MIL/AERO WAFER AND SERVICES AGREEMENT
CONFIDENTIAL PORTIONS OF THIS DOCUMENT HAVE BEEN DELETED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO A REQUEST FOR
CONFIDENTIAL TREATMENT
THIS MIL/AERO WAFER AND SERVICES AGREEMENT ("Agreement") is dated and made
effective this 11th day of March, 1997 (the "Effective Date") by and between
NATIONAL SEMICONDUCTOR CORPORATION, a Delaware corporation, having its principal
place of business at ▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇, ▇▇▇▇▇ ▇▇▇▇▇, ▇▇▇▇▇▇▇▇▇▇
▇▇▇▇▇-▇▇▇▇ ("National") and [▇▇▇▇▇▇▇▇▇ SEMICONDUCTOR CORPORATION], a Delaware
corporation, having its principal place of business at ▇▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇, ▇▇▇▇▇
▇▇▇▇▇▇▇▇, ▇▇▇▇▇ ▇▇▇▇▇ ("Fairchild"). National and/or Fairchild may be referred
to herein as a "Party" or the "Parties" as the case may require.
W I T N E S S E T H:
WHEREAS, the Parties have entered into a certain Asset Purchase Agreement
(hereinafter referred to as the "Purchase Agreement") under which Fairchild is
acquiring certain of the assets of National's Logic, Memory and Discrete Power
and Signal Technologies Business Units as historically conducted and accounted
for (including Flash Memory, but excluding Public Networks, Programmable
Products and Mil/Aero Logic Products) (the "Business"); and
WHEREAS, pursuant to the transactions contemplated in the Purchase
Agreement, Fairchild is acquiring National's manufacturing facilities in South
Portland, Maine (excluding the eight-inch fab and related facilities); West
Jordan, Utah; Penang, Malaysia; and Cebu, the Philippines; and
WHEREAS, after the closing of the transactions contemplated by the
Purchase Agreement Fairchild will own and operate the Facilities; and
WHEREAS, National, using proprietary processes, has been manufacturing
silicon wafers containing certain integrated circuits intended for use in
Mil/Aero products at the Facilities and performing associated services; and
WHEREAS, National is conveying to Fairchild certain intellectual property
rights pursuant to the Technology Licensing and Transfer Agreement between
National and Fairchild, of even date herewith; and
WHEREAS, National and Fairchild desire to enter into an agreement under
which Fairchild will continue to provide certain manufacturing services and
▇▇▇▇▇▇▇▇▇ Products to National following the closing of the transactions
contemplated by the Purchase Agreement; and
WHEREAS, National and Fairchild recognize that the prices National shall
pay to Fairchild for Products manufactured pursuant to this Agreement are
determined based on the collateral transactions and ongoing relationship between
the Parties as expressed in the Purchase Agreement, Revenue Side Letter of even
date herewith (the "Revenue Side Letter") and other Operating Agreements (as
defined in Paragraph 9.1); and
WHEREAS, the execution and delivery of this Agreement is a condition
precedent to the closing of the transactions contemplated by the Purchase
Agreement.
NOW, THEREFORE, in furtherance of the foregoing premises and in
consideration of the mutual covenants and obligations hereinafter set forth, the
Parties hereto, intending to be legally bound hereby, do agree as follows:
1.0 DEFINITIONS
1.1 "Acceptance Criteria" shall mean the electrical parameter
testing, process control monitor ("PCM") and other inspections
for each Product and/or Process as set forth in Exhibit F hereto,
all of which are to be performed by Fairchild prior to shipment
of Wafers hereunder.
1.2 "Best Efforts" shall require that the obligated Party make a
diligent, reasonable and good faith effort to accomplish the
applicable objective. Such obligation, however, does not require
any material expenditure of funds or the incurrence of any
material liability on the part of the obligated Party, which
expenditure or liability is unreasonable in light of the related
objective, nor does it require that the obligated Party act in a
manner which would otherwise be contrary to prudent business
judgment or normal commercial practices in order to accomplish
the objective. The fact that the objective is not actually
accomplished is no indication that the obligated Party did not in
fact utilize its Best Efforts in attempting to accomplish the
objective.
1.3 "Confidential Information" shall have the meaning set forth in
Paragraph 19.1 below.
1.4 "Effective Date" shall mean the date first set forth above.
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1.5 "Equivalent Wafers" for Wafers manufactured at the South
Portland, Maine six-inch fab shall mean the actual number of
Wafers in a given Process multiplied by the process complexity
factor for that Process, as set forth in Exhibit A hereto; and
for Wafers manufactured in a four or five-inch fab, Equivalent
Wafers shall mean the number of six inch equivalent Wafers.
1.6 "Facilities" shall mean the existing wafer fabrication facilities
located at South Portland, Maine (excluding the eight inch
fabrication facility of which National is retaining ownership)
and West Jordan, Utah transferred to Fairchild from National
pursuant to the Purchase Agreement.
1.7 "Fairchild" shall mean ▇▇▇▇▇▇▇▇▇ Semiconductor Corporation and
its Subsidiaries.
1.8 "Fairchild Assured Capacity" shall mean the capacity that
Fairchild agrees to supply National pursuant to Section 7 below.
1.9 "Masks" shall mean the masks and reticle sets, including the mask
holders and ASM pods, for the Products and Wafers used to
manufacture Products hereunder.
1.10 "Mil/Aero Business" shall mean the development, manufacture,
marketing and sale of integrated circuits that: (i) conform to
government drawings and qualifications, including but not limited
to JAN, SMD, QML, RHA, 883; or (ii) standard products in military
temperature grade (-55(Degree)C to 125(Degree)C) designated as
5400 series or ceramic packaged DM series.
1.11 "National" shall mean National Semiconductor Corporation and
its Subsidiaries.
1.12 "Processes" shall mean those wafer manufacturing processes and
associated unit processes to be used in the fabrication of Wafers
hereunder which are set forth in Exhibit A hereto, as such
processes shall be modified from time to time as agreed in
writing by the Parties.
1.13 "Products" shall mean National's Mil/Aero integrated circuit
products which will be manufactured by
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Fairchild in wafer form for National hereunder and which are
identified by National's part numbers listed in Exhibit B hereto,
which exhibit may be amended from time to time as the parties may
agree.
1.14 "Quality and Reliability Criteria" shall mean National's
manufacturing process quality and reliability specifications, as
set forth in the revision of National Specification CP0008 which
is in effect as of the Effective Date, and which are to be
followed by Fairchild in manufacturing Wafers hereunder.
1.15 "Specifications" shall mean the technical specifications (such as
Mask ID, Process Flow and Sort Test) as listed in Exhibit B for
each of the Products as provided in this Agreement.
1.16 "Subsidiary" shall mean any corporation, partnership, joint
venture or similar entity more than fifty percent (50%) owned or
controlled by a Party hereto, provided that any such entity shall
no longer be deemed a Subsidiary after such ownership or control
ceases to exist.
1.17 "Technology Licensing and Transfer Agreement" shall mean the
agreement of even date herewith between the Parties, under which
National is licensing and transferring certain intellectual
property rights to Fairchild.
1.18 "Wafers" shall mean four-inch (4"), five-inch (5") and/or
six-inch (6") silicon wafers for any of the Products to be
manufactured by Fairchild hereunder.
1.19 "Wafer Module" shall mean the ▇▇▇▇▇▇▇▇▇ four-inch (4"), five-inch
(5"), and six-inch (6") wafer fabrication units in South
Portland, Maine and the six-inch (6") wafer fabrication unit in
West Jordan, Utah.
2.0 INTELLECTUAL PROPERTY; EXCLUSIVITY
2.1 Except as may be set forth in Section 10 hereof, the provisions
of the Technology Licensing and Transfer Agreement will govern
all issues related to the respective intellectual property rights
of the Parties hereunder, to include but not be limited to, use
rights, ownership rights and indemnification
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obligations.
2.2 All manufacturing of Wafers shall take place at the Facilities.
Fairchild shall not manufacture Wafers or transfer any National
owned intellectual property or other National technical
information outside of the Facility or to any other site, other
than as may be permitted under the Technology Licensing and
Transfer Agreement.
2.3 For seven (7) years from the Effective Date or for the term of
this Agreement including any subsequent ramp-down period provided
under Paragraph 17.1 and Last-Time-Buy periods provided under
Paragraph 6.1, whichever is longer, Fairchild will not enter the
Mil/Aero Business.
2.4 National will have exclusive rights to value-added die and wafer
sales, as listed in Exhibit B hereto, for one (1) year from the
Effective Date with the exception of (i) wafer sales made to
Fairchild alternate sourcing partners; and (ii) any other die and
wafer sales assigned to Fairchild as of the Effective Date.
2.5 Fairchild will supply National with Wafers for use in Mil/Aero
integrated circuits and Mil/Aero value-added die and wafer sales,
and associated services hereunder, on an exclusive basis for the
term of this Agreement, including any subsequent ramp-down period
provided under Paragraph 17.1 and Last-Time-Buy periods provided
under Paragraph 6.1. Fairchild will not knowingly supply Wafers
for use in Mil/Aero integrated circuits or value-added die or
wafer sales (except as part of a Fairchild alternate sourcing
agreement) to any other external customer for five (5) years from
the Effective Date or for the term of this Agreement including
any subsequent ramp-down period provided under Paragraph 17.1 and
Last-Time-Buy periods provided under Paragraph 6.1, whichever is
longer.
2.6 For the term of this Agreement, including any subsequent
ramp-down period provided in Paragraph 17.1 and Last-Time-Buy
periods provided under Paragraph 6.1, whichever is longer,
National shall not knowingly supply Fairchild die or Fairchild
Wafers to any customer that competes with Fairchild by packaging
die or Wafers for resale to the merchant market or to individual
customers as direct replacements for
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Fairchild standard products.
3.0 PROCESSES
3.1 Exhibit A lists the Processes which Fairchild shall use in
manufacturing Wafers hereunder for National. Exhibit A may be
amended from time to time by mutual agreement in writing of the
Parties, as new processes are developed and older Processes
become obsolete.
3.2 After qualification is successfully completed for any Product to
be manufactured under this Agreement, if Fairchild desires to
make material Process changes affecting form, fit or function,
Fairchild will notify National of the intended change in
accordance with ▇▇▇▇▇▇▇▇▇'▇ process change procedures then in
effect. If the proposed changes are unacceptable to National,
National and Fairchild shall work together in efforts to resolve
the problem and qualify the changed Process for making Wafers. If
the Parties are unable to resolve the problem, Fairchild shall
have the right to make such Process changes upon the provision of
twelve (12) fiscal periods prior written notice to National.
Subsequent to ▇▇▇▇▇▇▇▇▇'▇ notice of Process change, Fairchild
will make provisions with National for Last Time Buys, and commit
to ship all Wafers requested in such last Time Buys as the
Parties may negotiate.
3.3 Should Fairchild elect to discontinue a Process, it must give
National written notice of no less than twelve (12) fiscal
periods prior to the date it intends to discontinue any Process
or its future amended form. Subsequent to ▇▇▇▇▇▇▇▇▇'▇ notice of
Process discontinuance, Fairchild will make provisions with
National for Last Time Buys, and commit to ship all Wafers
requested in such Last Time Buys as the Parties may negotiate.
4.0 SET UP AND QUALIFICATION OF NEW PRODUCTS
4.1 With ▇▇▇▇▇▇▇▇▇'▇ written approval, which approval shall not be
unreasonably withheld, National will be allowed to develop, at
its own expense, Mil/Aero versions of ▇▇▇▇▇▇▇▇▇ products,
including derivatives of and improvements to existing products.
4.2 For each new Product that National proposes to have
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Fairchild manufacture, National will provide to Fairchild in
advance the Specifications and design layout of the Product for
review and comment by Fairchild. The Parties will also agree on
the Acceptance Criteria, including electrical test parameters,
and Quality and Reliability Criteria for the prototype Wafers to
be manufactured for the new Product during the qualification
process.
4.3 An initial data base for Mask generation or pattern generation,
or acceptable production Masks will be provided by National to
Fairchild, per Fairchild specifications, at National's expense,
for each new Product to be fabricated for National, if required.
In the alternative, National may provide Fairchild with prime die
design data and Fairchild will provide the frame and fracture
services and procure the Mask set at National's expense. After
receipt of the initial data base, or pattern generation tape, or
master or sub-master Mask set, additional and/or replacement Mask
sets shall be the responsibility and expense of Fairchild. All
such data bases, pattern generation tapes and Mask sets shall be
the property of National, regardless of whether they were
initially supplied by National or replaced by Fairchild, for Mask
works developed by National.
4.4 As soon as practical following agreement on the items in
Paragraph 4.2 above, and following receipt of a written purchase
order from National, Fairchild will begin manufacture of twelve
(12) prototype Wafers for such Product as is specified in the
purchase order. Fairchild will perform the electrical testing
specified in the initial Acceptance Criteria and supply the test
data to National with the prototype Wafers. ▇▇▇▇▇▇▇▇▇'▇
obligation shall be limited to providing Wafers that meet the
applicable PCM specifications and the associated test data.
National will promptly inspect the prototype Wafers and notify
Fairchild in writing of the results. If the prototype Wafers do
not meet the Acceptance Criteria and Quality and Reliability
Criteria, the Parties will cooperate in good faith to determine
the reason for such failure.
4.5 In connection with the completion of the qualification process
for any new Product, National will deliver to Fairchild final
Specifications for the Product incorporating any changes agreed
in writing by the Parties during the qualification process. The
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Parties will also negotiate for each Product the final Acceptance
Criteria and Quality and Reliability Criteria to be used for the
commercial production lots of Wafers.
4.6 Unless otherwise agreed in writing production quantities of
Wafers of a new Product will not be manufactured prior to
completion of the qualification process under this Section 4. In
the event that National desires for Fairchild to manufacture
production quantities, the Parties will agree in writing on the
terms before Fairchild accepts the purchase order.
5.0 MODIFICATION OF EXISTING PRODUCTS
5.1 If either National or Fairchild desires to make any changes to
the Masks, final Specifications, Acceptance Criteria or Quality
and Reliability Criteria for an existing Product (including
changes to a ▇▇▇▇▇▇▇▇▇ product that is the basis for a National
Product), that Party shall notify the other Party in writing and
negotiate the changes in good faith, including any changes in
prices required by such modifications. A modification to any of
the foregoing will be binding only when a writing to which such
modification is attached has been signed by both Parties as
provided in this Agreement. The Parties will separately negotiate
the price and terms of any prototype Wafers required in
connection with such change. If any changes proposed by Fairchild
are not acceptable to National, Fairchild will continue to
manufacture the unchanged product for twelve (12) fiscal periods.
During that time Fairchild will make provisions with National for
Last Time Buys, and commit to ship all Wafers requested in such
Last Time Buys as the Parties may negotiate.
6.0 PRODUCT OBSOLESCENCE
6.1 Fairchild may at its discretion declare a ▇▇▇▇▇▇▇▇▇ product
obsolete. If the product forms the basis for a National Product
then Fairchild may declare the device obsolete if it has not been
run in production for eighteen (18) fiscal periods. Fairchild
shall provide National with twelve (12) months prior written
notice, make provisions with National for a Last Time Buy and
commit to ship all Wafers requested
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in such Last Time Buys as the Parties may negotiate. If a product
has not been run in production for six (6) fiscal periods by
either Fairchild or National then Fairchild will notify National
in writing and the following surcharge will apply to the price of
any such product:
four (4) inch wafers, 25% of the latest negotiated price
five (5) inch wafers, 25% of the latest negotiated price
six (6) inch wafers, 10% of the latest negotiated price
After the Last Time Buy has expired, Fairchild may sell the Mask
set and associated tooling to an established after-market
supplier such as Rochester Electronics. Should Fairchild elect
not to sell the Mask set and tooling to a third party then
National will have the option of purchasing the Mask set etc., in
which case National will retain only the military rights to the
product.
7.0 CAPACITY; VOLUME COMMITMENTS; PRODUCTION PLANNING
7.1 Production under this Agreement will use the procedures, terms,
and conditions described in Section 5 of the Fairchild Foundry
Services Agreement between the Parties of even date herewith.
7.2 All production under this Agreement will be included as part of
the total National Capacity Request and Fairchild Assured
Capacity as defined in Section 5 of said Fairchild Foundry
Services Agreement.
8.0 PURCHASE ORDERS
8.1 All purchases and sales between Fairchild and National shall be
initiated by National's issuance of written purchase orders sent
by either first class mail or facsimile. By written agreement of
the Parties, purchase orders may also be sent and acknowledged by
electronic data exchange or other mutually satisfactory system.
Such "blanket" purchase orders shall be issued once per fiscal
quarter for Wafers to be delivered three (3) fiscal periods
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in the future. They shall state the Wafer quantities (specifying
whether equivalents or actual) by Wafer Module, and shipping and
invoicing instructions. Fairchild shall accept purchase orders
through a written or electronic acknowledgment. Within a
reasonable time after receipt of National's detailed device level
Wafer starts request for the next fiscal period, Fairchild shall
provide National with a Product delivery schedule either on a
weekly basis as the Wafers are started or for the Wafer starts
for the entire fiscal period, as the Parties may agree in
writing. The purchase orders may utilize the first three (3)
fiscal periods forecast in the eight period rolling forecast
supplied pursuant to Section 7, as the embodiment of the purchase
order for specifying the Wafer quantity by Wafer Module and
Process, and whether sorted or unsorted.
8.2 In the event of any conflict between the terms and conditions of
this Agreement and either Party's purchase order, acknowledgment,
or similar forms, priority shall be determined as follows:
(a) typewritten or handwritten terms on the face of a written
purchase order, acknowledgment or similar document or in
the main body of an electronic equivalent which have been
specifically accepted in writing by the other Party's
Program Manager;
(b) the terms of this Agreement;
(c) preprinted terms incorporated in the purchase order,
acknowledgment or similar document.
8.3 Consistent with standard practices of issuing specific device
level details of part numbers to be fabricated on a weekly or
periodic basis, National may unilaterally change the part number
to be manufactured, provided that Fairchild agrees that the
change does not negatively impact ▇▇▇▇▇▇▇▇▇'▇ loadings and
provided further that there is no change in the Process flow to
be used. A change that will negatively impact loading or alter
the Process flow may only be directed upon ▇▇▇▇▇▇▇▇▇'▇ written
agreement, which shall utilize its Best Efforts to comply with
such requested change. The specific part number detail shall be
submitted by first class mail or facsimile. By written agreement
of the Parties specific part number detail may also be sent by
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electronic data exchange, or other mutually satisfactory system.
8.4 National shall request delivery dates which are consistent with
▇▇▇▇▇▇▇▇▇'▇ reasonable lead times for each Product as indicated
at the time National's purchase order is placed. Notwithstanding
the foregoing, Fairchild shall utilize its Best Efforts to
accommodate requests by National for quick turnarounds or "hot
lots", which includes prototype lots. Hot lot cycle times and the
premiums to be paid therefor are listed in Exhibit K. Level S hot
lots will be negotiated on a case-by-case basis.
8.5 Fairchild may manufacture lots of any size which satisfy the
requirements of effective manufacturing. However, National must
place orders for full flow and prototype Products in increments
of [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH
THE SECURITIES AND EXCHANGE COMMISSION] Wafers for lots that are
run exclusively for National with National Masks, or, when
possible, as agreed by Fairchild, in [CONFIDENTIAL INFORMATION
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION] increments if scheduled as a portion of a ▇▇▇▇▇▇▇▇▇
product lot started for ▇▇▇▇▇▇▇▇▇'▇ use. For personalized ASIC
Wafers drawn from mid-flow inventories, the smallest quantity
that shall be ordered by National is [CONFIDENTIAL INFORMATION
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION], except for Wafers manufactured in the five-inch (5")
fab, in which case the smallest quantity that can be ordered is
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION].
9.0 PRICES AND PAYMENT
9.1 The Parties hereby acknowledge that, as part of the collateral
transactions contemplated under the Purchase Agreement and
ongoing relationship between the Parties, they have entered into
the Revenue Side Letter under which National has agreed to
provide a minimum revenue of [CONFIDENTIAL INFORMATION OMITTED
AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION]
after the Effective Date. National shall discharge its
obligations under the Revenue Side Letter by purchasing goods and
services under this Agreement, a corresponding Fairchild Assembly
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Services Agreement, and a corresponding Fairchild Foundry
Services Agreement of even date herewith (collectively the
"Operating Agreements"). Set forth herein at Exhibit N is the
forecast volume of Wafers, by Wafer Module and Process, that
National will purchase from Fairchild during the aforementioned
thirty-nine fiscal periods under this agreement (the "Forecast
Volumes"). The Forecast Volumes are for pricing purposes under
this Section 9 only and may vary in magnitude and mix in
practice, whereupon the prices applicable to the revised
magnitude and mix may also vary.
