I PURPOSE. The Parties hereto have enjoyed a well-established and synergistic business relationship whereby Amkor and CIL and their respective Affiliates have established numerous relationships with semiconductor companies to provide integrated circuit packaging and test services. A substantial portion of these services has been performed by AICL, who, in turn, has relied on Amkor and CIL for their worldwide marketing and sales capabilities. The purpose of this Agreement is to establish a long-term arrangement between the Parties to provide Packaging Services to the semiconductor industry. The Parties believe that such a long-term relationship, under the terms and conditions of this Agreement, is necessary to assure their respective long-term profitability and growth and is in their respective best interests.
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Sources: Packaging & Test Services Agreement (Amkor Technology Inc), Packaging & Test Services Agreement (Amkor Technology Inc)