Fundamentals. The packing must be constructed so as to satisfy SN 10 250 Part 1 - Fundamentals for Packaging Engineering (Planning and Objectives). The functions of packing are described in SN 10 250, Part 2 - Functions. The departments in the Semiconductor Group which deal with packing are responsible for these functions. New forms of packing must always be the subject of a request. The required application is described in Org-Handbook Guideline B 5.6,Guideline of Packing Materials - Part land 2. HL Packing Coordination issues lists of each of the permitted packing materials. In the case of new packing materials, for multi-use packing, and the recycling of packaging and packing aids, the UAS section should also be involved. In this context, refer to DIN 6120. When planning and developing packing, reference should be made to SN 10 250, Fundamentals for Packaging Engineering Attachment 1, "List of questions for use in selecting the packing". Before new forms of packing, packaging and packing aids are authorized, these questions should be considered (permitted packing materials, multi-use, disposal, transport simulation, costs). Items of packing which have already been authorized should be checked regularly to ensure that they meet the requirements of their conditions of use (continual improvement process). Packaging and packing aids should be reused. The decisive factors are the financial aspects of return transport and the environmental protection regulations. Examples of reusable packaging are wafer boxes, wafer canisters, transport containers with padded inserts, tubes and trays.
Appears in 2 contracts
Sources: Manufacturing Agreement (Advance Power Technology Inc), Manufacturing Agreement (Advanced Power Technology Inc)