9.2 Set forth in Exhibit G hereto are the prices which National shall
pay to Fairchild for Level "S" Wafers manufactured hereunder
during the term of this Agreement.
9.3 The prices and pricing methodology to be followed for non-Level
"S" Wafers and for miscellaneous support services will be as set
forth in the aforementioned Fairchild Foundry Services Agreement.
9.4 Prices are quoted and shall be paid in U.S. Dollars. Such
prices are on an FOB ship point basis. Payment terms are net
thirty (30) from date of invoice. Miscellaneous services may
be invoiced separately.
9.5 National shall pay, in addition to the prices quoted or invoiced,
the amount of any freight, insurance, special handling and
duties. National shall also pay all sales, use, excise or other
similar tax applicable to the sale of goods covered by this
Agreement, or National shall supply Fairchild with an appropriate
tax exemption certificate.
10.0 OTHER MANUFACTURING SERVICES
10.1 Fairchild shall continue to provide such services to National at
the same level of support that was in effect as of the Effective
Date. This specifically includes S-level processing including SEM
step coverage, as outlined in SP34061 and Wafer Lot Acceptance as
outlined in SP3402.
10.2 At National's request, Fairchild will perform Wafer sort and test
services based on sort and test programs prepared, owned and
otherwise proprietary to National. Towards that end, National
shall supply
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Fairchild with National-owned specific probe cards, load boards
and test software in order that Fairchild may provide such
services. Wafer sort shall be priced by hours of active sorting,
with specific prices as set forth in Exhibit G, and specific sort
times as set forth in Exhibit B.
10.3 Fairchild will supply Mil/Aero Wafers in compliance to commercial
critical electrical test parametrics (PCM data) according to
Product Specifications. Existing sort minimum yield assurance
specifications as defined in Section 13 will be guaranteed to
National. In the event that National changes any test program
forcing function or limit specification of a Mil/Aero sort
program existing on the Effective date, Fairchild will only
guarantee Wafer acceptance to the PCM data.
10.4 National will continue to have rights to the MCT Program Writer
(PW) software. National will be provided copies of all associated
VAX libraries as well as all support programs (MRL) relating to
MCT and PCMCT testers. Fairchild will provide whatever assistance
is necessary in loading and bringing the source code on-line on
National's systems. This project will be completed by May 31,
1997, after which date National will no longer have access to the
▇▇▇▇▇▇▇▇▇ ▇▇ VAX system. Services provided by ▇▇▇▇▇▇▇▇▇ after May
31, 1997 will be billed at $100 per hour.
10.5 National will continue to have rights to the WGT hardware design,
software, and associated documentation. National will assemble a
WGT tester and ▇▇▇▇▇▇▇▇▇ will provide whatever assistance is
necessary to bring the system on-line. National will use Best
Efforts to have this project completed by May 31, 1997. If, due
to circumstances beyond National's control, the system cannot be
assembled and brought on-line prior to May 31, 1997, ▇▇▇▇▇▇▇▇▇
will provide support free of charge for a reasonable period of
time. Otherwise support required beyond May 31, 1997 will be
charged at $100 per hour.
10.6 National shall have non-exclusive rights to the VHDL model of the
modified PSC110 as supplied to ▇▇▇▇▇▇ Corporation. National shall
continue to own the Quicksim and Quickpath licenses.
10.7 National will be supplied with an SGML database for
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the existing Mil/Aero data sheets for ▇▇▇▇▇▇▇▇▇ products only.
10.8 National will transfer the electrical test equipment known as the
IMCS 4600 Latch-up Tester to ▇▇▇▇▇▇▇▇▇. In consideration thereof,
▇▇▇▇▇▇▇▇▇ will support the Latch-up data test requirements of
National for the term of this Agreement, and any extension or
ramp-down period, for a fee of $100.00 per hour.
10.9 In support of the Processes, ▇▇▇▇▇▇▇▇▇ will make available design
support information including the following items:
(a) Layout design rules.
(b) Industry standard models for active devices (BSIM3v3 for
CMOS devices and ▇▇▇▇▇▇-▇▇▇▇ with parasitics for bipolar
devices) representing nominal conditions and performance
corners.
(c) Industry standard models, as stated in the National NTPRS
document in effect as of the Effective Date, for parasitic
elements, such as interconnect resistances and
capacitances, sheet resistivities of all conducting layers,
parasitic capacitances for diffused areas, and so forth,
including additional elements or devices intended for
mixed-signal applications.
(d) Process cross sections, if not already available at
National.
(e) Sufficient sizing and PCM information to assure the
integrity of masks ordered in support of products to be
manufactured.
(f) Yield models plus applicable current and forecast
parameters such as Ys and Do for those models.
This information should be in the form of at least one controlled
paper copy or electronic access to a controlled copy. National,
at its discretion, may request a controlled electronic copy of
the required information in lieu of the paper copy. ▇▇▇▇▇▇▇▇▇
will provide the foregoing services at no charge to National,
limited to those engineering services performed as of the
Effective Date.
11.0 DELIVERY; RESCHEDULING AND CANCELLATION
11.1 ▇▇▇▇▇▇▇▇▇ shall make reasonable and diligent efforts to deliver
Wafers on the delivery dates specified in
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the Product delivery schedule provided by ▇▇▇▇▇▇▇▇▇ pursuant to
Paragraph 8.1. Any shipment made within fifteen (15) days before
or after the shipment date(s) specified in said Product delivery
schedule shall constitute timely shipment. Partial shipments will
be allowed and may be invoiced separately. A delivery will be
considered conforming if it contains a quantity equal to plus
five percent (5%) or minus twenty percent (20%) of the quantity
ordered.
11.2 Except in the case of Level "S" wafers, which are
non-cancellable, if ▇▇▇▇▇▇▇▇▇ has not made shipment of Products
within fifteen (15) days after the shipment date specified in the
Product delivery schedule provided by ▇▇▇▇▇▇▇▇▇ pursuant to
Paragraph 8.1, National shall have the right, subject to
Paragraph 20.2, to cancel that portion of its purchase order
pertaining to such Products, but only in the event that
National's customer for those Products has cancelled its order
with National for such Products. Notwithstanding the foregoing,
if ▇▇▇▇▇▇▇▇▇ has not made shipment of Products within thirty (30)
days after the shipment date specified in the Product delivery
schedule, National shall have the right, subject to Paragraph
20.2, in its sole discretion, to cancel that portion of its
purchase order pertaining to such Products, regardless of whether
National's customer has cancelled its order with National or not.
In either event, any obligation of National under its Capacity
Request and/or any commitment to ▇▇▇▇▇▇▇▇▇ under the Revenue Side
Letter associated with such cancelled purchase order shall be
discharged in full and National shall have no liability
whatsoever to ▇▇▇▇▇▇▇▇▇ therefore.
11.3 All Wafers delivered pursuant to the terms of this Agreement
shall be suitably packed for shipment in ▇▇▇▇▇▇▇▇▇'▇ standard
containers, marked for shipment to National's address set forth
in the applicable purchase order and delivered to a carrier or
forwarding agent chosen by National. Should National fail to
designate a carrier, forwarding agent or type of conveyance,
▇▇▇▇▇▇▇▇▇ shall make such designation in conformance with its
standard shipping practices. Shipment will be F.O.B. shipping
point, at which time risk of loss and title shall pass to
National. Shipments will be subject to incoming inspection as set
forth in Paragraph 12.2 below.
11.4 To facilitate the inspection of Product deliveries to
-15-
National, lot integrity shall be maintained on all such
deliveries, unless specifically waived by mutual agreement of the
Parties.
11.5 Subject to the provisions of Section 8 hereof, National may
cancel any purchase order upon at least one (1) week's notice
prior to the commencement of manufacturing without charge,
provided that National reimburses ▇▇▇▇▇▇▇▇▇ for the cost of any
unique raw materials purchased for such order.
11.6 National may request that ▇▇▇▇▇▇▇▇▇ stop production of Wafers in
process for National's convenience and ▇▇▇▇▇▇▇▇▇ shall consider
stopping depending on the point of process. In such event,
National shall pay for all Wafers at the agreed price, subject to
a negotiated adjustment based upon the degree of completion of
the Wafers and whether or not ▇▇▇▇▇▇▇▇▇ is able to utilize the
unfilled capacity. ▇▇▇▇▇▇▇▇▇ will, if reasonably practicable,
restart production of stopped Wafers one time within a reasonable
time after receipt of a written request from National, subject to
National's payment of any additional expenses incurred. Sections
12, 13, and 14 of this Agreement shall not apply to Wafers
stopped under this Paragraph 11.6 for more than thirty (30) days,
nor shall ▇▇▇▇▇▇▇▇▇ make any commitments of yield with respect to
such Wafers.
11.7 In the event that National elects to maintain an inventory of
partially finished Wafers, ownership of the partially finished
Wafers will pass to National when they reach the holding point
defined by the relevant Process flow. ▇▇▇▇▇▇▇▇▇ will invoice
National for such Wafers, but they will be stored under
clean-room conditions and remain in the Wafer processing WIP
management system. ▇▇▇▇▇▇▇▇▇ will inform National of the number
and types of these Wafers remaining in inventory at the end of
each fiscal period. Further, the electronic records and physical
inventory shall be available for inspection by National at any
time. ▇▇▇▇▇▇▇▇▇ shall credit National with the amount previously
invoiced for any such Wafers at such time as they are restarted
in the Process flow.
11.8 As of 12:01 A.M. on the Effective Date, National will own all
Wafers located at the Facility which ▇▇▇▇▇▇▇▇▇ has commenced
processing but which have not yet been completed in accordance
with the pertinent
-16-
Process flow. Unless expressly directed in writing by National
otherwise, ▇▇▇▇▇▇▇▇▇ shall continue to process each Wafer to a
normal state of completion in the applicable Wafer Module.
National shall pay ▇▇▇▇▇▇▇▇▇ for the accumulated additional
processing costs, plus a twenty-five percent (25%) ▇▇▇▇ up, for
the additional processing taking place on and after the Effective
Date. The provisions of Sections 12, 13, and 14 hereof shall
specifically apply to all such Wafers.
12.0 QUALITY CONTROL AND INSPECTION; AND RELIABILITY
12.1 ▇▇▇▇▇▇▇▇▇ will manufacture Wafers in accordance with the Quality
and Reliability Criteria for the applicable Product. Prior to
shipment, ▇▇▇▇▇▇▇▇▇ will perform the electrical parameter testing
and other inspections specified to be performed by it in the
applicable Acceptance Criteria on each Wafer lot manufactured.
▇▇▇▇▇▇▇▇▇ will only ship those Wafer lots that successfully pass
the applicable Acceptance Criteria. ▇▇▇▇▇▇▇▇▇ will electronically
provide National with the electrical test data specified in the
applicable Acceptance Criteria. Wafers will be laser scribed with
lot and wafer number for statistical monitoring and lot number
traceability.
12.2 National shall promptly provide for inspection and testing of
each shipment of Wafers upon receipt in accordance with the
Acceptance Criteria and shall notify ▇▇▇▇▇▇▇▇▇ in writing of
acceptance of the Wafers. If National has not given written
notice to ▇▇▇▇▇▇▇▇▇ of rejection of all or part of a shipment
within thirty (30) days of receipt, National will be deemed to
have accepted such Wafers. In the event any lot or Wafer is found
to fail the Acceptance Criteria prior to final acceptance,
National shall promptly return it to ▇▇▇▇▇▇▇▇▇, together with all
test data and other information reasonably required by ▇▇▇▇▇▇▇▇▇.
Upon confirmation by ▇▇▇▇▇▇▇▇▇ that such Wafers fail the
Acceptance Criteria, ▇▇▇▇▇▇▇▇▇ shall replace such lot or Wafer on
a timely basis.
12.3 National shall promptly provide for yield probe tests to be
conducted on the Wafers and communicate the results of the tests
to ▇▇▇▇▇▇▇▇▇ within thirty (30) days of receipt of Wafers from
▇▇▇▇▇▇▇▇▇. The right to return any Wafers for low yield shall be
governed by Section 11 below.
-17-
12.4 MPS-3-000 (Material Procurement Specification) - General
Provisions and Quality Requirements for External (Non-National)
Wafer Fab Facilities and MPS-3-001 (Material Procurement
Specification) - Technical Requirements for CMOS Processing are
the National policies for the purchase of integrated circuits
from independent suppliers. These policies as in effect at the
Effective Date shall provide criteria for the initial and
continuing qualification of the Facility and evaluation of Wafers
manufactured by ▇▇▇▇▇▇▇▇▇ hereunder. To the extent that those
policies are not inconsistent with the provisions of this
Agreement, National shall not be required to accept delivery of
any Wafers hereunder if ▇▇▇▇▇▇▇▇▇ fails to comply with said
policies or such other similar policies as may be mutually agreed
to by the Parties.
12.5 ▇▇▇▇▇▇▇▇▇ hereby warrants that the Facility currently is, and
will remain throughout the term of this Agreement, ISO9000
certified.
13.0 MINIMUM YIELD ASSURANCES
13.1 ▇▇▇▇▇▇▇▇▇ will guarantee a minimum yield assurance ("MYA") on a
per Product basis for those Wafers fabricated and probed by
▇▇▇▇▇▇▇▇▇. MYAs shall function as a reliability screen hereunder
for maverick Wafers, via standard sort test results and yield.
For Wafers not sorted by ▇▇▇▇▇▇▇▇▇, the MYA limits will apply
only to Wafers whose substandard yield is caused by materials or
▇▇▇▇▇▇▇▇▇ workmanship.
13.2 For a new Product, the baseline yield and MYA will be established
after a minimum of twenty (20) Wafer lot runs have been tested to
production released test programs. A new baseline yield and MYA
will be calculated whenever National makes any modifications to
said test programs.
13.3 Each fiscal quarter, each Product's baseline yield will be
calculated using the previous fiscal quarter's results, or the
previous twenty (20) Wafer lot runs if less than twenty (20)
Wafer lot runs were processed in said previous quarter. The mean
and standard deviation (sigma) yield for a Product will be
calculated using individual Wafer data. Zero
-18-
yielding Wafers will be excluded from such calculations. The
results of such calculations will be used in defining the MYA for
that Product for the quarter in which the calculations are made,
but only if the mean yield changes by more than +/-2%.
13.4 MYA will be determined as follows. Wafers which yield less than
sixty percent (60%) of the baseline yield for the commercial
version of the Product will be considered discrepant and may be
returned for full credit at National's discretion. In no event
shall ▇▇▇▇▇▇▇▇▇ accept returns of Wafers on non-released
products. For Level "S" Fact 2.0 Wafers the MYA will be fifty
percent (50%) of the baseline yield for the commercial version of
the Product. For Mil/Aero products that yield significantly less
than their respective commercial versions, the MYA will be
negotiated on a case by case basis.
13.5 National shall provide yield analysis information on Wafers
returned to ▇▇▇▇▇▇▇▇▇ under this Section 13, in order to assist
▇▇▇▇▇▇▇▇▇ in continuous Process improvement.
13.6 In the event of an extended period of substandard yields on a
Product, ▇▇▇▇▇▇▇▇▇ will utilize its Best Efforts to correct any
Process related causes and the Parties will negotiate in good
faith to make up for the yield loss experienced by National and
its customers.
14.0 WARRANTY
14.1 ▇▇▇▇▇▇▇▇▇ warrants that the Products delivered hereunder shall
meet the Quality and Reliability Criteria and shall be free from
defects in material and ▇▇▇▇▇▇▇▇▇'▇ workmanship under normal use
for a period of one (1) year from the date of delivery. If,
during the one year period:
(i) ▇▇▇▇▇▇▇▇▇ is notified in writing promptly upon discovery
with a detailed description of any such defect in any
Product (at which time ▇▇▇▇▇▇▇▇▇ shall issue a return
material authorization number to National), and;
(ii) National returns such Product to the applicable Facility
at National's expense for inspection; and
(iii) ▇▇▇▇▇▇▇▇▇'▇ examination of such Product reveals
-19-
that the Product is indeed defective and does not meet
the applicable Quality and Reliability Criteria or is
defective in materials or ▇▇▇▇▇▇▇▇▇'▇ workmanship and
such problems are not caused by accident, abuse, misuse,
neglect, improper storage, handling, packaging or
installation, repair, alteration or improper testing or
use by someone other than ▇▇▇▇▇▇▇▇▇
then, within a reasonable time, ▇▇▇▇▇▇▇▇▇, at its sole option,
shall either replace or credit National for such defective
Product. ▇▇▇▇▇▇▇▇▇ shall return any Products replaced under this
warranty to National transportation prepaid, and shall reimburse
National for the transportation charges paid by National in
returning such defective Products to ▇▇▇▇▇▇▇▇▇.
14.2 THE FOREGOING WARRANTY CONSTITUTES ▇▇▇▇▇▇▇▇▇'▇ EXCLUSIVE
LIABILITY, AND NATIONAL'S EXCLUSIVE REMEDY, FOR ANY BREACH OF
WARRANTY. EXCEPT AS SET FORTH HEREIN, ▇▇▇▇▇▇▇▇▇ MAKES AND
NATIONAL RECEIVES NO WARRANTIES OR CONDITIONS ON THE PRODUCTS,
EXPRESS, IMPLIED, STATUTORY OR OTHERWISE, AND ▇▇▇▇▇▇▇▇▇
SPECIFICALLY DISCLAIMS ANY WARRANTY OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE.
15.0 ON-SITE INSPECTION AND INFORMATION
15.1 ▇▇▇▇▇▇▇▇▇ shall allow National and/or National's customers to
visit and evaluate the Facility during normal business hours as
part of established source inspection programs, it being
understood and agreed between National and ▇▇▇▇▇▇▇▇▇ that
National must obtain the concurrence of ▇▇▇▇▇▇▇▇▇ for the
scheduling of all such visits, which such concurrence shall not
be unreasonably withheld. It is anticipated that such visits will
occur no more than once per quarter on average.
15.2 National shall have access to fab audits conducted by ▇▇▇▇▇▇▇▇▇
and fab baselines. ▇▇▇▇▇▇▇▇▇ may charge a fee commensurate with
the effort required to provide these baselines and audits.
15.3 Upon National's written request, ▇▇▇▇▇▇▇▇▇ will provide National
with process control information, to include but not be limited
to: process and electrical test yield results, current process
specifications and conformance to specifications;
-20-
calibration schedules and logs for equipment; environmental
monitor information for air, gases and DI water; documentation of
operator qualification and training; documentation of
traceability through ▇▇▇▇▇▇▇▇▇'▇ operation; and ▇▇▇▇▇▇▇▇▇
verification information. Except for exigent circumstances, such
requests shall not be made more than twice per year for a given
category of information.
16.0 PRODUCT ENGINEERING SUPPORT
16.1 The Parties will cooperate in allowing National employees to have
reasonable access to the Facility during the term of this
Agreement (the "National Engineering Team"), in order to assist
in Product developments and improvements. ▇▇▇▇▇▇▇▇▇ will provide
reasonable office space to the National Engineering Team, if
required on a temporary basis, not to exceed 60 days per
occurrence, at no expense to National. Should the National
Engineering Team require long term, dedicated office space,
National agrees to pay ▇▇▇▇▇▇▇▇▇ the overhead cost associated
with such space. The National Engineering Team will comply with
all applicable ▇▇▇▇▇▇▇▇▇ regulations in force at the Facility and
National hereby agrees to hold ▇▇▇▇▇▇▇▇▇ harmless for any damages
or liability caused by any member of the National Engineering
Team, which are attributable to: (i) the negligence or willful
malfeasance of such member, and (ii) any failure by such member
to comply with ▇▇▇▇▇▇▇▇▇'▇ regulations in force at the Facility
or with applicable law.
16.2 ▇▇▇▇▇▇▇▇▇ shall assist the efforts of the National Engineering
Team and provide National with reasonable and timely support.
16.3 ▇▇▇▇▇▇▇▇▇ shall assist National in any efforts to identify any
reliability problems that may arise in a Product. National shall
correct National Product related problems and ▇▇▇▇▇▇▇▇▇ shall
correct all ▇▇▇▇▇▇▇▇▇ product and Process related problems.
