Common use of Process Control Clause in Contracts

Process Control. 5.4.19.1 The Contract manufacturer will implement production process control measurements with SMT Reflow profile and Solder Wave profile measurements before start production, AOI 100% for SMT, X-Ray of Lead Less components and BGA according to sample 0.2%, Conformal Coating thickness sample 3 times during production batch, PCBA ion contamination after cleaning process 1 time per production batch, Product sealing sample 1%, monitor the process materials and react with correction action in case any of the results are out of control limits.