17.0 TERM AND TERMINATION
17.1 The term of this Agreement shall be thirty-nine (39) fiscal
periods from the Effective Date; provided, however, that the
Parties shall not less than eight
-21-
(8) fiscal periods prior to the end of such thirty-ninth (39th)
fiscal period determine in good faith a ramp-down schedule of
production so as to minimize disruption to both Parties. If the
Parties are unable to agree on the terms governing a ramp-down,
National shall be allowed to reduce its purchase commitment by
not more than twenty percent (20%) per fiscal quarter, starting
one fiscal quarter after the initial thirty-nine (39) fiscal
period term of this Agreement. National will provide ▇▇▇▇▇▇▇▇▇
with not less than ninety (90) days prior written notice of such
reduction.
17.2 This Agreement may be terminated, in whole or in part, by one
Party sending a written notice to the other Party of the
termination of this Agreement, which notice specifies the reason
for the termination, upon the happening of any one or more of the
following events:
(a) the other Party is the subject of a petition filed in a
bankruptcy court of competent jurisdiction, whether
voluntary or involuntary, which petition in the event of
an involuntary petition is not dismissed within sixty
(60) days; if a receiver or trustee is appointed for all
or a substantial portion of the assets of the other
Party; or if the other Party makes an assignment for the
benefit of its creditors; or
(b) the other Party fails to perform substantially any
material covenant or obligation, or breaches any
material representation or warranty provided for herein;
provided, however, that no right of termination shall
arise hereunder until sixty (60) days after receipt of
written notice by the Party who has failed to perform
from the other Party, specifying the failure of
performance, and said failure having not been remedied
or cured during said sixty (60) day period.
17.3 Upon termination of this Agreement, all rights granted hereunder
shall immediately terminate and each Party shall return to the
other Party any property belonging to the other Party which is in
its possession, except that ▇▇▇▇▇▇▇▇▇ may continue to retain and
use any rights or property belonging to National solely for the
period necessary for it to finish manufacturing the currently
forecasted ▇▇▇▇▇▇▇▇▇ Assured Capacity. Nothing in this Section 17
-22-
is intended to relieve either Party of any liability for any
payment or other obligations existing at the time of termination.
17.4 The provisions of Sections 2, 6, 14, 18, 19 and Paragraphs 21.5
and 21.8 shall survive the termination of this Agreement for any
reason.
18.0 EXPORT CONTROL
18.1 The Parties acknowledge that each must comply with all rules and
laws of the United States government relating to restrictions on
export. Each Party agrees to use its Best Efforts to obtain any
export licenses, letters of assurance or other documents
necessary with respect to this Agreement.
18.2 Each Party agrees to comply fully with United States export laws
and regulations, assuring the other Party that, unless prior
authorization is obtained from the competent United States
government agency, the receiving Party does not intend and shall
not knowingly export or re-export, directly or indirectly, any
Wafers, Products, technology or technical information received
hereunder, that would be in contravention of any laws and
regulations published by any United States government agency.
19.0 CONFIDENTIALITY
19.1 For purposes of this Agreement, "Confidential Information" shall
mean all proprietary information, including National and/or
▇▇▇▇▇▇▇▇▇ trade secrets relating to the subject matter of this
Agreement disclosed by one of the Parties to the other Party in
written and/or graphic form and originally designated in writing
by the disclosing Party as Confidential Information or by words
of similar import, or, if disclosed orally, summarized and
confirmed in writing by the disclosing Party within thirty (30)
days after said oral disclosure, that the orally disclosed
information is Confidential Information.
19.2 Except as may otherwise be provided in the Technology Licensing
and Transfer Agreement, each Party agrees that it will not use in
any way for its own account, or for the account of any third
party, nor disclose to any third party except pursuant to this
Agreement,
-23-
any Confidential Information revealed to it by the other Party.
Each Party shall take every reasonable precaution to protect the
confidentiality of said information. Each Party shall use the
same standard of care in protecting the Confidential Information
of the other Party as it normally uses in protecting its own
trade secrets and proprietary information.
19.3 Notwithstanding any other provision of this Agreement, no
information received by a Party hereunder shall be Confidential
Information if said information is or becomes:
(a) published or otherwise made available to the public
other than by a breach of this Agreement;
(b) furnished to a Party by a third party without
restriction on its dissemination;
(c) approved for release in writing by the Party designating
said information as Confidential Information;
(d) known to, or independently developed by, the Party
receiving Confidential Information hereunder without
reference to or use of said Confidential Information; or
(e) disclosed to a third party by the Party transferring said
information hereunder without restricting its subsequent
disclosure and use by said third party.
19.4 In the event that either Party either determines on the advice of
its counsel that it is required to disclose any information
pursuant to applicable law or receives any demand under lawful
process to disclose or provide information of the other Party
that is subject to the confidentiality provisions hereof, such
Party shall notify the other Party prior to disclosing and
providing such information and shall cooperate at the expenses of
the requesting Party in seeking any reasonable protective
arrangements requested by such other Party. Subject to the
foregoing, the Party that receives such request may thereafter
disclose or provide information to the extent required by such
law (as so advised by counsel) or by lawful process.
-24-
20.0 REPORTS AND COMMUNICATIONS
20.1 Each Party hereby appoints a Program Manager whose
responsibilities shall include acting as a focal point for the
technical and commercial discussions between them related to the
subject matter of this Agreement, to include monitoring within
his or her respective company the distribution of Confidential
Information received from the other Party and assisting in the
prevention of the unauthorized disclosure of Confidential
Information within the company and to third parties. The Program
Managers shall also be responsible for maintaining pertinent
records and arranging such conferences, visits, reports and other
communications as are necessary to fulfill the terms and
conditions of this Agreement. The names, addresses and telephone
numbers of the Program Managers will be communicated between the
Parties from time to time.
21.0 GENERAL
21.1 AMENDMENT: This Agreement may be modified only by a written
document signed by duly authorized representatives of the
Parties.
21.2 FORCE MAJEURE: A Party shall not be liable for a failure or delay
in the performance of any of its obligations under this Agreement
where such failure or delay is the result of fire, flood, or
other natural disaster, act of God, war, embargo, riot, labor
dispute, unavailability of raw materials or utilities (provided
that such unavailability is not caused by the actions or
inactions of the Party claiming force majeure), or the
intervention of any government authority, providing that the
Party failing in or delaying its performance immediately notifies
the other Party of its inability to perform and states the reason
for such inability.
21.3 ASSIGNMENT: This Agreement may not be assigned by any Party
hereto without the written consent of the other Party; provided
that ▇▇▇▇▇▇▇▇▇ may assign its rights but not its obligations
hereunder as collateral security to any bona fide financial
institution engaged in acquisition financing in the ordinary
course providing financing to consummate the transactions
contemplated by the Purchase Agreement or any bona fide financial
institution engaged in
-25-
acquisition financing in the ordinary course through whom such
financing is refunded, replaced, or refinanced and any of the
foregoing financial institutions may assign such rights in
connection with a sale of ▇▇▇▇▇▇▇▇▇ or the Business in the form
then being conducted by ▇▇▇▇▇▇▇▇▇ substantially as an entirety.
Subject to the foregoing, all of the terms and provisions of this
Agreement shall be binding upon, and inure to the benefit of, and
shall be enforceable by, the respective successors and assigns of
the Parties hereto.
21.4 COUNTERPARTS: This Agreement may be executed simultaneously in
two or more counterparts, each of which shall be deemed an
original and all of which together shall constitute but one and
the same instrument.
21.5 CHOICE OF LAW: This Agreement, and the rights and obligations of
the Parties hereto, shall be interpreted and governed in
accordance with the laws of the State of California, without
giving effect to its conflicts of law provisions.
21.6 WAIVER: Should either of the Parties fail to exercise or enforce
any provision of this Agreement, such failure or waiver shall not
be construed as constituting a waiver or a continuing waiver of
its rights to enforce such provision or right or any other
provision or right. Should either of the Parties waive any
provision or right under this Agreement, such waiver shall not be
construed as constituting a waiver of any other provision or
right.
21.7 SEVERABILITY: If any provision of this Agreement or the
application thereof to any situation or circumstance shall be
invalid or unenforceable, the remainder of this Agreement shall
not be affected, and each remaining provision shall be valid and
enforceable to the fullest extent.
21.8 LIMITATION OF LIABILITY: IN NO EVENT SHALL EITHER PARTY BE LIABLE
FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES
RESULTING FROM THE OTHER PARTY'S PERFORMANCE OR FAILURE TO
PERFORM UNDER THIS AGREEMENT, OR THE FURNISHING, PERFORMANCE, OR
USE OF ANY GOODS OR SERVICES SOLD PURSUANT HERETO, WHETHER DUE TO
BREACH OF CONTRACT, BREACH OF WARRANTY, NEGLIGENCE OR OTHERWISE,
REGARDLESS OF WHETHER THE
-26-
NON-PERFORMING PARTY WAS ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES OR NOT.
21.9 EFFECT OF HEADINGS: The headings and sub-headings contained
herein are for information purposes only and shall have no effect
upon the intended purpose or interpretation of the provisions of
this Agreement.
21.10 INTEGRATION: The agreement of the Parties, which is composed of
this Agreement and the Exhibits hereto and the documents referred
to herein, constitutes the entire agreement and understanding
between the Parties with respect to the subject matter of this
Agreement and integrates all prior discussions and proposals
(whether oral or written) between them related to the subject
matter hereof.
21.11 PUBLIC ANNOUNCEMENT: Prior to the closing of the transactions
contemplated under the Purchase Agreement, neither ▇▇▇▇▇▇▇▇▇ nor
National shall, without the approval of the other Party hereto,
make any press release or other public announcement concerning
the terms of the transactions contemplated by this Agreement,
except as and to the extent that any such Party shall be so
obligated by law, in which case the Party shall use its Best
Efforts to advise the other Party thereof and the Parties shall
use their Best Efforts to cause a mutually agreeable release or
announcement to be issued; provided that the foregoing shall not
preclude communications or disclosures necessary to (a) implement
the provisions of this Agreement or (b) comply with accounting
and Securities and Exchange Commission disclosure obligations.
▇▇▇▇▇▇▇▇▇ shall provide National with a reasonable opportunity to
review and comment on any references to National made by
▇▇▇▇▇▇▇▇▇ (and shall not include any such references to National
without the written consent of National, which consent shall not
be unreasonably withheld or delayed) in any written materials
that are intended to be filed with the Securities and Exchange
Commission in connection with obtaining financing required to
effect the transactions contemplated in connection with the
Purchase Agreement or intended to be distributed to prospective
purchasers pursuant to an offering made under Rule 144A
promulgated under the Securities Act of 1933 in connection with
obtaining such financing.
21.12 NO PARTNERSHIP OR AGENCY CREATED: Nothing contained herein or
done pursuant to this Agreement shall
-27-
constitute the Parties as entering upon a joint venture or
partnership, or shall constitute either Party the agent for the
other Party for any purpose or in any sense whatsoever.
21.13 BINDING EFFECT: This Agreement and the rights and obligations
hereunder shall be binding upon and inure to the benefit of
the Parties hereto and to their respective successors and
assigns.
21.14 NOTICES: All notices, requests, demands and other communications
which are required or may be given under this Agreement shall be
in writing and shall be deemed to have been duly given when
received if personally delivered; when transmitted if transmitted
by telecopy, electronic or digital transmission method; the day
after it is sent, if sent for next day delivery to a domestic
address by a recognized overnight delivery service (e.g., Federal
Express); and upon receipt, if sent by certified or registered
mail, return receipt requested. In each case notice shall be sent
to:
National: National Semiconductor Corporation
▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇
▇.▇. ▇▇▇ ▇▇▇▇▇
M/S ▇▇-▇▇▇
▇▇▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
Attn: General Counsel
FAX: (▇▇▇) ▇▇▇-▇▇▇▇
Fairchild: ▇▇▇▇▇▇▇▇▇ Semiconductor Corporation
M/S 01-00 (General Counsel)
▇▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇
▇▇▇▇▇ ▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇
FAX: (▇▇▇) ▇▇▇-▇▇▇▇
or to such other place as such Party may designate as to itself
by written notice to the other Party.
-28-
IN WITNESS WHEREOF, the Parties have had this Agreement executed by their
respective duly authorized officers on the day and date first written above. The
persons signing warrant that they are duly authorized to sign for and on behalf
of the respective Parties.
NATIONAL SEMICONDUCTOR CORPORATION
By:/s/ ▇▇▇▇ ▇. ▇▇▇▇▇ III
--------------------------------
Title: Senior ▇.▇.
▇▇▇▇▇▇▇▇▇ SEMICONDUCTOR CORPORATION
By:/s/ ▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇
--------------------------------
Title: Executive V.P.
-29-
EXHIBIT A
PROCESSES
4-inch Wafer Process Flows: ▇▇▇▇▇▇▇▇▇ Maine Fab 4100
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Process Description and
Process Name Acceptance Specification Status
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ANALOG 5(mu) Bipolar Process Prod
Spec: Exhibit F - Fab 4100 "ANALOG"
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BUS 4(mu) Bipolar, Low Power Schottky optimized for Prod
Bus Interface applications
Spec: Exhibit F - Fab 4100 "BUS"
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CGS 4(mu) Bipolar, Low Power Schottky optimized for Prod
Clock Generator applications
Spec: Exhibit F - Fab 4100 "CGS"
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DTCOMM 3(mu) FAST, Bipolar Schottky optimized for Data Prod
Communications applications
Spec: Exhibit F - Fab 4100 "DTCOMM"
--------------------------------------------------------------------------------
DTP 4(mu) Bipolar, Low Power Schottky Prod
Spec: Exhibit F- Fab 4100 "DTP"
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PTP 4(mu) Bipolar, Low Power Schottky optimized for Prod
Point to Point applications
Spec: Exhibit F - Fab 4100 "PTP"
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FSLM 3(mu) FAST Bipolar Sky Prod
Spec:
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FDLM 3(mu) FAST Bipolar 2LM Prod
Spec:
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FLSI 2.5(mu) FAST Bipolar 2LM Prod
Spec:
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ECL 2.5(mu) FAST Bipolar 2LM Prod
Spec:
--------------------------------------------------------------------------------
LPSSLM 4(mu) LPS Bipolar Single LM Prod
Spec:
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LPSDLM 4(mu) LPS Bipolar 2LM Prod
Spec;
--------------------------------------------------------------------------------
LSRSLM 4(mu) LPS Bipolar Single LM Prod
Spec:
--------------------------------------------------------------------------------
TTL 8(mu) TTL Bipolar SLM Prod
Spec:
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HCMOS 75 2.5(mu) HCMOS SLM Prod
Spec:
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5-inch Wafer Process Flows: ▇▇▇▇▇▇▇▇▇ Maine Fab 5100
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Process Description and
Process Name Acceptance Specification Status
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--------------------------------------------------------------------------------
CGSP/E 2.5(mu) HCMOS Prod
Spec:
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FCT20P/E 2(mu) FACT 2LM Prod
Spec:
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6-inch Wafer Process Flows: ▇▇▇▇▇▇▇▇▇ Maine Fab 6001
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Process Description and
Process Name Acceptance Specification Status
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MSIFCT15 1.5(mu) FACT 2LM Prod
Spec:
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LSIFCT15 1.5(mu) FACT 2LM Prod
Spec:
--------------------------------------------------------------------------------
SCAN15 1.5(mu) FACT 2LM Prod
Spec:
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ATBC10 1.0(mu) BCT 2LM Prod
Spec:
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EXHIBIT B
PRODUCT LIST AND SUPPORTING DATA
Non ▇▇▇▇▇▇▇▇▇ Products
Products manufactured in Maine
-------------------------------------------------------------------------------------------------------------
Division Product ID ▇▇▇▇ ID & REV Process Flow Sort Test Sort W/hr MYA Date
-------------------------------------------------------------------------------------------------------------
ANALOG DM8640A4B DM8640A-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8833B4B DM8833B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8834B4B DM8834B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8835B4B DM8835B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8836B4B DM8836B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8837B4B DM8837B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8838A4B DM8838A4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8839B4B DM8839B4B-TAB BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DP7304C4B DP7304C4B-TAA BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS1776Z4B DS1776Z4B-TAA BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS1777Z4B DS1777Z4B-TAA BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS76S10A4B DS76S10A4B-TAA BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS76S11A4B DS76S11A4B-TAA BUS MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS1691A4B DS1691A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS26L31B4B DS26L31B4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS26L31B4B DS261L31B4B-TAA/E DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS26L32B4B DS26L32B4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS26L32B4B DS26L32B4B-TAA/E DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS26L33B4B DS26L33B4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS7632A4B DS7632A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS7632A4B DS7632A4B-TAA/E DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS7633A4B DS7633A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS78C120A4B DS78C120A4B-TAA/E DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS78LS120A4B DS78LS120A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG ▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇-▇▇▇/▇ DTCOMM MCT20XX 55% 6-Jan-97
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ANALOG 9636A4B 9636A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
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1 of 3
EXHIBIT B
PRODUCT LIST AND SUPPORTING DATA
Non ▇▇▇▇▇▇▇▇▇ Products
Products manufactured in Maine
-------------------------------------------------------------------------------------------------------------
Division Product ID ▇▇▇▇ ID & REV Process Flow Sort Test Sort W/hr MYA Date
-------------------------------------------------------------------------------------------------------------
ANALOG 9637A4B 9637A4B-TBA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9638A4B 9638A4B-TDB DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9638A4B 9638A4B-TDB/E DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9639A4B 9639A4B-TAA DTCOMM MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8830E4B DM8830E4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8830EAB DM8830EAB-TAB/D DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8831B4B DM8831B4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8832B4B DM8832B4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DM8832B4B DM8832B4B-TAB/E DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS75113A4B DS75113A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS75114A4B DS75114A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS75114A4B DS75114A4B-TAB/C DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS75115A4B DS75115A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS8820H4B DS8820H4B-TBB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG DS8820H4B DS8820H4B-TBB/E DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG LM163A4B LM163A4B-TAB DTP MCT20XX 55% 6-Jan-97
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ANALOG LM3623A4B LM3623A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG LM3624A4B LM3624A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG LM75107A4B LM75107A4B-TAB DTP MCT20XX 55% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9614A4B 9614A4B-TBA DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9614A4B 9614A4B-TBA/C DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9614A4B 9614A4B-TBA/E DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9615A4B 9615A4B-TBA DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9615A4B 9615A4B-TBA/C DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9615A4B 9615A4B-TBA/E DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9622A4B 9622A4B-TBA DTP MCT20XX N/A 6-Jan-97
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2 of 3
EXHIBIT B
PRODUCT LIST AND SUPPORTING DATA
Non ▇▇▇▇▇▇▇▇▇ Products
Products manufactured in Maine
-------------------------------------------------------------------------------------------------------------
Division Product ID ▇▇▇▇ ID & REV Process Flow Sort Test Sort W/hr MYA Date
-------------------------------------------------------------------------------------------------------------
MCT20XX
-------------------------------------------------------------------------------------------------------------
ANALOG 9627A4B 9627A4B-TCA DTP MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
ANALOG 9616A4B 9616A4B-TDA DTCOMM MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C DP8311C/M4B DP8311C/M4B-TBB ANALOG MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C DS002B4B DS002B4B-TBB/E ANALOG MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7710A/C4G 7710A/C4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7710A/M4G 7710A/M4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7710A4G 7710A4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7711C4G 7711C4G-TBA/C ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7711A/C4G 7711A/C4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7711A/M4G 7711A/M4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 7711A4G 7711A4G-TBA ANALOG MCT20XX N/A 6-Jan-97
-------------------------------------------------------------------------------------------------------------
C&C 9667B4B 9667B4B-TCA/E ANALOG MCT20XX 50% 6-Jan-97
-------------------------------------------------------------------------------------------------------------
3 of 3
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
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CGS3301 ZCF3021C CGS3301Z5B CCF 8C
CGS3301 ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ B2A30211 DMS54LSR154BB4B TBA 70
DMS71LSR95 C1C30211 81LSR95C4B ▇▇▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇ ▇▇▇ 8T
DM7474 WBB3023T 7474W4B TBB/C 8T
DM7474 WBB3025T 7474W4B TBB/E 8T
DM9334 AAB3021T 9334A4B TAB 8T
MM74HC123 CBA3021T MM74HC123C4B TBA 41
MM74HC123 CBA3025T MM74HC123C4B TBA/E 41
WA000BYA 9300YR4B TYA 8T
WA001MMA 9301V4B TAA 8T
WA008BXA 9308X4B TXA 8T
WA011BBA 9311W4B TBA 8T
WA012BCA 9312W4B TCB 8T
WA016MCA 9316T4B TCA 8T
WA021MXA 9321Y4B TXA 8T
WA024BBA 9324V4B TBA 8T
WA034BCA 9334U4B TCA 8T
WA038BAA 9338X4B TAA 8T
WA048MAA 9348X4B TAA 8T
WB000BBB 93L00T4B ▇▇▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ 8T
WB008MAB 93L08W4B TAB 8T
WB009MAB 93L09Z4B TAB 8T
WB010MBB 93L10U4B ▇▇▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ 8T
WB021MAB 93L21Z4B TAB 8T
WB022BDB 93L22X4B TDB 8T
WB022MCB 93L22X4B TCB 8T
WB028BBB 93L28U4B TBB 8T
WB034MAB 93L34V4B TAB 8T
WB038BBB 93L38W4B ▇▇▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇ 70
WL000FBB 74LS00Z4B TBB/E 70
WL003BBB 74LS03Z4B TBB 70
WL003FBB 74LS03Z4B TBB/E 70
WL004BAB 74LS04Z4B TAB 70
WL004CAB 74LS04Z4B TAB/C 70
WL004FAB 74LS04Z4B TAB/E 70
WL005BAB 74LS05Z4B TAB 70
WL005FAB 74LS05Z4B TAB/E 70
WL008FAB 74LS08Z4B TAB/E 70
WL008MAB 74LS08Z4B TAB 70
WL008PAB 74LS08Z4B TAB/C 70
WL009MAB 74S09Z4B TAB 70
WL010BDB 74LS10Z4B TDB 70
Page 1
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WL010FDB 74LS10Z4B TDB/E 70
WL011BFB 74LS11Z4B TFB 70
WL014BAB 74LS14YAB TAB 70
WL015BEB 74LS15Z4B TEB 70
WL015FEB 74LS15Z4B TEB/E 70
WL020BAB 74LS20Z4B TAB 70
WL020CAB 74LS20Z4B TAB/C 70
WL020GAB 74LS20Z4B TAB/D 70
WL021MAB 74LS21Z4B TAB 70
WL021PAB 74LS21Z4B TAB/C 70
WL026BBB 74LS26Z4B TBB 70
WL027BDB 74LS27Z4B TDB 70
WL027MAB 74LS27Z4B TAB 70
WL030BDB 74LS30Z4B TDB 70
WL032BAB 74LS32Z4B TAB 70
WL032CAB 74LS32Z4B TAB/C 70
WL032FAB 74LS32Z4B TAB/E 70
WL033MBB 74LS33Y4B TBB 70
WL038MCB 74LS38Y4B TCB 70
WL042BBB 74LS42Y4B TBB 70
WL047BBB 74LS47Y4B TBB 70
WL051BDB 74LS51Z4B TDB 70
WL051PAB 74LS51Z4B TAB/C 70
WL054MBB 74LS54Y4B TBB 70
WL054PBB 74LS54Y4B TBB/C 70
WL054MBB 74LS55Y4B TBB 70
WL074BCB 74LS74Z4B TCB 70
WL074CCB 74LS74Z4B TCB/C 70
WL074FCB 74LS74Z4B TCB/E 70
WL074GCB 74LS74Z4B TCB/D 70
WL083BBB 74LS83Y4B TBB 70
WL083CBB 74LS83Y4B TBB/C 70
WL085BBC 74LS85Y4B TBC 70
WL085CBC 74LS85Y4B ▇▇▇/▇ ▇▇
WL085FAB 74LS85Z4B TAB/E 70
WL085FBC 74LS85Y4B TBC/E 70
WL095BFB 74LS95U4B TFB 70
WL109BCB 74LS109Z4B TCB 70
WL109CCB 74LS109Z4B TCB/C 70
WL109FCB 74LS109Z4B TCB/E 70
WL113BEB 74LS113Z4B TEB 70
WL113CEB 74LS113Z4B TEB/C 70
WL125BBB 74LS125AX4B TBB 70
WL133BBB 74LS133Z4B TBB 70
WL138BCB 74LS138Y4B TCB 70
WL138CBB 74LS138Z4B TBB/C 70
WL138FCB 74LS138Y4B TCB/E 70
WL139BBB 74LS139Z4B TBB 70
Page 2
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WL139CBB 74LS139Z4B TBB/C 70
WL151BBB 74LS151Y4B TBB 70
WL151CAB 74LS151Z4B TAB/C 70
WL151FBB 74LS151Y4B TBB/E 70
WL151GAB 74LS151Z4B TAB/D 70
WL153BAB 74LS153Z4B TAB 70
WL153CAB 74LS153Z4B TAB/C 70
WL155BEB 74LS155Z4B TEB 70
WL156BDB 74LS156Z4B TDB 70
WL157BDB 74LS157T4B TDB 70
WL158BDB 74LS158T4B TDB 70
WL158PCB 74LS158T4B TCB/C 70
WL161BCB 74LS161AU4B TCB 70
WL162BDB 74LS162AU4B TDB 70
WL164BDB 74LS164U4B TDB 70
WL164FDB 74LS164U4B TDB/E 70
WL165BCB 74LS165Z4B TCB 70
WL165FCB 74LS165Z4B TCB/E 70
WL168BEB 74LS168Y4B TEB 70
WL169BEB 74LS169Y4B TEB 70
WL169FEB 74LS169Y4B TEB/E 70
WL173BCB 74LS173X4B TCB 70
WL173FCB 74LS173X4B TCB/E 70
WL174BBB 74LS174Y4B TBB 70
WL174FBB 74LS174Y4B TBB/E 70
WL175BCB 74LS175Y4B TCB 70
WL175CCB 74LS175Y4B TCB/C 70
WL175FCB 74LS175Y4B TCB/E 70
WL181BDB 74LS181Y4B TDB 70
WL193BCB 74LS193X4B TCB 70
WL193CCB 74LS193X4B TCB/C 70
WL193FCB 74LS193X4B TCB/E 70
WL193GCB 74LS193X4B TCB/D 70
WL194BHB 74LS194AV4B THB 70
WL194CHB 74LS194AV4B THB/C 70
WL195BGB 74S195AU4B TGB 70
WL195FGB 74LS195AU4B TGB/E 70
WL240BCC 74LS240U4B TCC 70
WL240CCC 74LS240U4B TCC/C 70
WL241BCC 74LS241U4B TCC 70
WL241CCC 74LS241U4B TCC/C 70
WL241FCC 74LS241U4B TCC/E 70
WL244BCC 74LS244U4B TCC 70
WL244CCC 74LS244U4B TCC/C 70
WL244FCC 74LS244U4B TCC/E 70
WL244GDC 74LS244U4B TDC/D 70
WL245BAC 74LS245Z4B TAC 70
WL253BAB 74LS253Z4B TAB 70
Page 3
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WL253CAB 74LS253Z4B TAB/C 70
WL253FAB 74LS253Z4B TAB/E 70
WL253GCB 74LS253Z4B TCB/D 70
WL257BDB 74LS257AT4B TDB 70
WL257FDB 74LS257AT4B TDB/E 70
WL257PCB 74LS257AT4B TCB/C 70
WL258BDB 74LS258AT4B TDB 70
WL258FDB 74LS258AT4B TDB/E 70
WL258PCB 74LS258AT4B TCB/C 70
WL259BAB 74LS259Z4B TAB 70
WL259CAB 74LS259Z4B TAB/C 70
WL260BBB 74LS260Z4B TBB 70
WL273BAB 74LS273Z4B TAB 70
WL273CAB 74LS273Z4B TAB/C 70
WL273GDB 74LS273Z4B TDB/D 70
WL279BAB 74LS279Z4B TAB 70
WL279CAB 74LS279Z4B TAB/C 70
WL283BBB 74LS283Y4B TBB 70
WL283CBB 74SL283Y4B TBB/C 70
WL283FBB 74LS283Y4B TBB/E 70
WL283GCB 74LS283Y4B TCB/D 70
WL295MEB 74LS295AV4B TEB 70
WL298BFB 74LS298U4B TFB 70
WL299BAB 74LS299Z4B TAB 70
WL322BAB 74LS322Z4B TAB 70
WL323BAB 74LS323Z4B TAB 70
WL365BBB 74LS365AX4B TBB 70
WL365CBB 74LS365AX4B TBB/C 70
WL365FBB 74LS365AX4B TBB/E 70
WL366BBB 74LS366AX4B TBB 70
WL366CBB 74LS366AX4B TBB/C 70
WL367BBB 74LS367AX4B TBB 70
WL367CBB 74LS367AX4B TBB/C 70
WL368BBB 74LS368AX4B TBB 70
WL368CBB 74LS368AX4B TBB/C 70
WL374BBB 74LS374Y4B TBB 70
WL374FBB 74LS374Y4B TBB/E 70
WL377BBB 74LS377Z4B TBB 70
WL378BDB 74LS378Z4B TDB 70
WL379MAB 74LS379Y4B TAB 70
WL502BBB 74LS502X4B TBB 70
WL503BBB 74LS503X4B TBB 70
WL602BBB 74LS602Y4B TBB 70
WL670BBB 74LS670Y4B TBB 70
WL670FBB 74LS670Y4B TBB/E 70
WM000BGE 74F00W4B TGE 8M
WM000CGE 74F00W4B TGE/C 8M
WM000GHE 74F00W4B THE/D 8M
Page 4
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WM002BEE 74F02X4B TEE 8M
WM002CEE 74F02X4B TEE/C 8M
WM002GFE 74F02X4B TFE/D 8M
WM004BHE 74F04U4B THE 8M
WM004CHE 74F04U4B THE/C 8M
WM004GJE 74F04U4B TJE/D 8M
WM008BGE 74F08W4B TGE 8M
WM008CGE 74F08W4B TGE/C 8M
WM008GHE 74F08W4B THE/D 8M
WM010BCE 74FF10X4B TCE 8M
WM010CCE 74F10X4B TCE/C 8M
WM010GDE 74F10X4B TDE/D 8M
WM011BCE 74F11X4B TCE 8M
WM011CCE 74F11X4B TCE/C 8M
WM011FCE 74F11X4B TCE/E 8M
WM011GDE 74F11X4B TDE/D 8M
WM014BAB 74F14Z4B TAB 8M
WM020BCE 74F20X4B TCE 8M
WM020CBE 74F20X4B TBE/C 8M
WM020GDE 74F20X4B TDE/D 8M
WM032BJE 74F32U4B TJE 8M
WM032CJE 74F32U4B TJE/C 8M
WM032GKE 74F32U4B TKE/D 8M
WM038BBD 74F38Z4B TBD 8M
WM038CBD 74F38Z4B TBD/C 8M
WM038FBD 74F38Z4B TBD/E 8M
WM064BCE 74F64X4B TCE 8M
WM064CCE 74F64X4B TCE/C 8M
WM064GDE 74F64X4B TDE/D 8M
WM074BHG 74F74X4B THG 8M
WM074CFE 74F74Y4B TFE/C 8M
WM074GGE 74F74Y4B TGE/D 8M
WM086BEE 74F86Y4B TEE 8M
WM086CEE 74F86Y4B TEE/C 8M
WM086GFE 74F86Y4B TFE/D 8M
WM132BAB 74F132Z4B TAB 8M
WM138BFG 74F138Y4B TFG 8M
WM138CCE 74F138Z4B TCE/C 8M
WM138GDE 74F138Z4B TDE/D 8M
WM139BEE 74F139Y4B TEE 8M
WM139CEE 74F139Y4B TEE/C 8M
WM139GFE 74F139Y4B TFE/D 8M
WM151BHG 74F151AW4B THG 8M
WM151CGG 74F151AW4B TGG/C 8M
WM151GJG 74F151AW4B TJG/D 8M
WM153BKG 74F153U4B TKG 8M
WM153CKG 74F153U4B TKG/C 8M
WM153GLG 74F153U4B TLG/D 8M
Page 5
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WM157BJG 74F157AW4B TJG 8M
WM157CJG 74F157AW4B TJG/C 8M
WM157GKG 74F157AW4B TKG/D 8M
WM158BGG 74F158AW4B TGG 8M
WM158CGG 74F158AW4B TGG/C ▇▇
▇▇▇▇▇▇▇▇ 74F158AW4B THG/D 8M
WM160BMG 74F160AT4B TMG 8M
WM160CMG 74F160AT4B TMF/C 8M
WM160GNG 74F160AT4B TNG/D 8M
WM161BNG 74F161AT4B TNG 8M
WM161CNG 74F161AT4B TNG/C 8M
WM161GPG 74F161AT4B TPG/D 8M
WM163BMG 74F163AT4B TMG 8M
WM163CMG 74F163AT4B TMG/C 8M
WM163GNG 74F163AT4B TNG/D 8M
WM164BGG 74F164AY4B TGG 8M
WM169BFG 74F169W4B TFG 8M
WM174BHE 74F174X4B THE 8M
WM174CHE 74F174X4B THE/C 8M
WM174GJE 74F174X4B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ 74F175U4B TFG 8M
WM175CFG 74F175U4B TFG/C 8M
WM175GEE 74F175Y4B TEE/D 8M
WM181BJG 74F181W4B TJG 8M
WM181CJG 74F181W4B TJG/C ▇▇
▇▇▇▇▇▇▇▇ 74F181W4B TJG/E ▇▇
▇▇▇▇▇▇▇▇ 74F182X4B TCG 8M
WM182CCG 74F182X4B TCG/C 8M
WM182FCG 74F182X4B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇ 8M
WM190bJG 74F190U4B TJG 8M
WM191BJG 74F191U4B TJG 8M
WM192BJG 74F192T4B TJG 8M
WM192CJG 74F192T4B TJG/C 8M
WM193BKG 74F193T4B TKG 8M
WM193CKG 74F193T4B TKG/C 8M
WM194BEE 74F194Y4B TEE 8M
WM194CEE 74F194Y4B TEE/C 8M
WM194FEE 74F194Y4B TEE/E 8M
WM219BDG 74F219Y4B TDG 8M
WM240BHG 74F240T4B THG 8M
WM241BJG 74F241T4B TJG 8M
WM241CJG 74F241T4B TJG/C 8M
WM241GKG 74F241T4B TKG/D 8M
WM243BKG 74F243T4B TKG 8M
WM244BKG 74F244T4B TKG 8M
WM244CKG 74F244T4B TKG/C 8M
WM244GLG 74F244TAB TLG/D 8M
Page 6
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--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WM245BNG 74F245T4B TNG 8M
WM245CNG 74F245T4B TNG/C 8M
WM245GPG 74F245T4B TPG/D 8M
WM251BHG 74F251AW4B THG 8M
WM251CGG 74F252AW4B TGG/C 8M
WM251GJG 74F251AW4B TJG/D 8M
WM253BKG 74F253U4B TKG 8M
WM253CKG 74F253U4B TKG/C 8M
WM253GLG 74F253U4B TLG/D 8M
WM257BKG 74F257AW4B TKG 8M
WM257CHG 74F257AX4B THG/C 8M
WM257GJG 74F257AX4B TJG/D 8M
WM258BHG 74F257AW4B THG 8M
WM258CFG 74F258AX4B TFG/C 8M
WM258GGG 74F258AX4B TGG/D 8M
WM273BCB 74F273Y4B TCB 8M
WM280BKG 74F280U4B TKG 8M
WM280CKG 74F280U4B TKG/C 8M
WM280GLG 74F280U4B TLG/D 8M
WM283BGG 74F283Y4B TGG 8M
WM283CGG 74F283Y4B TGG/C ▇▇
▇▇▇▇▇▇▇▇ 74F283Y4B THG/D 8M
WM299BHB 74F299W4B THB 8M
WM322BFG 74F322Y4B TFG ▇▇
▇▇▇▇▇▇▇▇ 74F323W4B TGB 8M
WM365BDD 74F365Z4B TDD 8M
WM365CCD 74F365Z4B TCD/C 8M
WM373BPG 74F373T4B TPG 8M
WM373CPG 74F373T4B TPG/C 8M
WM373GRG 74F373T4B TRG/D 8M
WM374BQG 74F374S4B TQG 8M
WM377BCB 74F377Y4B TCB 8M
WM378BGE 74F378X4B TGE 8M
WM379BFE 74F379X4B TFE 8M
WM398BFG 74F398U4B TFG 8M
WM398CCE 74F398Y4B TCE/C 8M
WM398GEE 74F398Y4B TEE/D 8M
WM399BFG 74F399U4B TFG 8M
WM399CCE 74F399Y4B TCE/C 8M
WM399GEE 74F399Y4B TEE/D 8M
WM402BDD 74F402Z4B TDD ▇▇
▇▇▇▇▇▇▇▇ 74F407Y4B TBD 8M
WM410BDG 74F410Y4B TDG 8M
WM413BHD 74F413Z4B THD 8M
WM521BFG 74F521Y4B TFG 8M
WM521CDG 74F521Y4B TDG/C 8M
WM521GEG 74F521Y4B TEG/D 8M
WM533BKG 74F533T4B TKG 8M
Page 7
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
WM533CKG 74F533T4B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ 74F534S4B TLG 8M
WM534CLG 74F534S4B TLG/C 8M
WM540BDG 74F540Y4B TDG 8M
WM540CCG 74F540Y4B TCG/D 8M
WM544BGG 74F544Y4B TGG 8M
WM545BJG 74F545T4B TJG 8M
WM545CJG 74F545T4B TJG/C 8M
WM563BGG 74F563W4B TGG 8M
WM563CGG 74F563W4B TGG/C 8M
WM564BGG 74F564T4B TGG 8M
WM573BGG 74F573W4B TGG 8M
WM573CGG 74F573W4B TGG/C 8M
WM574BGG 74F574W4B TGG 8M
WM646BDB 74F646X4B TDB 8M
WM648BDB 74F648X4B TDB 8M
WM651BDB 74F651X4B TDB 8M
WM652BDB 74F652X4B TDB ▇▇
▇▇▇▇▇▇▇▇ 74F657Z4B TCD 8M
WM676BDG 74F676Z4B TDG 8M
WM821BDG 74F821Y4B TDG 8M
WM823BGG 74F823Y4B TGG 8M
WM825BFG 74F825Y4B TFG 8M
WM827BDG 74F827Y4B TDG 8M
WN002CAA 7402X4B TAA/C 8T
WN009CBA 7409W4B TBA/C 8T
WN010CBA 7410U4B TBA/C 8T
WN020BHA 7420X4B THA 8T
WN020CGA 7420X4B TGA/C 8T
WN020CHA 7420X4B THA/C 8T
WN040CDA 7440X4B TDA/C 8T
WN040FCA 7440X4B TCA/E 8T
WN083BDA 7483AV4B TDA 8T
WN083CDA 7483AV4B TDA/C 8T
WN151BCA 74151AX4B TCA 8T
WN151CCA 74151AX4B TCA/C 8T
WN175CDA 74175Z4B TDA/C 8T
WN298BEA 74298W4B TEA 8T
WTF10CBA 54LF10B4B TBA/C 8T
WTF10GBA 54LF10B4B TBA/D 8T
W2241BAG 74F2241T4B TAG ▇▇
▇▇▇▇▇▇▇▇ 74F2243T4B TCG ▇▇
▇▇▇▇▇▇▇▇ 74F2244T4B TAG 8M
100301 ZBC3021T 100301Z4B TBC 8K
100301 ZBC3025T 100301Z4B TBC/E 8K
100302 ZBC3021T 100302Z4B TBC 8K
100302 ZBC3025T 100302Z4B TBC/E 8K
100304 YDC3021T 100304Y4B TDC 8K
Page 8
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
100304 YDC3025T 100304Y4B TDC/E 8K
100307 YCC3021T 100307Y4B TCC 8K
100307 YCC3025T 100307Y4B TCC/E 8K
100310 YAC3021T 100310Y4B TAC 8K
100310 YAC3025T 100310Y4B TAC/E 8K
100311 YAC3021T 100311Y4B TAC 8K
100311 YAC3025T 100311Y4B TAC/E 8K
100313 ZAC3021T 100313Z4B TAC 8K
100313 ZAC3025T 100313Z4B TAC/E 8K
100314 ZBC3021T 100314Z4B TBC 8K
100314 ZBC3025T 100314Z4B TBC/E 8K
100315 ZAC3021T 100315Z4B TAC 8K
100315 ZAC3025T 100315Z4B TAC/E 8K
100316 ZDC3021T 100316Z4B TDC 8K
100316 ZDC3025T 100316Z4B TDC/E 8K
100319 ZCC3021T 100319Z4B TCC 8K
100319 ZCC3025T 100319Z4B TCC/E 8K
100321 ZAC3021T 100321Z4B TAC 8K
100321 ZAC3025T 100321Z4B TAC/E 8K
100322 ZAC3021T 100322Z4B TAC 8K
100322 ZAC3025T 100322Z4B TAC/E 8K
100323 ZDC3021T 100323Z4B TDC 8K
100323 ZDC3025T 100323Z4B TDC/E 8K
100324 ZAC3021T 100324Z4B TAC 8K
100324 ZAC3025T 100324Z4B TAC/E 8K
100325 ZBC3021T 100325Z4B TBC 8K
100325 ZBC3025T 100325Z4B TBC/E 8K
100328 ZBC3021T 100328Z4B TBC 8K
100328 ZBC3025T 100328Z4B TBC/E 8K
100329 ZCC3021T 100329Z4B TCC 8K
100329 ZCC3025T 100329Z4B TCC/E 8K
100331 YCC3021T 100331Y4B TCC 8K
100331 YCC3025T 100331Y4B TCC/E 8K
100336 YEC3021T 100336Y4B TEC 8K
100336 YEC3025T 100336Y4B TEC/E 8K
100336 YFC3021T 100336Y4B TFC 8K
100336 YFC3025T 100336Y4B TFC/E 8K
100341 ZCC3021T 100341Z4B TCC 8K
100341 ZCC3025T 100341Z4B TCC/E 8K
100343 ZBC3021T 100343Z4B TBC 8K
100343 ZBC3025T 100343Z4B TBC/E 8K
100344 ZAC3021T 100344Z4B TAC 8K
100344 ZAC3025T 100344Z4B TAC/E 8K
100350 YFC3021T 100350Y4B TFC 8K
100350 YFC3025T 100350Y4B TFC/E 8K
100351 YEC3021T 100351Y4B TEC 8K
100351 YEC3025T 100351Y4B TEC/E 8K
100351 YFC3021T 100351Y4B TFC 8K
Page 9
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
100351 YGC3024T 100351Y4B TGC/D 8K
100352 ZAC3021T 100352Z4B TAC 8K
100352 ZAC3025T 100352Z4B TAC/E 8K
100353 ZBC3021T 100353Z4B TBC 8K
100353 ZBC3025T 100353Z4B TBC/E 8K
100354 ZAC3021T 100354Z4B TAC 8K
100354 ZAC3025T 100354Z4B TAC/E 8K
100355 ZAC3021T 100355Z4B TAC 8K
100355 ZAC3025T 100355Z4B TAC/E 8K
100360 ZAC3021T 100360Z4B TAC 8K
100360 ZAC3025T 100360Z4B TAC/E 8K
100363 ZAC3021T 100363Z4B TAC 8K
100363 ZAC3025T 100363Z4B TACE 8K
100364 ZAC3021T 100364Z4B TAC 8K
100364 ZAC3025T 100364Z4B TAC/E 8K
100370 YCC3021T 100370Y4B TCC 8K
100371 ZCC3021T 100371Z4B TCC 8K
100371 ZCC3025T 100371Z4B TCC/E 8K
100390 YDC3021T 100390Y4B TDC 8K
100390 YDC3025T 100390Y4B TDC/E 8K
100391 ZAC3021T 100391Z4B TAC 8K
100393 ZBC3021T 100393Z4B TBC 8K
100393 ZCC3021T 100393Z4B TCC 8K
100395 ZBC3021T 100395Z4B TBC 8K
100395 ZCC3021T 100395Z4B TCC 8K
100397 ZAC3021T 100397Z4B TAC 8K
100398 ZAC3021T 100398Z4B TAC 8K
1305 WBB3021T 1305W4B TBB 8T
1306 WDB3021T 1306W4B TDB 8T
54LF00 EBB3021T 54LF00E4B TBB 8T
54LF00 EBB3023T 54LF00E4B TBB/C 8T
54LF00 EBB3024T 54LF00E4B TBB/D 8T
54LSR00 DBB3023T 54LS400D4B TBB/C 70
54LSR00 DBB3024T 54LS400D4B TBB/D 70
54LSR03 DBB3023T 54LSR03D4B TBB/C 70
54LSR03 DBB3024T 54LSR03D4B TBB/D 70
54LSR04 BBB3024T 54LSR04B4B TBB/D 70
54LSR05 BBB3023T 54LSR05B4B TBB/C 70
54LSR05 BBB3024T 54LS405B4B TBB/D 70
54LSR10 CBB3023T 54LSR10C4B TBB/C 70
54LSR10 CBB3024T 54LSR10C4B TBB/D 70
54LSR11 DBB3023T 54LSR11D4B TBB/C 70
54LSR11 DBB3024T 54LSR11D4B TBB/D 70
54LSR138 BBB3024T 54LSR138B4B TBB/D 70
54LSR139 BBB3024T 54LSR139B4B TBB/D 70
54LSR153 DBB3024T 54LSR153D4B TBB/D 70
54LSR154 BBB3021T 54LSR154B4B TBB 70
54LSR154 BBB3025T 54LSR154B4B TBB/E 70
Page 10
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
54LSR157 CBB3024T 54LSR157C4B TBB/D 70
54LSR158 CBB3024T 54LSR158C4B TBB/D 70
54LSR161 CBB3023T 54LSR161C4B TBB/C 70
54LSR161 CBB3025T 54LSR161C4B TBB/E 70
54LSR164 BBB3023T 54LSR164C4B TBB/C 70
54LSR164 BBB3024T 54LSR164C4B TBB/D 70
54LSR169 CBB3021T 54LSR169C4B TBB/C 70
54LSR191 BBB3021T 54LSR191B4B TBB 70
54LSR21 DBB3024T 54LSR21D4B TBB/D 70
54LSR251 DBB3021T 54LSR251D4B TBB 70
54LSR251 DBB3023T 54LSR251D4B TBB/C 70
54LSR251 DBB3024T 54LSR251D4B TBB/D 70
54LSR257 CBB3024T 54LSR257C4B TBB/D 70
54LSR27 BBB3023T 54LSR27B4B TBB/C 70
54LSR27 BBB3024T 54LSR27B4B TBB/D 70
54LSR30 CBB3023T 54LSR30C4B TBB/C 70
54LSR30 CBB3024T 54LSR30C4B TBB/D 70
54LSR373 BBB3021T 54LSR373B4B TBB 70
54LSR38 BBB3023T 54LSR38B4B TBB/C 70
54LSR42 BBB3023T 54LSR42B4B TBB/C 70
54LSR42 BBB3024T 54LSR42B4B TBB/D 70
54LSR670 BBB3023T 54LSR670B4B TBB/C 70
54LSR73 DBB3021T 54LSR73D4B TBB 70
54LSR73 DBB3025T 54LSR73D4B TBB/E 70
54LSR86 BBB3021T 54LSR86B4B TBB 70
54LSR86 BBB3023T 54LSR86B4B TBB/C 70
54LSR86 BBB3024T 54LSR86B4B TBB/D 70
54L00 ECB3021T 54L00E4B TCB 8T
54L00 ECB3023T 54L00E4B TCB/C 8T
54L00 ECB3024T 54L00E4B TCB/D 8T
54L04 BBB3021T 54L04B4B ▇▇▇ ▇▇
▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 54L04B4B ▇▇▇/▇ ▇▇
▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 54L04B4B TCB/D 8T
5406 BBB3021T 5406B4B TBB 8T
5406 BBB3023T 5406B4B TBB/C 8T
5406 BBB3024T 5406B4B TBB/D 8T
5407 BBB3021T 5407B4B TBB 8T
5407 BBB3023T 5407B4B TBB/C 8T
5407 BBB3024T 5407B4B TBB/D 8T
5414 ABB3021T 5414A4B TBB 8T
5414 ABB3023T 5414A4B TBB/C 8T
54161 CBB3021T 54161C4B TBB 8T
54161 CBB3023T 54161C4B TBB/C 8T
54161 CBB3024T 54161C4B TBB/D 8T
54180 ABB3021T 54180A4B TBB 8T
54180 ABB3023T 54180A4B TBB/C 8T
54194 ABB3021T 54194A4B TBB 8T
54194 ABB3023T 54194A4B TBB/C 8T
Page 11
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
5438 ABB3021T 5438A4B TBB 8T
5438 ABB3023T 5438A4B TBB/C 8T
5438 ABB3024T 5438A4B TBB/D 8T
74ABT16244 ZAA3021B 74ABT16244Z6B BAA 6R
74ABT16245 ZAA3021B 74ABT16245Z6B BAA 6R
74ABT16373 ZAA3021B 74ABT16373Z6B BAA 6R
74ABT16374 ZAA3021B 74ABT16374Z6B BAA 6R
74ABT16500 ZAA3021B 74ABT16500Z6B BAA 6R
74ABT16646 ZAA3021B 74ABT16646Z6B BAA 6R
74ABT2240 YAB3021B 74ABT2240Y6B BAB 6R
74ABT2244 YCB3021B 74ABT2244Y6B BCB 6R
74ABT22952 ZCB3021B 74ABT22952Z6B BCB 6R
74ABT240 YAA3021B 74ABT240Y6B BAA 6R
74ABT240 YAB3021B 74ABT240Y6B BAB 6R
74ABT241 YAA3021B 74ABT241Y6B BAA 6R
74ABT241 YAB3021B 74ABT241Y6B BAB 6R
74ABT244 YCB3021B 74ABT244Y6B BCB 6R
74ABT244 ZBA3021B 74ABT244Y6B BBA 6R
74ABT244 ZBA3024B 74ABT244Y6B BBA/D 6R
74ABT245 ZCA3021B 74ABT245Z6B BCA 6R
74ABT245 ZCA3024B 74ABT245Z6B BCA/D 6R
74ABT245 ZCB3021B 74ABT245Z6B BCB 6R
74ABT273 ZAA3021B 74ABT273Z6B BAA 6R
74ABT2952 ZDB3021B 74ABT2952Z6B BDB 6R
74ABT373 ZAA3021B 74ABT373Z6B BAA 6R
74ABT373 ZAA3024B 74ABT373Z6B BAA/D 6R
74ABT374 ZAA3021B 74ABT374Z6B BAA 6R
74ABT374 ZAA3024B 74ABT3724Z6B BAA/D 6R
74ABT377 ZAA3021B 74ABT377Z6B BAA 6R
74ABT541 ZAA3021B 74ABT541Z6B BAA 6R
74ABT541 ZAB3021B 74ABT541Z6B BAA 6R
74ABT543 ZAA3021B 74ABT543Z6B BAA 6R
74ABT543 ZAA3024B 74ABT543Z6B BAA/D 6R
74ABT573 ZAA3021B 74ABT573Z6B BAA 6R
74ABT574 ZAA3021B 74ABT574Z6B BAA 6R
74ABT646 ZCA3021B 74ABT646Z6B BCA 6R
74ABT646 ZCA3024B 74ABT646Z6B BCA/D 6R
74ABT646 ZCB3021B 74ABT646Z6B BCB 6R
74ABT652 ZCA3021B 74ABT652Z6B BCA 6R
74ABT652 ZCB3021B 74ABT652Z6B BCB 6R
74ABT899 ZAB3021B 74ABT899Z6B BAB 6R
74ACQ240 TDA3021B 74ACQ240T6B BDA 8J
74ACQ240 TDD3025C 74ACQ240T5B CDD/E 8J
74ACQ241 TCA3021B 74ACQ241T6B BCA 8J
74ACQ244 TCA3021B 74ACQ244T6B BCA 8J
74ACQ244 TCA3023B 74ACQ244T6B BCA/C 8J
74ACQ244 TCD3025C 74ACQ244T5B CCD/E 8J
74ACQ245 TCA3021B 74ACQ245T6B BCA 8J
Page 12
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74ACQ245 TCD3025C 74ACQ245T5B CCD/E 8J
74ACQ373 TCA3021B 74ACQ373T6B BCA 8J
74ACQ374 TCA3021B 74ACQ374T6B BCA 8J
74ACQ374 TCA3025B 74ACQ374T6B BCA/E 8J
74ACQ374 TCD3025C 74ACQ374T5B CCD/E 8J
74ACQ573 TBA3021B 74ACQ573TBA BBA 8J
74ACQ574 TBA3021B 74ACQ574TBA BBA 8J
74ACTQ02 ZAA3021B 74ACTQ02Z6B BAA 8J
74ACTQ02 ZAD3025C 74ACTQ02Z5B CAD/E 8J
74ACTQ04 ZAA3021B 74ACTQ04Z6B BAA 8J
74ACTQ04 ZAA3025B 74ACTQ04Z6B BAA/E 8J
74ACTQ08 ZAA3021B 74ACTQ08Z6B BAA 8J
74ACTQ08 ZAD3025C 74ACTQ08Z5B CAD/E 8J
74ACTQ10 ZBA3021B 74ACTQ10Z6B BBA 8J
74ACTQ10 ZBA3025B 74ACTQ10Z6B BBA/E 8J
74ACTQ100 ZAD3021C 74ACTQ100Z5B CAD 5Y
74ACTQ14 ZAA3021B 74ACTQ14Z6B BAA 8J
74ACTQ14 ZAD3025C 74ACTQ14Z5B CAD/E 8J
74ACTQ16240 YDA3021B 74ACTQ16240Y6B BDA 8J
74ACTQ16244 ZCA3021B 74ACTQ16244Z6B BCA 8J
74ACTQ16244 ZCA3025B 74ACTQ16244Z6B BCA/E 8J
74ACTQ16245 ZCA3021B 74ACTQ16245Z6B BCA 8J
74ACTQ16245 ZCA3025B 74ACTQ16245Z6B BCA/E 8J
74ACTQ16373 ZBA3021B 74ACTQ16373Z6B BBA 8J
74ACTQ16374 ZBA3021B 74ACTQ16374Z6B BBA 8J
74ACTQ16374 ZBA3025B 74ACTQ16374Z6B BBA/E 8J
74ACTQ16540 ZCA3021B 74ACTQ16540Z6B BCA 8J
74ACTQ16541 ZBA3021B 74ACTQ16541Z6B BBA 8J
74ACTQ16646 ZDA3021B 74ACTQ16646Z6B BDA 8J
▇▇▇▇▇▇▇▇▇ TCA3021B 74ACTQ240T6B BCA 8J
74ACTQ241 TCA3021B 74ACTQ241T6B BCA 8J
74ACTQ244 TDA3021B 74ACTQ244T6B BDA 8J
74ACTQ244 TDA3025B 74ACTQ244T6B BDA/E 8J
74ACTQ244 TDD3025C 74ACTQ244T5B CDD/E 8J
74ACTQ245 TCA3021B 74ACTQ245T6B BCA 8J
74ACTQ245 TCA3025B 74ACTQ245T6B BCA/E 8J
▇▇▇▇▇▇▇▇▇ ZAA3021B 74ACTQ273Z6B BAA 8J
▇▇▇▇▇▇▇▇▇ ZAA3025B 74ACTQ273Z6B BAA/E 8J
74ACTQ283 ZAA3021B 74ACTQ283Z6B BAA 8J
74ACTQ32 ZAA3021B 74ACTQ32Z6B BAA 8J
74ACTQ32 ZAD3025C 74ACTQ32Z5B CAD/E 8J
74ACTQ373 TCA3021B 74ACTQ373T6B BCA 8J
74ACTQ373 TCD3025C 74ACTQ373T5B CCD/E 8J
74ACTQ374 TCA3021B 74ACTQ374T6B BCA 8J
74ACTQ374 TCD3025C 74ACTQ374T5B CCD/E 8J
74ACTQ377 ZBA3021B 74ACTQ377Z6B BBA 8J
74ACTQ533 TAA3021B 74ACTQ533T6B BAA 8J
74ACTQ541 YBA3021B 74ACTQ541Y6B BBA 8J
Page 13
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DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74ACTQ543 ZAA3021B 74ACTQ543Z6B BAA 8J
74ACTQ544 ZAA3021B 74ACTQ544Z6B BAA 8J
74ACTQ573 TAA3021B 74ACTQ573T6B BAA 8J
74ACTQ574 TBA3021B 74ACTQ574T6B BBA 8J
▇▇▇▇▇▇▇▇▇ YCA3021B 74ACTQ646Y6B BCA 8J
▇▇▇▇▇▇▇▇▇ YCA3025B 74ACTQ646Y6B BCA/E 8J
74ACTQ652 ZAA3021B 74ACTQ652Z6B BAA 8J
74ACTQ657 ZAA3021B 74ACTQ657Z6B BAA 8J
74ACTQ715 ZAA3021B 74ACTQ715Z6B BAA 8J
74ACTQ715A ZBA3021B 74ACTQ715AZ6B BBA 8J
74ACTQ821 ZAA3021B 74ACTQ821Z6B BAA 8J
74ACTQ827 ZAA3021B 74ACTQ827Z6B BAA 8J
74ACTQ841 ZAA3021B 74ACTQ841Z6B BAA 8J
74ACTQ899 ZAA3021B 74ACTQ899Z6B BAA 8J
74ACTQ899 ZAA3025B 74ACTQ899Z6B BAA/E 8J
74ACT00 TCF3021C 74ACT00T5B CCF 8C
74ACT00 TCF3023C 74ACT00T5B CCF/C 8C
74ACT00 TCF3024C 74ACT00T5B CCF/D 8C
74ACT109 WBF3021C 74ACT109W5B CBF 8C
74ACT109 WBF3025C 74ACT109W5B CBF/E 8C
74ACT112 XAF3021C 74ACT112X5B CAF 8C
74ACT112 XAF3024C 74ACT112X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ XDF3021C 74ACT138X5B CDF 8C
74ACT138 XDF3023C 74ACT138X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ XDF3024C 74ACT138X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ XDF3021C 74ACT139X5B CDF 8C
74ACT151 XBF3021C 74ACT151X5B CBF 8C
74ACT151 XBF3023C 74ACT151X5B CBF/C 8C
74ACT151 XBF3024C 74ACT151X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ YEF3021C 74ACT153Y5B CEF 8C
74ACT157 XDF3021C 74ACT157X5B CDF 8C
74ACT157 XDF3025C 74ACT157X5B CDF/E 8C
74ACT158 XDF3021C 74ACT158X5B CDF 8C
74ACT161 ZBF3021C 74ACT161Z5B CBF 8C
74ACT163 ZBF3021C 74ACT163Z5B CBF 8C
74ACT163 ZBF3025C 74ACT163Z5B CBF/E 8C
74ACT169 YAF3021C 74ACT169Y5B CAF 8C
74ACT169 YAF3025C 74ACT169Y5B CAF/E 8C
74ACT174 WBF3021C 74ACT174W5B CBF 8C
74ACT174 WBF3025C 74ACT174W5B CBF/E 8C
74ACT175 ZBF3021C 74ACT175Z5B CBF 8C
74ACT175 ZBF3025C 74ACT175Z5B CBF/E 8C
74ACT240 WEF3021C 74ACT240W5B CEF 8C
74ACT240 WEF3023C 74ACT240W5B CEF/C 8C
74ACT240 WEF3024C 74ACT240W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT241W5B CCF 8C
74ACT241 WEF3025C 74ACT241W5B CEF/E 8C
74ACT244 WEF3021C 74ACT244W5B CEF 8C
Page 14
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74ACT244 WEF3023C 74ACT244W5B CEF/C 8C
74ACT244 WEF3024C 74ACT244W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
▇▇▇▇▇▇▇▇ VEF3023C 74ACT245V5B CEF/C 8C
74ACT245 VEF3024C 74ACT245V5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT251X5B CBF 8C
74ACT253 YBF3021C 74ACT253Y5B CBF 8C
74ACT257 XBF3021C 74ACT257X5B CBF 8C
74ACT258 XBF3021C 74ACT258X5B CBF 8C
74ACT299 XBF3021C 74ACT299X5B CBF 8C
74ACT299 XBF3025C 74ACT299X5B CBF/E 8C
74ACT323 XBF3021C 74ACT323X5B CBF 8C
74ACT373 WEF3021C 74ACT373W5B CEF 8C
74ACT374 WEF3021C 74ACT374W5B CEF 8C
74ACT374 WEF3024C 74ACT374W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT377Z5B CBF 8C
74ACT377 ZBF3023C 74ACT377Z5B CBF/C 8C
74ACT377 ZBF3024C 74ACT377Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT399Z5B CBF 8C
74ACT520 XBF3021C 74ACT520X5B CBF 8C
74ACT521 XAD3025C 74ACT521X5B CAD/E 8C
74ACT521 XBF3021C 74ACT521X5B CBF 8C
74ACT534 WCF3021C 74ACT534W5B CCF 8C
74ACT563 XEF3021C 74ACT563X5B CEF 8C
74ACT564 XEF3021C 74ACT564X5B CEF 8C
74ACT573 XEF3021C 74ACT573X5B CEF 8C
74ACT573 XEF3025C 74ACT573X5B CEF/E 8C
74ACT574 XEF3021C 74ACT574X5B CEF 8C
74ACT574 XEF3023C 74ACT574X5B CEF/C 8C
74ACT574 XEF3024C 74ACT574X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT74W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT74W5B CCF 8C
74ACT74 WCF3023C 74ACT74W5B CCF/C 8C
74ACT74 WCF3024C 74ACT74W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74ACT818Z5B CCF 8C
74ACT821 ZCF3021C 74ACT821Z5B CCF 8C
74ACT823 ZCF3021C 74ACT823Z5B CCF 8C
74ACT825 ZCF3021C 74ACT825Z5B CCF 8C
74ACT825 ZCF3025C 74ACT825Z5B CCF/E 8C
74AC00 VCF3021C 74AC00V5B CCF 8C
74AC00 VCF3023C 74AC00V5B CCF/C 8C
74AC00 VCF3024C 74AC00V5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC02V5B CCF 8C
74AC02 VCF3023C 74AC02V5B CCF/C 8C
74AC02 VCF3024C 74AC02V5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC04Y5B CCF 8C
74AC04 YCF3023C 74AC04Y5B CCF/C 8C
74AC04 YCF3024C 74AC04Y5B CCF/D 8C
Page 15
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74AC05 YCF3021C 74AC05Y5B CCF 8C
74AC05 YCF3023C 74AC05Y5B CCF/C 8C
74AC05 YCF3024C 74AC05Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC08Y5B CCF 8C
74AC08 YCF3023C 74AC08Y5B CCF/C 8C
74AC08 YCF3024C 74AC08Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC10Y5B CCF 8C
74AC10 YCF3023C 74AC10Y5B CCF/C 8C
74AC10 YCF3024C 74AC10Y5B CCF/D 8C
74AC109 WEF3021C 74AC109W5B CEF 8C
74AC109 WEF3023C 74AC109W5B CEF/C 8C
74AC109 WEF3024C 74AC109W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC11Y5B CCF 8C
74AC11 YCF3023C 74AC11Y5B CCF/C 8C
74AC11 YCF3024C 74AC11Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC125X5B CBF/C 8C
74AC125 XBF3024C 74AC125X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3021C 74AC138X5B CDF 8C
74AC138 XDF3023C 74AC138X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3024C 74AC138X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3021C 74AC139X5B CDF 8C
74AC139 XDF3023C 74AC139X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3024C 74AC139X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC14Y5B CCF 8C
74AC14 YCF3023C 74AC14Y5B CCF/C 8C
74AC14 YCF3024C 74AC14Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC151Y5B CCF 8C
74AC151 YCF3023C 74AC151Y5B CCFC 8C
74AC151 YCF3024C 74AC151Y5B CCF/D 8C
74AC153 YDF3021C 74AC153Y5B CDF 8C
74AC153 YDF3023C 74AC153Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ YDF3024C 74AC153Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ YDF3021C 74AC157Y5B CDF 8C
74AC157 YDF3023C 74AC157Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ YDF3024C 74AC157Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ YDF3021C 74AC158Y5B CCF 8C
74AC161 ZBF3021C 74AC161Z5B CBF 8C
74AC161 ZBF3023C 74AC161Z5B CBF/C 8C
74AC161 ZBF3024C 74AC161Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC163Z5B CBF 8C
74AC163 ZBF3023C 74AC163Z5B CBF/C 8C
74AC163 ZBF3024C 74AC163Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC169Z5B CBF 8C
74AC169 ZBF3025C 74AC169Z5B CBF/E 8C
74AC174 XCF3021C 74AC174X5B CCF 8C
74AC174 XCF3023C 74AC174X5B CCF/C 8C
74AC174 XCF3024C 74AC174X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC175Z5B CBF 8C
Page 16
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74AC175 ZBF3025C 74AC175Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC191Z5B CBF 8C
74AC191 ZBF3023C 74AC191Z5B CBF/C 8C
74AC191 ZBF3024C 74AC191Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC20X5B CBF 8C
74AC20 XBF3023C 74AC20X5B CBF/C 8C
74AC20 XBF3024C 74AC20X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ WEF3021C 74AC240W5B CEF 8C
74AC240 WEF3023C 74AC240W5B CEF/C 8C
74AC240 WEF3024C 74AC240W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
▇▇▇▇▇▇▇ WEF3023C 74AC241W5B CEF/C 8C
74AC241 WEF3024C 74AC241W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
▇▇▇▇▇▇▇ WEF3023C 74AC244W5B CEF/C 8C
74AC244 WEF3024C 74AC244W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
▇▇▇▇▇▇▇ VFF3023C 74AC245V5B CFF/C 8C
74AC245 VFF3024C 74AC245V5B CFF/D 8C
74AC251 YBF3021C 74AC251Y5B CBF 8C
74AC251 YBF3025C 74AC251Y5B CBF/E 8C
74AC2525 ZCF3021C 74AC2525Z5B CCF 8C
74AC2525 ZCF3025C 74AC2525Z5B CCF/E 8C
74AC2526 ZBE3024C 74AC2526Z5B CBE/D 8C
74AC253 YCF3021C 74AC253Y5B CCF 8C
74AC253 YCF3025C 74AC253Y5B CCF/E 8C
74AC257 XEF3021C 74AC257X5B CEF 8C
74AC257 XEF3023C 74AC257X5B CEF/C 8C
74AC257 XEF3024C 74AC257X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC258X5B CDF 8C
74AC273 ZBF3021C 74AC273Z5B CBF 8C
74AC273 ZBF3023C 74AC273Z5B CBF/C 8C
74AC273 ZBF3024C 74AC273Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
74AC280 ZAF3025C 74AC280Z5B CAF/E 8C
74AC299 XDF3021C 74AC299X5B CDF 8C
74AC299 XDF3023C 74AC299X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3024C 74AC299X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC32Y5B CCF 8C
74AC32 YCF3023C 74AC32Y5B CCF/C 8C
74AC32 YCF3024C 74AC32Y5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC32Y5B CCF/E 8C
74AC373 WFF3021C 74AC373W5B CFF 8C
74AC373 WFF3023C 74AC373W5B CFF/C 8C
74AC373 WFF3024C 74AC373W5B CFF/D 8C
74AC374 WEF3021C 74AC374W5B CEF 8C
74AC374 WEF3023C 74AC374W5B CEF/C 8C
74AC374 WEF3024C 74AC374W5B ▇▇▇/▇ ▇▇
▇▇▇▇ ▇▇
▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇ Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74AC377 ZBF3021C 74AC377Z5B CBF 8C
74AC377 ZBF3023C 74AC377Z5B CBF/C 8C
74AC377 ZBF3024C 74AC377Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ WBF3021C 74AC378W5B CBF 8C
74AC379 ZBF3021C 74AC399Z5B CBF 8C
74AC520 XDF3021C 74AC520X5B CDF 8C
74AC520 XDF3023C 74AC520X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3024C 74AC520X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3021C 74AC521X5B CDF 8C
74AC521 XDF3023C 74AC521X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3024C 74AC521X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XDF3025C 74AC521X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC540Z5B CBF 8C
74AC540 ZBF3025C 74AC540Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC541Z5B CBF 8C
74AC541 ZBF3023C 74AC541Z5B CBF/C 8C
74AC541 ZBF3024C 74AC541Z5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ XEF3021C 74AC574X5B CEF 8C
74AC574 XEF3023C 74AC574X5B CEF/C 8C
74AC574 XEF3024C 74AC574X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC646X5B CDF 8C
74AC646 XDF3023C 74AC646X5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇
74AC74 WEF3021C 74AC74W5B CEF 8C
74AC74 WEF3023C 74AC74W5B CEF/C 8C
74AC74 WEF3024C 74AC74W5B ▇▇▇/▇ ▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 74AC821Z5B CCF 8C
74AC86 YCF3021C 74AC86Y5B CCF 8C
74AC86 YCF3023C 74AC86Y5B CCF/C 8C
74AC86 YCF3024C 74AC86Y5B CCF/D 8C
74FCT240 YAA3021B 74FCT240Y6B BAA 8J
74FCT240 YAD3025C 74FCT240Y5B CAD/E 8J
74FCT241 ZAD3021C 74FCT241Z5B CAD 8J
74FCT244 ZAA3021B 74FCT244Z6B BAA 8J
74FCT244 ZAA3025B 74FCT244Z6B BAA/E 8J
74FCT245 TDA3021B 74FCT245T6B BDA 8J
74FCT273 ZAA3021B 74FCT27376B BAA 8J
74FCT373 ZAA3021B 74FCT37376B BAA 8J
74FCT374 ZAA3021B 74FCT374Z6B BAA 8J
74FCT377 ZAA3021B 74FCT377Z6B BAA 8J
74FCT533 ZAA3021B 74FCT533Z6B BAA 8J
74FCT540 ZAA3021B 74FCT540Z6B BAA 8J
74FCT541 ZAA3021B 74FCT541Z6B BAA 8J
74FCT573 ZAA3021B 74FCT573Z6B BAA 8J
74FCT574 ZAA3021B 74FCT574Z6B BAA 8J
74FCT574 ZAAA3025B 74FCT574Z6B BAA/E 8J
74F1061 ZAG3021T 74F1061Z4B TAG 8M
74F109 XGG3021T 74F109X4B TGG 8M
Page 18
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74F109 XGG3024T 74F109X4B TGG/D 8M
74F109 XGG3025T 74F109X4B TGG/E 8M
74F109 XHG3023T 74F109X4B THG/C 8M
74F109 XHG3024T 74F109X4B THG/H 8M
74F132 ZAB3025T 74F132Z4B TAB/E 8M
74F175 UFG3025T 74F175U4B TFG/E 8M
74F240 THG3025T 74F240T4B THG/E 8M
74F243 TKG3025T 74F243T4B TKG/E 8M
74F374 SQG3023T 74F374S4B TQG/C 8M
74F374 SQG3024T 74F374S4B TQG/D 8M
74F374 SQG3025T 74F374S4B TQG/E 8M
74F38 ZBD3024T 74F38Z4B TBD/D 8M
74LS02 ZAB3023T 74LS02Z4B TAB/C 70
74LS02 ZAB3024T 74LS02Z4B TAB/D 70
74LS02 ZAB3025T 74LS02Z4B TAB/E 70
74LS109 ZCB3024T 74LS109Z4B TCB/D 70
74LS14 YAB3025T 74LS14Y4B TAB/E 70
74LS157 TDB3023T 74LS157T4B TDB/C 70
74LS161 UCB3025T 74LS161U4B TCB/E 70
74LS161A UCB3025T 74LS161AU4B TCB/E 70
74LS174 YBB3024T 74LS174Y4B TBB/D 70
74LS240 UCC3025T 74LS240U4B TCC/E 70
74LS245 ZAC3025T 74LS245Z4B TAC/E 70
74LS257A TCB3024T 74LS257AT4B TCB/D 70
74LS273 ZAB3025T 74LS273Z4B TAB/E 70
74LS283 YCB3025T 74LS283Y4B TCB/E 70
74LS367A XBB3024T 74LS367AX4B TBB/D 70
74LS367A XBB3025T 74LS367AX4B TBB/E 70
74LS367A XBB3025T 74LS367AX4B TBB/E 70
74LS377 ZBB3025T 74LS377Z4B TBB/E 70
74LS502 XBB3025T 74LS502X4B TBB/E 70
74LS83 YBB3025T 74LS83Y4B TBB/E 70
74LS85 YBC3024T 74LS85Y4B ▇▇▇/▇ ▇▇
▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇ ▇▇▇ 8T
7400 SFB3023T 7400S4B TFB/C 8T
7400 XAB3021T 7400X4B TAB 8T
7400 XAB3023T 7400X4B TAB/C 8T
7404 UDB3021T 7404U4B TDB 8T
7404 UDB3023T 7404U4B TDB/C 8T
7408 VBB3021T 7408V4B TBB 8T
7408 WAB3023T 7408V4B TAB/C 8T
7409 VCB3021T 7409V4B TCB 8T
7410 WAB3021T 7410W4B TAB 8T
74121 XCB3021T 74121X4B TCB 8T
74121 XCB3023T 74121X4B TCB/C 8T
74125 ZBB3021T 74125Z4B TBB 8T
74151A XCB3021T 74151AX4B TCB 8T
74153 ZBB3021T 74153Z4B TBB 8T
Page 19
▇▇▇▇▇▇▇▇▇ Wafer Sales to NSC
--------------------------------------------------------------------------------
DIE NSID DIE SPEC WAFER NSID WAFER SPEC AFM
--------------------------------------------------------------------------------
74153 ZBB3023T 74153Z4B TBB/C 8T
74161 YCB3021T 74161Y4B TCB 8T
74174 ZBB3021T 74174Z4B TBB 8T
74174 ZBB3023T 74174Z4B TBB/C 8T
7420 XHB3025T 7420X4B ▇▇▇/▇ ▇▇
▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇ ▇▇▇ 8T
7430 WBB3021T 7430W4B TBB 8T
7430 YAB3023T 7430W4B TAB/C 8T
7432 YBB3021T 7432Y4B TBB 8T
7437 YDB3021T 7437Y4B TDB 8T
7437 YDB3023T 7437Y4B TDB/C 8T
7440 WCB3021T 7440W4B TCB 8T
7442 WDB3021T 7442W4B TDB 8T
7442 WDB3023T 7442W4B TDB/C 8T
7475 WCB3021T 7475W4B TCB 8T
7486 YEB3021T 7486Y4B TEB 8T
7486 YEB3023T 7486Y4B TEB/C 8T
7490 SBB3021T 7490S4B TBB 8T
93L14 XBC3021T 93L14X4B ▇▇▇ ▇▇
▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 93L24U4B TCC 8T
9309 WBB3021T 9309W4B TBB 8T
9309 WBB3023T 9309W4B TBB/C 8T
9314 YAB3021T 9314Y4B TAB 8T
9322 YCB3021T 9322Y4B TCB 8T
9322 YCB3023T 9322Y4B TCB/C 8T
9328 VAB3021T 9328V4B TAB 8T
936 SBB3021T 936S4B TBB 8T
936 SBB3023T 936S4B TBB/C 8T
946 RAB3021T 946R4B TAB 8T
946 RAB3023T 946R4B TAB/C 8T
96L02 RAB3021T 96L02Z4B TAC 8T
96L02 ZAC3025T 96L02Z4B TAC/E 8T
9601 ZYC3021T 9601Z4B TYC 8T
9601 ZYC3023T 9601Z4B TYC/C 8T
9602 YAC3021T 9602Y4B TAC 8T
9602 YAC3023T 9602Y4B TAC/C 8T
962 SAB3021T 962S4B TAB 8T
Page 20
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95 74ABT16501C MWC 5574ABT16501 ZAA3026B 5074ABT16501Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ YAA3026B 5074ABT241Y6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ YAA3026B 5074ABT241Y6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ YAB3026B 5074ABT241Y6B BAB
95 74ACQ241 MDA 5574ACQ241 TCA3021B ▇▇ ▇▇ ▇▇▇▇▇▇▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ TCA3026B 5074ACQ241T6B BCA
95 74ACQ241 MWC 5574ACQ241 TCD3026C 5074ACQ241T5B CCD
95 74ACQ574 MDA 5574ACQ574 TBA3021B NO 50 COMPONENT
95 74ACTQ00 MDA 5574ACTQ00 ZAA3026B 5074ACTQ00Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ MDC 5574ACTQ00 ZAA3026B 5074ACTQ00Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ MDA 5574ACTQ04 ZAA3026B 5074ACTQ04Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ MDC 5574ACTQ04 ZAA3026B 5074ACTQ04Z6B BAA
95 74ACTQ04 MWA 5574ACTQ04 ZAA3026B 5074ACTQ04Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ZAA3021B 5074ACTQ04Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ZAD3021C 5074ACTQ04Z5B CAD
95 74ACTQ08 MDA 5574ACTQ08 ZAA3026B 5074ACTQ08Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ MDC 5574ACTQ08 ZAA3021B 5074ACTQ08Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ MDC ▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ACTQ08Z5B CAD
95 74ACTQ08 MWA 5574ACTQ08 ZAA3021B 5074ACTQ08Z6B BAA
95 74ACTQ16543 MDA 5574ACTQ16543 ZBA3026B 5074ACTQ16543Z6B BBA
95 74ACTQ16543 MDA 5574ACTQ16543 ZBD3026C 5074ACTQ16543Z5B CBD
95 ▇▇▇▇▇▇▇▇▇ MDC 5574ACTQ273 ZBA3026B 5074ACTQ273Z6B BBA
95 ▇▇▇▇▇▇▇▇▇ MDC 5574ACTQ273 ZBD3026C 5074ACTQ273Z5B CBD
95 74ACTQ563 MDA 55WD563EAA 5074ACTQ563T5B CAA
95 74ACTQ74 MWC 5574ACTQ74 ZAA3026B 5074ACTQ74Z6B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ZAD3026C 5074ACTQ74Z5B CAD
95 74ACTQ823 MWC 5574ACTQ823 ZAA3026B 5074ACTQ823Z6B BAA
95 74ACTQ823 MWC 5574ACTQ823 ZAD3026C 5074ACTQ823Z5B CAD
95 74ACT00 MDA 5574ACT00 TCF3026C 5074ACT00T5B CCF
95 74ACT00 MDC 5574ACT00 TCF3021C 5074ACT00T5B CCF
95 74ACT04 MDA 5574ACT04 XBF3026C 5074ACT04X5B CBF
95 74ACT04 MDC 5574ACT04 XBF3026C 5074ACT04X5B CBF
95 74ACT04 MWA 5574ACT04 XBF3026C 5074ACT04X5B CBF
95 74ACT08 MDA 5574ACT08 XBF3026C 5074ACT08X5B CBF
95 74ACT08 MDC 5574ACT08 XBF3026C 5074ACT08X5B CBF
95 74ACT08 MWA 5574ACT08 XBF3026C 5074ACT08X5B CBF
95 74ACT109 MWC 5574ACT109 WBF3021C 5074ACT109W5B CBF
95 74ACT138 MWC 5574ACT138 XDF3021C 5074ACT138X5B CDF
95 74ACT138 MWC 5574ACT138 XDF3026C 5074ACT138X5B CDF
95 74ACT157 MWC 55WJ157EAE 5074ACT157X5B CAE
95 74ACT157 MWC 5574ACT157 XDF3021C 5074ACT157X5B CDF
95 74ACT158 MWC 5574ACT158 WEF3026C 5074ACT158W5B CEF
Page 1
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95 74ACT161MWC 55WJ161EAE 5074ACT161Z5B CAE
95 74ACT161 MWC 5574ACT161 ZBF3021C 5074ACT161Z5B CBF
95 74ACT163 MWC 55WJ163EAE NO 50 COMPONENT
95 74ACT163MWC 5574ACT163 ZBF3021C 5074ACT163Z5B CBF
95 74ACT244 MWC 55WJ24EEE 5074ACT244W5B CEE
95 74ACT244 MWC 5574ACT244 WCF3021C 5074ACT244WB CCF
95 74ACT244 MWC 5574ACT244 WEF3021C 5074ACT244W5B CEF
95 74ACT245 MDC 5574ACT245 TFF3026C 5074ACT245T5B CFF
95 74ACT245 MDC 5574ACT 245 VDF3021C 5074ACT245V5B CDF
95 74ACT245 MDC 5574ACT245 VEF3026C 5074ACT245V5B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ TFF3026C 5074ACT245T5B CFF
95 74ACT245 MWC 5574ACT245 VDF3026C 5074ACT245V5B CDF
95 74ACT245 MWC 5574ACT245 VEF3026C 5074ACT245V5B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ 5074ACT257X5B CBE
95 74ACT257 MWC 5574ACT257 XBF3021C 5074ACT257X5B CBF
95 74ACT257 MWC 5574ACT257 XBF3026C 5074ACT257X5B CBF
95 74ACT299 MWC 55WJ299EAE 5074ACT299X5B CAE
95 74ACT299 MWC 5574ACT299 XBF3021C 5074ACT299X5B CBF
95 74ACT323MWC 55WJ323EAE 5074ACT323X5B CAE
95 74ACT323 MWC 5574ACT323 XBF3021C 5074ACT323X5B CBF
95 74ACT3301 MDC 55CGS3301 ZCF3021C 50CGS3301Z5B CCF
95 74ACT3301 MDC 55CGS3301 ZCF3026C 50CGS3301Z5B CCF
95 74ACT3301 MDC 55WJ3301ECE 5074ACT3301Z5B CCE
95 74ACT3301 MDCT 55CGS3301 ZCF3026C 50CGS3301Z5B CCF
95 74ACT3301 MWC 55CGS3301 ZCF3026C 50CGS3301Z5B CCF
95 74ACT3301 MWC 55WJ3301ECE 5074ACT3301Z5B CCE
95 74ACT373 MWC 5574ACT373 WEF3026C 5074ACT373W5B CEF
95 74ACT374 MWC 55WD374ECA 5074ACTQ374T5B CCA
95 74ACT374 MWC 5574ACTQ374 TCD3021C 5074ACTQ374T5B CCD
95 74ACT377 MWC 55WJ377EAE 5074ACT377Z5B CAE
95 74ACT377 MWC 5574ACT377 ZBF3021C 5074ACT377Z5B CBF
95 74ACT521 MWC 5574ACT521 XBF3021C 5074ACT521X5B CBF
95 74ACT564 MWC 5574ACT564 XEF3021C 5074ACT564X5B CEF
95 74ACT573 MDA 5574ACT573 XEF3021C 5074ACT573X5B CEF
95 74ACT573 MDC 5574ACT573 XEF3026C 5074ACT573X5B CEF
95 74ACT573 MWA 5574ACT573 XEF3021C 5074ACT573X5B CEF
95 74ACT573 MWC 55WJ573EEE 5074ACT573X5B CEE
95 74ACT573 MWC 5574ACT575 XEF3021C 5074ACT573X5B CEF
95 74ACT574 MWC 55WJ574EEE 5074ACT574X5B CEE
95 74ACT574 MWC 5574ACT574 XEF3021C 5074ACT574X5B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ XEF3026C 5074ACT574X5B CEF
95 74AC00 MDC 5574AC00 VCF3026C 5074AC00V5B CCF
Page 2
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95 74AC00 MDCT 5574AC00 VCF3026C 5074AC00V5B CCF
95 74AC00 MWC 5574AC00 VCF3026C 5074AC00V5B CCF
95 74AC02 MDC 5574AC02 VCF3026C 5074AC02V5B CCF
95 74AC02 MDCT 5574AC02 VCF3026C 5074AC02V5B CCF
95 74AC04 MDC 5574AC04 YCF3021C 5074AC04Y5B CCF
95 74AC04 MWC 5574AC04 YCF3021C 5074AC04Y5B CCF
95 74AC08 MDC 5574AC08 YCF3026C 5074AC08Y5B CCF
95 74AC125 MDC 5574AC125 XBF3026C 5074AC125X5B CBF
95 74AC138 MWC 5574AC138 XDF3021C 5074AC138X5B CDF
95 74AC138 MWC 5574AC138 XDF3026C 5074AC138X5B CDF
95 74AC139 MDC 5574AC138 XDF3021C 5074AC138X5B CDF
95 74AC139 MDCT 5574AC139 XDF3026C 5074AC138X5B CDF
95 74AC139 MWC 5574AC139 XDF3021C 5074AC139X5B CDF
95 74AC14 MWC 5574AC14 YCF3021C 5074AC14Y5B CCF
95 74AC151 MWC 55WZ151EAE 5074AC151Y5B CAE
95 74AC151 MWC 55WZ151LAC NO 50 COMPONENT
95 74AC151 MWC 5574AC151 YCF3021C 5074AC151Y5B CCF
95 74AC20 MWC 55WZ020EBE 5074AC20X5B CBE
95 74AC20 MWC 5574AC20 XBF3021C 5074AC20X5B CBF
95 74AC20 MWC 5574AC20 XBF3026C 5074AC20X5B CBF
95 74AC244 MWC 5574AC244 WCF3021C 5074AC244W5B CCF
95 74AC244 MWC 5574AC244 WEF3021C 5074AC244W5B CEF
95 74AC245 MWC 5574AC245 TGF3026C 5074AC245T5B CGF
95 74AC251 MWC 55WZ251LAC NO 50 COMPONENT
95 74AC251 MWC 5574AC251 YBF3021C 5074AC251Y5B CBF
95 74AC257 MWC 55WZ257ECD NO 50 COMPONENT
95 74AC257 MWC 55WZ257ECE 5074AC257X5B CCE
95 74AC257 MWC 5574AC257 XEF3021C 5074AC257X5B CEF
95 74AC273 MWC 5574AC273 ZBF3021C 5074AC273Z5B CBF
95 74AC273 MWC 5574AC273 ZBF3026C 5074AC273Z5B CBF
95 74AC299 MWC 552Z299ECD NO ▇▇ ▇▇▇▇▇▇▇▇▇
▇▇ ▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ NO 50 COMPONENT
95 74AC299 MWC 5574AC299 XDF3021C 5074AC299X5B CDF
95 74AC32 MDC 5574AC32 YCF3026C 5074AC32Y5B CCF
95 74AC32 MWC 5574AC32 YCF3026C 5074AC32Y5B CCF
95 74AC521 MWC 5574AC521 XDF3021C 5074AC521X5B CDF
95 74AC541 MWC 5574AC541 ZBF3021C 5074AC541Z5B CBF
95 74AC574 MWC 55WZ574EDE 5074AC574X5B CDE
95 74AC574 MWC 5574AC574 XEF3021C 5074AC574X5B CEF
95 74AC574 MWC 5574AC574 XEF3026C 5074AC574X5B ▇▇▇
▇▇ ▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇ XDF3026C 5074AC648X5B CDF
95 74AC74 MDC 5574AC74 WEF3026C 5074AC74W5B CEF
Page 3
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95 74AC74 MDCT 5574AC74 WEF3026C 5074AC74W5B CEF
95 74AC74 MWC 5574AC74 WEF3021C 5074AC74W5B CEF
95 74AC86 MWC 5574AC86 YCF3026C 5074AC86Y5B CCF
95 74F00 MWC 55WM000BGE 5074F00W4B TGE
95 74F00DC 55WM000BGE 5074F00W4B TGE
95 74F00DC 55WM000BGE 5074F00W4B TGE
95 74F02 MWC 55WM002BEE 5074F02X4B TEE
95 74F02DC 55WM002BEE 5074F02X4B TEE
95 74F02DC 55WM002BEE 5074F02X4B TEE
95 74F04MWA 55WM004GJE NO 50 COMPONENT
95 74F04 MWC 55WM004XHE 5074F04U4B THE
95 74F04DC 55WM004BHE 5074F04U4B THE
95 74F04DC 55WM004BHE 5074F04U4B THE
95 74F08 MWC 552M008BGE 5074F08W4B TGE
95 74F08DC 552M008BGE 5074F08W4B TGE
95 74F08DC 552M008BGE 5074F08W4B TGE
95 74F10DC 55WM010BCE 5074F10X4B TCE
95 74F109DC 5574F109 XGG3021T 5074F109X4B TGG
95 74F11 MWC 55WM011BCE 5074F11X4B TCE
95 74F11DC 55WM011BCE 5074F11X4B TCE
95 74F11DC 55WM011BCE 5074F11X4B TCE
95 74F112 MWC 55WM112XGG 5074F112W4B TGG
95 74F125 MWC 55WM125XBD 5074F125Z4B TBD
95 74F125 MWC 55WM125YBA 5074F125Z5B CBA
95 74F148 MWC 5574F148 ZDG3026T 5074F148Z4B TDG
95 74F151A MWC 55WM151BHG 5074F151AW4B THG
95 74F161ADC 55WM161BNG 5074F161AT4B TNG
95 74F163ADC 55WM163BMG 5074F163AT4B TMG
95 74F164A MWC 55WM164BGG 5074FF164AY4B TGG
95 74F194 MWC 55WM194XEE 5074F194Y4B TEE
95 74F194 DC 55WM194BEE 5074F194Y4B TEE
95 74F194 DC 55WM194BEE 5074F194Y4B TEE
95 74F20 MWC 55WM020XCE 5074F20X4B TCE
95 74F20DC 55WM020BCE 5074F20X4B TCE
95 74F20DC 55WM020BCE 5074F20X4B TCE
95 74F219 MWC 55WM219XDG 5074F219Y4B TDG
95 74F240DC 55WM240BHG 5074F240T4B THG
95 74F244 MWC 55WM244BKG 5074F244T4B TKG
95 74F245 MWC 55WM245BNG 5074F245T4B TNG
95 74F251ADC 55WM251BHG 5074F251AW4B THG
95 74F251ADC 55WM251BHG 5074F251AW4B THG
95 74F253DC 55WM253BKG 5074F253U4B TKG
Page 4
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95 74F257ADC 55WM257BKG 5074F257AW4B TKG
95 74F257ADC 55WM257BKG 5074F257AW4B TKG
95 74F280DC 55WM280BKG 5074F280U4B TKG
95 74F280DC 55WM280BKG 5074F280U4B ▇▇▇
▇▇ ▇▇▇▇▇ ▇▇▇ 55WM032BJE 5074F32U4B ▇▇▇
▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇
▇▇ 74F373 MWC 55WM373BPG 5074F373T4B TPG
95 74F373DC 55WM373BPG 5074F373T4B TPG
95 74F373DC 55WM373BPG 5074F373T4B TPG
95 74F374 MWC 55WM374BQG 5074F374S4B TQG
95 74F374DC 55WM374BQG 5074F374S4B TQG
95 74F374DC 55WM374BQG 5074F374S4B TQG
95 74F381 MWC 55WM381DGG NO 50 COMPONENT
95 74F381 MWC 55WM3810GG NO 50 COMPONENT
95 74F401 MWC 55W401XCD 5074F401Z4B TCD
95 74F413 MDC 55W13BHD 5074F413Z4B THD
95 74F413 MDC 55W413XHD 5074F413Z4B THD
95 74F521 MWC 55WM521BFG 5074F521Y4B TFG
95 74F521 DC 55WM521BFG 5074F521Y4B TFG
95 74F524 MWC 55WM524XFG 5074F524Z4B TFG
95 74F525 MWC 55WM525XDG NO 50 COMPONENT
95 74F539 MWC 55WM539XGG NO 50 COMPONENT
95 74F64DC 55WM064BCE 5074F64X4B TCE
95 74F74DC 55WM074BHG 5074F74X4B THG
95 74F74DC 55WM074BHG 5074F74X4B ▇▇▇
▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ LAA3026J NO 50 COMPONENT
95 74VHCT373 MWC 5574VHCT373 ZAA3026C 5074VHCT373Z5B CAA
95 74VHCT374 MWC 5574VHCT374 ZAA3026C 5074VHCT374Z5B CAA
95 74VHC00 MDC 5574VHC00 LCA3006L 5074VHC00L6B LCA
95 74VHC00 MDC 5574VHC00 L1A3006T NO 50 COMPONENT
95 74VHC00 MWC 5574VHC00 LCA3006L 5074VHC00L6B LCA
95 74VHC00 MWC 5574VHC00 L1A3006T NO 50 COMPONENT
95 74VHC02 MDC 5574VHCO2 LBA3006L 5074VHC02L6B LBA
95 74VHC02 MDC 5574VHCO2 L1A3006T ▇▇ ▇▇ ▇▇▇▇▇▇▇▇▇
▇▇ ▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074VHC02L6B LBA
95 74VHC02 MWC 5574VHCO2 L1A3006T NO 50 COMPONENT
95 74VHC86 MDC 5574VHC86 L1A3006T NO 50 COMPONENT
95 74VHC86 MWC 5574VHC86 L1A3006T NO 50 COMPONENT
95MM74C04 MWC 55MMS54C04 D102041 NO 50 COMPONENT
95MM74C10 MWC 55MMS54C10 C102041 NO 50 COMPONENT
95MM74C10 MWC 55MMS74C10 C102042 5074C10C4B MAA
95MM74C14 MWC 5574C14 DAA3026T 5074C14D4B TAA
Page 5
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95MM74C161 MWC 55MMS54C161 G102041 NO 50 COMPONENT
95MM74C374 MWC 55MMS54C374 E102041 NO 50 COMPONENT
95MM74C86 MWC 55MMS54C86 C102041 NO 50 COMPONENT
95MM74C905 MWC 55MMS54C905 C102041 NO 50 COMPONENT
95MM74C905 MWC 5574C905 CAA3026T 5074C905C4B TAA
95MM74C923 MWC 55MMS54C923 E202041 NO 50 COMPONENT
95MM74HCT00 MWC 55MM74HCTF00 GBA3026C 5074HCTF00G5B CBA
95MM74HCT05 MWC 55MM74HCT05 FCA3026T 5074HCT05F4B TCA
95MM74HCT138 MDC 55MM74HCT138 CBA3026T 5074HCT138C4B TBA
95MM74HCT164 MWC 55MM74HCT164 CBA3026T 5074HCT164C4B TBA
95MM74HCT245 MWC 55MM74HCTF245 EDA3026C ▇▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇
95MM74HCT574 MDC 55MM74HC9574 DAA3026T 5074HC9574D4B TAA
95MM74HCT574 MWC 55MM74HC9574 DAA3026T 5074HC9574D4B TAA
95MM74HCU04 MWC 55MM74HCFU04 EBA3026C 5074HCFU04E5B CBA
95MM74HC00 MDC 55MM74HCF00 GCA3026C 5074HCF00G5B CCA
95MM74HC00MWC 55MM74HCF00 GCA3026C 5074HCF00G5B CCA
95MM74HC02 MDC 55MM74HC02 DCA3026T 5074HC02D4B TCA
95MM74HC02 MWC 55MM74HC02 DCA3026T 5074HC02D4B TCA
95MM74HC04 MDC 55MM74HCB4 DDA3026T 5074HCB4D4B TDA
95MM74HC04 MDC 55MM74HCF04 ECA3026C 5074HCF04E5B CCA
95MM74HC04 MWC 55MM74HCF04 ECA3026C 5074HCF04E5B CCA
95MM74HC123A MWC 55MM74HC123 CBA3021T 5074HC123C4B TBA
95MM74HC123A MWC 55MM74HC123 CBA3026T 5074HC123C4B TBA
95MM74HC125 MDC 55MM74HC125 CBA3026T 5074HC125C4B TBA
95MM74HC125 MDCT 55MM74HC125 CBA3026T 5074HC125C4B TBA
95MM74HC132 MDC 55MM74HC132 CCA3026T 5074HC132C4B TCA
95MM74HC132 MDCT 55MM74HC132 CCA3026T 5074HC132C4B TCA
95MM74HC14 MWC 55MM74HCF14 EDA3026C 5074HCF14E5B CDA
95MM74HC14 MWC 55MM74HC14 DEA3026T 5074HC14D4B TEA
95MM74HC157 MDC 55MM74HC157 CBA3026T 5074HC157C4B TBA
95MM74HC157 MWC 55MM74HC157 CBA3026T 5074HC157C4B TBA
95MM74HC161 MDC 55MM74HC161 DBA3026T 5074HC161D4B TBA
95MM74HC175 MDC 55MM74HC175 DBA3026T 5074HC175D4B TBA
95MM74HC221 MWC 55MM74HC221 EBA3026T 5074HC221E4B TBA
95MM74HC244 MWC 55MM74HCF244 EDA3026C 5074HCF244E5B CDA
95MM74HC245A MWC 55MM74HCF245 EDA3026C 5074HCF245E5B CDA
95MM74HC32 MDC 55MM74HC32 DCA3026T 5074HC32D4B TCA
95MM74HC32 MWC 55MM74HC32 DCA3026T 5074HC32D4B TCA
95MM74HC373 MDC 55MM74HCF373 FCA3026C 5074HCF373F5B CCA
95MM74HC373 MWC 55MM74HCF373 FCA3026C 5074HCF373F5B CCA
95MM74HC374 MWC 55MM74HCF374 FCA3026C 5074HCF374F5B CCA
95MM74HC393 MWC 55MM74HC393 EBA3026T 5074HC393E4B TBA
Page 6
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95MM74HC4040 MWC 55MM74HC4040 CBA3026T 5074HC4040C4B TBA
95MM74HC4050 MDC 55MM74HC4050 DBA3026T 5074HC4050D4B TBA
95MM74HC4050 MWC 55MM74HC4050 DBA3026T 5074HC4050D4B TBA
95MM74HC4051 MWC 55MM74HCF4051 CCA3026C 5074HCF4051C5B CCA
95MM47HC4052 MDC 55MM74HCF4052 CCA3026C 5074HCF4052C5B CAA
95MM47HC4052 MWC 55MM74HCF4052 CCA3026C 5074HCF4052C5B CAA
95MM74HC4066 MDC 55MM74HC4066 CBA3026T 5074HC4066C4B TBA
95MM74HC4066 MWC 55MM74HC4066 CBA3026T 5074HC4066C4B TBA
95MM74HC4316 MWC 55MM74HC4316 CBA3026T 5074HC4316C4B TBA
95MM74HC4538 MDC 55MM74HC4538 DBA3026T 5074HC4538D4B TBA
95MM74HC4538 MDCT 55MM74HC4538 DBA3026T 5074HC4538D4B TBA
95MM74HC574 MDC 55MM74HC574 CBA3026T 5074HC574C4B TBA
95MM74HC595 MWC 55MM74HC595 CBA3026T 5074HC595C4B TBA
95MM74HC688 MWC 55MM74HC688 CBA3026T 5074HC688C4B TBA
95MM74HC74A MWC 55MM74HCF74 EDA3026C 5074HCF74E5B CDA
95MM74HC86 MDC 55MM74HC86 DBA3026T 5074HC86D4B TBA
95MM74HC86 MWC 55MM74HC86 DBA3026T 5074HC86D4B TBA
95MM74HC942 MWC 55MM74HC942 HBA3026T 5074HC942H4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ CAA
95DM74ALS240A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ALS240B5B CAA
95DM74ALS244A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ALS244B5B CAA
95DM74ALS245A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ALS245D5B CAA
95DM74ALS540A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ALS540A5B CAA
95DM74ALS574A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ 5074ALS574A5B CAA
95DM74ALS74A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ CAA
95DM74AS20 MWC 55DMS54AS20 18 5074AS20A6B JAA
95DM74AS20 MWC 55DMS74AS20 18 5074AS20A6B JAA
95DM74LS00 MWC 55DMS74LSR00 D1C30261 5074LSR00D4B TCC
95DM74LS02 MWC 55WL002XCB 5074LS02Y4B TCB
95DM74LS03 MWC 55DMS74LSR03 D1C30261 5074LSR03D4B TCC
95DM74LS04 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR04C4B TCC
95DM74LS05 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 NO 50 COMPONENT
95DM74LS08 55DMS74LSR08 D1C30261 5074LSR08D4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ D1C30261 5074LSR112D4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR123C4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR125C4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR126C4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR132B4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR139B4B TCC
95DM74LS14 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR14B4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ E1C30261 5074LSR151E4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR157C4B TCC
Page 7
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC ▇▇▇▇▇ ▇▇▇▇/▇▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR158C4B TCC
95DM74LS161A MWC 55WL161BCB 5074LS161AU4B TCB
95DM74LS163A MWC 55WL163BDB 5074LS163AU4B TDB
95DM74LS164 MWC 55DMS74LSR164 B1C30261 5074LSR164B4B TCC
95DM74LS165 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR169C4B TCC
95DM74LS175 MWC 55DMS74LSR175 C1C30261 5074LSR175C4B TBC
95DM74LS181 MWC 55WL181BDB 5074LS181Y4B TDB
95DM74LS240 MWC 55WL240BCC NO 50 COMPONENT
95DM74LS244 MWC 55WL244BCC 5074LS244U4B TCC
95DM74LS244 MWC 55WL244XCC 5074LS244U4B TCC
95DM74LS245 MWC 55DMS74LSR245 AEC3026T 5074LS4245A4B TEC
95DM74LS251 MWC 55DMS74LSR251 E1C30261 5074LSR251E4B TCC
95DM74LS256 MWC 55WL256XDB 5074LS256Z4B TDB
95DM74LS257B MWC 55DMS74LSR257 C1C30261 5074LSR257C4B TCC
95DM74LS259 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇
▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ D1C30261 5074LSR03D4B TCC
95DM74LS260 MWC 55WL260BBB 5074LS260Z4B TBB
95DM74LS273 MWC 55WL273XCB 5074LS273Y4B TCB
95DM74LS30 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR30C4B TCC
95DM74LS30 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR30C5B TCC
95DM74LS32 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ D1C30261 5074LSR32D4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 5074LSR367C4B TBC
95DM74LS373 MWC 55WL373XBB 5074LS373Y4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇ ▇▇ ▇▇▇▇▇▇▇▇▇
▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR38B4B TCC
95DM74LS67A MWC 55DMS74LSR367 C1C30261 5074LSR367C4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR670B4B TCC
95DM74LS74A ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ C1C30261 ▇▇ ▇▇ ▇▇▇▇▇▇▇▇▇
▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ E1C30261 5074LSR75E4B ▇▇▇
▇▇▇▇▇▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ B1C30261 5074LSR86B4B TCC
95DM74S00 MWC 55DMS74S00 E1B30261 5074S00E4B TBB
95DM74S02 MWC 55DMS74S02 C1A30261 NO 50 COMPONENT
95DM74S02 MWC 55DMS74S02 C1B30261 5074S02C4B TBB
95DM74S08 MWC 55DMS74S08 B1B30261 5074S08B4B TBB
95DM74S10 MWC 55DMS74S10 C1B30261 T074S10C4B TAB
95DM74S138 MWC 55DMS74S138 C1B30261 5074S138C4B TBB
95DM74S151 MWC 55DMS74S151 E1A30261 NO 50 COMPONENT
95DM74S151 MWC 55DMS74S151 E1B30261 5074S151E4B TBB
95DM74S153 MWC 55DMS74S153 E1B30261 NO 50 COMPONENT
95DM74S175 MWC 55DMS74S175 C1B30261 5074S175C4B TBB
95DM74S20 MWC 55DMS74S20 C1B30261 5074S20C4B TAB
Page 8
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95DM74S244 MWC 55DMS74S244 D1A30261 NO 50 COMPONENT
95DM74S244 MWC 55DMS74S244 D1B30261 5074S244D4B TAB
95DM74S257 MWC 55DMS74S257 C1B30261 NO 50 COMPONENT
95DM74S40 MWC 55DMS74S40 D1B30261 5074S40D4B TAB
95DM74S74 MWC 55DMS74S74 E1B30261 5074S74E4B TAB
95DM7400 MWC 557400 SFB3021T 507400S4B TFB
95DM7402 MWC 55WN002XCA NO 50 COMPONENT
95DM7403 MWC 55WN003XFA NO 50 COMPONENT
95DM7403 MWC 55WN0031FA 507426S4B TFA
95DM7404 MWC 557404 UDB3021T 507404U4B TDB
95DM7404 MWC 557404 UDB3026T 507404U4B TDB
95DM7406 MWC 557407 WDB3026T 507406W4B TDB
95DM7407 MWC 557407 WCB3026T 507407W4B TCB
95DM7407 MWC 557407 WDB3026T 507407W4G TDB
95DM74121 MWC 55WN121BCA NO 50 COMPONENT
95DM74121 MWC 5574121 XCB3021T 5074121X4B TCB
95DM74123 MWC 55WN123XEA NO 50 COMPONENT
95DM74164 MWC 55WN164XDA NO 50 COMPONENT
95DM74164 MWC 5574164 WDB3026T 5074164W4B TDB
95DM74165 MWC 55WN1651CA NO 50 COMPONENT
95DM7426 MWC 557403 SFB3026T 507403S4B TFB
95DM7438 MWC 557438 YDB3026T 507438Y4B TDB
95DM7473 MWC 55WN073XDA NO 50 COMPONENT
95DM7493A MWC 557493 SBB3026T 507493S4B TBB
95SCANPSC100F MDA 55SCANPSC100 ZAA3021B 50SCANPSC100Z6B BAA
95SCANPSC100F MDA 55SCANPSC100 ZAD3021C 50SCANPSC100Z5B CAD
95SCANPSC110F MDA 55SCANPSC110 ZDA3021B 50SCANPSC110Z6B BDA
95SCANPSC110F MDA 55SCANPSC110 ZDD3021C 50SCANPSC110Z5B CDD
95SCAN18245T MDA 55SCAN18245 ZBA3021B 50SCAN18245Z6B BBA
95SCAN18245T MDA 55SCAN18245 ZBD3021C 50SCAN18245Z5B CBD
95SCAN18373T MDA 55SCAN18373 YDA3026B 50SCAN18373Y6B BDA
95SCAN18373T MDA 55SCAN18373 YDD3026C 50SCAN18373Y5B CDD
95SCAN18374T MDA 55SCAN18374 YDA3026B 50SCAN18374Y6B BDA
95SCAN18374T MDA 55SCAN18374 YDD3026C 50SCAN18374Y5B CDD
95SCAN18540T MDA 55SCAN18540 YDA3026B 50SCAN18540Y6B BDA
95SCAN18540T MDA 55SCAN18540 YDD3026C 50SCAN18540Y5B CDD
95SCAN18541T MDA 55SCAN18541 YDA3026B 50SCAN18541Y6B BDA
95SCAN18541T MDA 55SCAN18541 YDD3026C 50SCAN18541Y5B CDD
95100301 MWC 55WF301RBB NO 50 COMPONENT
95100301 MWC 55100301 ZBC3021T 50100301Z4B TBC
95100301 MWC 55100301 ZBC3026T 50100301Z4B TBC
95100301 MWC 55100301 ZBC3026T 50100301Z4B TBC
Page 9
Exhibit B
Commercial Wafer and Die Sales
Level 95 Die NSID Die SPEC Wafer NSID/SPEC
95100301 ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ NO 50 COMPONENT
95100301 MW8 55100301 ZBC3021T 50100301Z4B TBC
95100302 MW8 55100302 ZBC3021T 50100302Z4B TBC
95100304 MW8 55100304 YDC3021T 50100304Y4B TDC
95100307 MW8 55100307 YCC3021T 50100307Y4B TCC
95100311 MWC 55WF311XAB 50100311Y4B TAB
95100311 MWC 55100311 YAC3026T 50100311Y4B TAC
95100314 MW8 55100314 ZBC3021T 50100314Z4B TBC
95100319 MDC 55WF319XCB 50100319Z4B TCB
95100319 MDC 55100319 ZCC3026T 50100319Z4B TCC
95100319 MDC 55100319 ZCC3026T 50100319Z4B TCC/E
95100322 MW8 55100322 ZAC3021T 50100322Z4B TAC
95100323 MWC 55WF323XAB 50100323Z4B TAB
95100323 MWC 55100323 ZAC3026T 50100323Z4B TAC
95100324 MW8 55100324 ZAC3021T 50100324Z4B TAC
95100325 MWC 55100325 ZBC3026T 50100325Z4B TBC
95100328 MW8 55100328 ZBC3021T 50100328Z4B TBC
95100331 MW8 55100331 YCC3021T 50100331Y4B TCC
95100336 MW8 55100336 YEC3021T 50100336Y4B TEC
95100341 MW8 55100341 ZCC3021T 50100341Z4B TCC
95100343 MW8 55100343 ZBC3021T 50100343Z4B TBC
95100351 MWC 55100351 YEC3021T 50100351Y4B TEC
95100363 MW8 55100363 ZAC3021T 50100363Z4B TAC
95100390 MDA 55100390 YDC3026T 50100390Y4B TDC
95100390 MDC 55100390 YDC3021T 50100390Y4B TDC
95100395 MWC 55100395 ZBC3026T 50100395Z4B TBC
9511C91 MD8 55WKC918A NO 50 COMPONENT
9512S MWC 5512S NO 50 COMPONENT
EXHIBIT F
WAFER ACCEPTANCE CRITERIA
▇▇▇▇▇▇▇▇▇ Electrical Test Acceptance Method:
Acceptance of ▇▇▇▇▇▇▇▇▇ Wafers for shipment to National shall be determined per
mutually agreed upon electrical parameter test distribution performance with
standard test die. For the
Page 10
West Jordan, Utah fabs, all wafers will be subjected to the Acceptance criteria
specified in West Jordan specifications: ▇▇▇-▇▇▇▇, ▇▇-▇▇▇▇ and TS-3021. For the
South Portland, Maine fabs, all Wafers will be tested to the electrical
specifications, by Process, listed in this Exhibit, with the acceptance methods
stated below.
South Portland, Maine Wafer Acceptance and Wafer Sort:
1. Each lot will be sampled at PCM test prior to Wafer sort. The following
minimum sample size will be tested and the Wafer will be rejected if the
stated number, or more, of test sites on that Wafer fails a specified
electrical parameter;
Wafer Size # Wafers per lot # Sites per Wafer Reject on # Sites
Tested Failing
6 inch 5 5 3
5 inch 5 5 3
4 inch 3 5 3
2. In the event that one or more Wafers in the lot sample fail the above
criteria, then 100% testing of the remaining Wafers in the lot will be
performed and the above acceptance criteria applied to each Wafer.
3. Electrical Test parameter distributions will be made available to National
on a monthly basis.
▇▇▇▇▇▇▇▇▇ Wafer Fabrication and National Wafer Sort:
1. A ten (10) Wafer lot sample will be tested to the applicable PCM
specification prior to shipment to National Five (5) test sites per wafer
will be sampled as the basis for electrical acceptance, and three (3) of
those sites must pass the PCM test parameters. In the event that one or
more sample wafers fails the PCM test, 100% testing of residual wafers
will be performed and all Wafers which pass the PCM will be shipped to
National.
2. Individual PCM specifications (by Process) are defined in Exhibit F.
3. Electrical Test parameter distributions will be made available on a
monthly basis.
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "ANALOG"
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
Bjt NPN BETA Q2Beta 50 150 250 Gain lc=1mA,
Vce-5.0V
Bjt NPN CBO Q2BVcbo 50 >50 N/A Volts lf=10uA
Bjt NPN EBO Q2BVebo 6.5 7.0 7.5 Volts lf-10uA
Bjt NPN CEO Q2LVceo 15 >15 N/A Volts lf=10uA
Bjt Col to Col BV_iso 50 >50 N/A Volts lf=5uA
--------------------------------------------------------------------------------------------------------------
Diffusion N Buried BL_RES 75 110 150 Ohms lf=10mA
Layer
Diffusion Narrow Base N_RES 800 1000 1800 Ohms lf=1mA
Diffusion Base BASERHO 100 125 150 Ohms/sq lf=45.3mA
Diffusion Emitter N+RHO 3.0 4.5 6.0 Ohms/sq lf=45.3mA
--------------------------------------------------------------------------------------------------------------
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "BUS"
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
Bjt NPN BETA Q1Beta 20 100 225 Gain lc=1mA,
Vce=5.0V
Bjt NPN CBO Q1BVcbo 20 >20 N/A Volts lf=10uA
Bjt NPN EBO Q1BVebo 6.7 8.0 8.3 Volts lf=10uA
Bjt NPN CEO Q1LVceo 8.0 >8 N/A Volts lf=10uA
Bjt Col to Col BViso 7.5 >7.5 N/A Volts lf=5uA
--------------------------------------------------------------------------------------------------------------
Diffusion N Buried BLres1 30 45 100 Ohms lf=10mA
Layer
Diffusion Narrow Base Narbase 1900 2500 2900 Ohms lf=1mA
Diffusion Emitter EM-res 5.0 10 40 Ohms lf=10mA
--------------------------------------------------------------------------------------------------------------
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "CGS"
Table of Parameters not available on January 2, 1997.
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "DTCOMM
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
Bjt NPN BETA Q3Beta 80 180 250 Gain lc=10mA,
Vce=2.50V
--------------------------------------------------------------------------------------------------------------
Bjt NPN CBO Q3BVcbo 38 >38 N/A Volts lf=100uA
--------------------------------------------------------------------------------------------------------------
Bjt NPN EBO Q2BVebo 5.5 6.3 7.0 Volts lf=100uA
--------------------------------------------------------------------------------------------------------------
Bjt NPN CEO Q3LVceo 5.0 >5 N/A Volts lf=5uA
--------------------------------------------------------------------------------------------------------------
Bjt Col to Col BV_ISO 15 >15 N/A Volts lf=100uA
--------------------------------------------------------------------------------------------------------------
Diffusion N Buried R_BL 15 23 30 Ohms lf=50mA
Layer
--------------------------------------------------------------------------------------------------------------
Diffusion Narrow Base R_NB 1650 2100 2500 Ohms lf=100uA
--------------------------------------------------------------------------------------------------------------
Diffusion Emitter R_EM 100 150 200 Ohms lf=10mA
--------------------------------------------------------------------------------------------------------------
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "DTP"
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
Bjt CEO Q1LVCEO 7 15 30 Volts
--------------------------------------------------------------------------------------------------------------
Bjt CBO Q1BVCBO 30 45 80 Volts
--------------------------------------------------------------------------------------------------------------
Bjt EBO Q1BVEBO 6 6.8 7.5 Volts
--------------------------------------------------------------------------------------------------------------
Bjt Beta Q1Beta 75 150 350 Gain
--------------------------------------------------------------------------------------------------------------
Bjt Schottky Q4VFD 0.26 0.32 0.4 Volts
--------------------------------------------------------------------------------------------------------------
Bjt Schottky ▇▇▇▇▇ ▇▇ ▇▇ ▇▇ Volts
==============================================================================================================
Diffusion Base BaseRho 160 190 220 Ohms/sq.
--------------------------------------------------------------------------------------------------------------
Diffusion Collector BL-RES 75 110 135 Ohms
--------------------------------------------------------------------------------------------------------------
Diffusion Resistor IMP-RES 13K 16K 19K Ohms
--------------------------------------------------------------------------------------------------------------
Diffusion Emitter N+RHO 4.25 5 5.75 Ohms/sq.
--------------------------------------------------------------------------------------------------------------
Diffusion Resistor N-RES 1250 1525 1800 Ohms
--------------------------------------------------------------------------------------------------------------
Diffusion Sink SINK-RES 6 8.5 11 Ohms
--------------------------------------------------------------------------------------------------------------
▇▇▇▇▇▇▇▇▇ Maine Fab 4100: "PTP"
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
Bjt NPN Beta Q3BETA 15 50 100 Gain lc=1mA, Vce=5.0V
--------------------------------------------------------------------------------------------------------------
Bjt NPN CBO Q3BVCBO 10 35 100 Volts le=10uA
--------------------------------------------------------------------------------------------------------------
Bjt NPN EBO Q3BVEBO 6.5 7 7.5 Volts le=10uA
--------------------------------------------------------------------------------------------------------------
Bjt NPN CEO Q3LVCEO 7 35 60 Volts lc=10uA
--------------------------------------------------------------------------------------------------------------
Bjt Col to Col BV_ISO 30 70 100 Volts l=5uA
==============================================================================================================
Diffusion N Buried BL_RES 90 115 140 Ohms l=10umA
Layer
--------------------------------------------------------------------------------------------------------------
Diffusion Sink (Plug) SINK_RES 2 12 30 Ohms 1=10mA
--------------------------------------------------------------------------------------------------------------
Diffusion Emitter N+RHO 3.5 6 7 Ohms/sq l=4.53mA
--------------------------------------------------------------------------------------------------------------
Diffusion Base BASERHO 170 195 220 Ohms/sq l=4.53mA
--------------------------------------------------------------------------------------------------------------
Diffusion Narrow Base N_RES 1250 1625 2000 Ohms l=1mA
--------------------------------------------------------------------------------------------------------------
▇▇▇▇▇▇▇▇▇ Maine Fab 6001: ABTC10
--------------------------------------------------------------------------------------------------------------
Category Parameter Analog Device Size Lower Spec Target Upper Spec Unit Measurement
Method
--------------------------------------------------------------------------------------------------------------
MOS Vtn VTON1 0.4 0.65 0.9 Volts
--------------------------------------------------------------------------------------------------------------
MOS Vtp ▇▇▇▇▇ -▇.▇▇ -▇.▇▇ -▇.▇▇ Volts
--------------------------------------------------------------------------------------------------------------
MOS Idsat IDSSP1 -0.014 -0.01 -0.005 mA
--------------------------------------------------------------------------------------------------------------
MOS Idsat IDSSN1 0.015 0.022 0.029 mA
--------------------------------------------------------------------------------------------------------------
MOS Bvdn BVDSSN1 7 13 19 Volts
==============================================================================================================
Bjt CEO OUTLVCEO 4 5.7 20 Volts
--------------------------------------------------------------------------------------------------------------
Bjt CBO OUTBVCBO 14 19 25 Volts
--------------------------------------------------------------------------------------------------------------
Bjt EBO OUTBVEBO 3 4.5 5.5 Volts
--------------------------------------------------------------------------------------------------------------
Bjt Beta OUTBETA 65 115 200 Volts
--------------------------------------------------------------------------------------------------------------
Bjt Schottky VCSCHOTTKY 0.2 0.34 0.475 Volts
==============================================================================================================
Diffusion Base BASERES 2300 3200 3700 Ohms
--------------------------------------------------------------------------------------------------------------
Diffusion Buried Layer BLRHO 18 28 38 Ohms/sq.
--------------------------------------------------------------------------------------------------------------
Diffusion Sink ▇▇▇▇▇▇▇ ▇▇ ▇▇ ▇▇ ▇▇▇▇/▇▇.
==============================================================================================================
Via Contact CONTM1M2 0 0.04 0.075 Ohms/Link
--------------------------------------------------------------------------------------------------------------
Contact N+ Contact CONTMN+ 10 30 60 Ohms/Link
--------------------------------------------------------------------------------------------------------------
Contact P+ Contact CONTMP+ 10 25 40 Ohms/Link
--------------------------------------------------------------------------------------------------------------
Metal Rs Metal 1 M1CONT 0 85 200 Ohms
==============================================================================================================
Metal Rs Metal 2 M2CONTWC 0 23 70 Ohms
--------------------------------------------------------------------------------------------------------------
Yd Gate Oxide BVGOXN -20 -15.5 -12.5 Volts
--------------------------------------------------------------------------------------------------------------
Yd Gate Oxide BVGOXP 11.5 13.5 20 Volts
--------------------------------------------------------------------------------------------------------------
Exhibit G
Military Aerospace Wafer Pricing
Level S Wafer Cost(1)
4" Wafers [CONFIDENTIAL
INFORMATION OMITTED
AND FILED SEPARATELY
WITH THE SECURITIES
AND EXCHANGE
COMMISSION]
5" Wafers [CONFIDENTIAL
INFORMATION OMITTED
AND FILED SEPARATELY
WITH THE SECURITIES
AND EXCHANGE
COMMISSION]
Level S Lot Set Up Charges
for Both ▇▇▇▇▇▇▇▇▇ and National Products
4" 5"
-- --
2 SEM wafers @ standard cost + Level S requirements [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION]
1.5 hr/wafer X 2 for SEM analysis @ [CONFIDENTIAL INFORMATION [CONFIDENTIAL INFORMATION OMITTED AND
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION] /hr EXCHANGE COMMISSION]
2 hr wafer lot acceptance @ [CONFIDENTIAL INFORMATION OMITTED [CONFIDENTIAL INFORMATION OMITTED AND
AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE FILED SEPARATELY WITH THE SECURITIES AND
COMMISSION] /hr EXCHANGE COMMISSION]
----------
(1) Does not include wafer probe cost, which is an additional $29 per hour
above listed wafer price.
Sub Total [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION]
Level S equipment set-up/testing [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION]
Total Level S Adder/Lot [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION]
Wafer Probe Cost
Wafer probe cost using a [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION] tester is [CONFIDENTIAL INFORMATION
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION] per
hour.
EXHIBIT K
CYCLE TIME AND EXPEDITED PROCESSING
Fiscal Year 1998 Wafer Processing Cycle Times (in Days)
[CONFIDENTIAL INFORMATION OMITTED AND FILED
SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION]
Standard Hot Lot Super Hot
Process cycle time cycle time cycle time
------- ---------- ---------- ----------
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED
SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION]
Standard Hot Lot Super Hot
Process cycle time cycle time cycle time
------- ---------- ---------- ----------
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]
Charges for Expedited Processing
National will be charged a premium per hot lot started as follows:
for Hot Lots, the premium will be [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES
AND EXCHANGE COMMISSION] per lot
for Super Hot Lots, the premium will be
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] per lot
The standard lot sizes of 12 or 24 Wafers will apply.
Foundry Agreement
Mil Aero: Demand on FSC
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION]