Exhibit 10.30
ARTICLES OF COLLABORATION
FOR
PLASTIC PACKAGING CONSORTIUM
This Agreement is entered into by and among the following parties:
National Semiconductor Corporation
Amoco Chemical Company
Leading Technologies, Inc.
Delco Electronics Corporation
Dexter Corporation
Integrated Packaging Assembly Corporation (IPAC)
▇▇▇▇ Corporation
▇▇▇▇▇▇▇ Electronic Materials, Inc.
▇▇▇▇▇▇▇▇, Inc.
WHEREAS the Parties have complementary research interests and wish to form a
cooperative research consortium (hereinafter Consortium) to engage in
cooperative research in the area of low cost plastic encapsulated microcircuits
to better understand package ruggedization, thermal dissipation and high density
plastic packaging including, without limitation, prototype fabrication for the
experimental demonstration of such technology; (hereinafter scope of research);
and WHEREAS the Parties anticipate receiving funding from a government agency;
and WHEREAS the Parties wish to be bound together in the Consortium by these
Articles of Collaboration (Articles hereinafter) in the form of a Joint Research
and Development Venture as such term is defined in the National Cooperative
Research Act of 1984 through a Cooperative Agreement as such term is defined in
31 U.S.C. 6305" and WHEREAS terms not otherwise defined in this Agreement shall
have the meaning set forth in the ARPA Agreement between the Consortium and the
Advanced Research Projects Agency (ARPA).
Hereinafter the following definitions apply:
Each of National Semiconductor Corporation, Amoco Chemical Company, Leading
Technologies Inc., Delco Electronics Corporation, Dexter Corporation,
integrated Packaging Assembly Corporation (IPAC), ▇▇▇▇ Corporation, ▇▇▇▇▇▇▇
Electronic Materials, Inc., ▇▇▇▇▇▇▇▇, Inc. once having executed these Articles
is a Consortium Member.
Each Consortium Member is a Party. All Consortium Members are collectively
identified as Parties.
Each of Sandia National Laboratories and SEMATECH are Advisors to the
Consortium. Sandia will be a subcontractor to National
Semiconductor Corporation. Due to legal constraints placed upon these
entities, they are unable to sign these Articles of Collaboration, but agree
to support the Consortium's goals and objectives. As Advisors to the program,
these entities shall not have any voting authority within the Consortium.
Each U.S. governmental department or agency thereof providing funding to the
Consortium as a whole is in an Agency during the period such funding is
available or being used.
NOW THEREFORE, the Parties agree as follows:
1 (a) The Parties hereby establish a joint research and development venture
to engage in a collaborative research effort of limited duration to gain further
knowledge and understanding of such technologies for the purposes and within the
Scope of Research set forth herein.
(b) Subject to the availability of Agency funding, the Parties
individually agree to expend best reasonable efforts to achieve the goals
assigned to them as defined in the Program Plan (including milestone payment
plan), attached hereto and incorporated herein. By execution of this Agreement
each Party authorizes the Consortium Management Committee (CMC) or its designee
to enter into with an Agency a single Other Transaction (hereinafter Funding
Agreement) as defined in 1 0 U.S. C. 2371 and consistent with the Project
Statement to fund the Consortium. In the course of the Consortium, the
Consortium Administrator shall disburse to each Party the funds associated with
the completion of each milestone established in the Funding Agreement upon
receipt of appropriate documentation from the Party. Milestone payments to each
Party will be made within 15 working days after receipt of a certification of
milestone completion, assuming such funds are available from the Agency and
unless the CMC shall direct the Consortium Administrator to the contrary in
accordance with Article 4.
(c) This Agreement shall not preclude any Party from developing at its own
expense technology based upon Consortium technology but apart from the Project
Statement, provided that the proprietary information and other rights of other
Parties hereunder are not violated. The developing Party under this
subparagraph reserves all intellectual property rights in its so developed
technology.
(d) The Parties agree to empower the Consortium Administrator to
officially execute the ARPA-Consortium Agreement No. MDA972-95-3-0024 on behalf
of all of the individual Consortium Member companies. This authority is granted
only after each individual company has had adequate time to review the Agreement
and have
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provided written authorization to the Consortium Administrator to execute the
document on behalf of their respective company.
2. (a) Subject to the terms and conditions stated herein, the Consortium
will be managed and governed by the Consortium Management Committee. The CMC is
empowered to determine all policy, business, financial, legal, and technical
issues of the Consortium. The CMC is authorized to represent-the Consortium in
reporting progress, in negotiating, and in transacting business with respect to
the scope of the Agreement with ARPA or other persons. Specifically and without
limitation, except as otherwise provided in this Agreement, the CMC is empowered
to redirect the research, redefine the tasks and goals of the Parties, and to
proportionally change to all Parties the amount of funding provided by an Agency
concerning the program.
(b) Each Consortium Member will appoint one voting representative to
comprise the CMC, who shall have the power to designate an alternate voting
representative from time to time. The CMC will meet in regular committee
meetings, approximately every three months, at locations chosen on a rotating
basis by the CMC or as is mutually acceptable among the Consortium Members.
Each representative may be accompanied by other employees of the Party or
Agency, including without limitation financial, business, and legal personnel.
Each Party and Agency will limit its attendees to three, with the exception of
National Semiconductor employees providing overall support to the Consortium.
Other parties may attend the committee meetings at the invitation of the CMC,
but only after agreeing in writing to appropriate disclosure limitations. The
CMC may exclude from a portion of the non-technical committee meetings the
representatives of the Agencies or other third persons.
(c) The National Semiconductor representative to the CMC will act as
chairperson of the committee meetings, keep the other members of the CMC
informed of developments, and deliver notification regarding meetings of the
CMC. Any Consortium Member may call a special meeting of the CMC.
(d) Subject to CMC approval National Semiconductor will appoint a
Consortium Administrator to the Consortium who will attend all CMC meetings and
who will provide a single point of contact to the Contracting Officers of
Parties and the Agencies or their designees.
(e) National Semiconductor will ensure that minutes of the meetings of the
CMC are recorded and distributed to the Consortium Members and, as requested, to
ARPA.
(f) Each Consortium Member will be responsible for hosting
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both CMC meetings and Technical Management Committee (TMC) meetings on a
rotating basis. The schedule for hosting meetings will be published by the
Consortium Administrator within 30 days after execution of these Articles.
3. (a) A simple majority of CMC members will constitute a quorum at a CMC
meeting. The CMC will attempt to reach a consensus decision of all
representatives present at each committee meeting. However, if demanded by one
Consortium Member, a decision may be determined by a vote of the CMC after the
concerns of affected Parties and Agencies present at the meeting are heard.
Except as provided in sections 4, 5 and 7, a majority vote of the voting
representatives present rules.
(b) Any Consortium Member company may request the convening of the CMC.
Requests must be made directly to the Chairman of the CMC. A request to convene
an unscheduled meeting of the CMC must allow at least 15 working days to convene
the meeting.
(c) CMC meetings will be held quarterly. Locations for the meetings will
be rotated among the Consortium Members. Each Consortium Member is responsible
for providing the necessary facilities to host a CMC meeting. The Consortium
Administrator will notify all member companies of the date and location of the
regularly scheduled CMC meetings at least 30 days in advance. If an unscheduled
CMC meeting is called by any of the member companies, the Consortium
Administrator will endeavor to provide as much notice as practical.
4. A supermajority vote, as required, is a vote of all but one of the
Consortium Members. For purposes of a supermajority vote, the vote of a
representative of a Consortium Member either not attending the CMC meeting or
not participating will be counted as an opposing vote. With a supermajority
vote, the CMC is empowered to:
(a) Revise the Articles of Collaboration-,
(b) Revise or terminate any funding agreements with an Agency;
(c) Delegate authority of CMC to the Consortium Administrator or
Consortium Chairman;
(d) Substantially change or eliminate any Agency funding allocated to any
Party as technically and/or financially justified by the CMC. A Party
experiencing any reduction in Agency funding may pro rata reduce its
internally funded participation in the Consortium;
(e) Act on any issue declared reasonably, in writing by a Consortium
Member, to be of critical importance;
(f) Appoint and remove the Consortium Administrator or any other officer;
and
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(g) Approve Annual Program Plan for Funds and adjusting funding to all
parties subject to section 6.
5. (a) The CMC by unanimous vote may admit a new member to the Consortium.
The membership of a new member shall become effective and such new member shall
become a Party upon its execution of this Agreement. The CMC will consider new
members on a non-discriminatory basis, but only if the new Member's technical
contributions can be justified and only on relatively comparable financial terms
as the existing Parties, recognizing the risk of their original investment. The
consideration will include without limitation whether the new member would bring
to the Consortium technology otherwise unavailable on the time scale of the
program or would allow the technology to be developed by members of the
Consortium to be applied to new markets. Other conditions of its admission are
that the entry of the new member would not substantially adversely affect the
intellectual property rights of the original Consortium Members, that the added
effort would not substantially change the ongoing Consortium program, and that
the new Member could participate without diminishing Agency funding provided to
existing Members. Notwithstanding the above, the representatives of the CMC may
consider any reasonable factor in addition to those above, and their decision on
admitting new Members is discretionary and final.
(b) If a member is unable to attend a CMC or TMC meeting, the member may
vote via written proxy. The proxy vote must be received by the Chairman of the
CMC at least one (1) working day prior to the CMC or TMC meeting. The proxy
vote must be in writing from the CMC voting representative of the Party or his
designee. A FAX or EMAIL proxy is acceptable.
(c) If a member is absent from a CMC or TMC meeting, that Party's vote
will be counted as a negative vote on all issues brought forth to a vote.
6. A Party may reject an expansion of its scope of responsibility within the
Consortium, a modification of its rights in Intellectual Property, or a
reduction of its Agency funding not accompanied by a reduction in the scope of
its responsibilities.
7. (a) Any Party may resign at will from the Consortium after it has provided
written notice to the CMC 30 days in advance of the effective date of the
resignation. During the 30 day period, the resigning Party shall wind down its
effort in an orderly fashion. The CMC shall reasonably determine whether to
provide any further Agency funding to the resigning member after its notice of
resignation.
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(b) The resigning Party shall make a reasonable best effort to transfer
its portion of Consortium work to other members of the Consortium, this
reasonable best effort extending beyond the 30 day period if reasonably required
and at the resigning Party's own cost (which shall not exceed the payment due to
the resigning party at the next payable milestone payment date following the
date notice of resignation is given). The resigning Party must provide a
reasonable, royalty-bearing, non-exclusive, perpetual, sub-licensable license in
its Consortium Intellectual Property as defined in Paragraph 8 (b), restricted
to the field of use defined in the SOW to the Party or Parties designated by the
CMC to replace the resigning Party in performing its assigned tasks.
(c) The CMC may, by unanimous vote, except for the resigning Party, force
a Party to resign if that Party is not adequately performing the tasks assigned
to it or is not reasonably cooperating with the Consortium and its Parties. For
purposes of the unanimous vote, the representative of a Consortium Member not
attending the CMC meeting or not voting will defeat the unanimity, except for
the resigning party. The CMC will provide at least 30 days notice to the
offending Party to resolve nonperformance issues prior to the issue coming to a
vote before the CMC. All appropriate efforts and communications will be made
prior to forcing a Party to resign. All of the requirements and
responsibilities of a resigning party described in 7(a) and 7(b) apply to a
party forced to resign.
8. (a) As to intellectual property made in the Consortium, each Party
retains title to inventions, technical data rights, and other intellectual
property made solely by its employees in performance of the Consortium work.
Inventions or technical data jointly developed by employees of more than one
Party are jointly owned by the respective employing Parties.
(b) Consortium Intellectual Property is that intellectual property
developed by and in the course of identified tasks assigned to and performed by
the member Party, whether performed under Agency funding or funding provided by
the Party as agreed to in the Funding Agreement and/or in this Agreement for
cost sharing. The identified tasks shall be those tasks i) agreed to by the
Party in a separate agreement between the Consortium and ARPA, ii) agreed to by
the Party with other Parties of the Consortium, and (iii) assigned to the Party
by the CMC subject to the restrictions of section 6. However, Consortium
Intellectual Property does not include (1) background: (2) concurrently
developed intellectual property that is independently funded apart from
Consortium: or (3) continuation (improvement or subsequent) intellectual
property (including so-defined processes) of the respective Party(ies). All
Parties agree to perform the tasks assigned to them in the attached Statement of
Work, to which the CMC is empowered to redirect these
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efforts.
(c) All Parties neither receive from nor are required to grant to the
other Consortium Members any royalty-free licenses in its Consortium
intellectual property, but all Parties agree to grant to any other Consortium
Member a reasonable, royaltybearing license for the sole purpose of continuing
the Consortium. The cost of this license will not be counted towards the
overall cost of the Plastic Packaging Consortium program. Further, all Parties
will license its Consortium intellectual property to other Parties only under
commercially reasonable terms. Consortium members Amoco, Dexter and ▇▇▇▇▇▇▇,
being direct competitors, are limited to reasonable licenses among themselves
only for the purpose of aiding the Consortium program. They are not required to
license each other for general molding compound commercial usage.
(d) In the event of a dispute concerning the reasonableness of a proposed
royalty resulting from Consortium Intellectual Property, all Parties agree to
submit to binding arbitration to determine the reasonableness of the proposed
royalty agreement between Parties. All Parties agree that the arbitrator's
decision will be binding.
(e) One Party may exercise march-in rights against the Consortium
Intellectual Property of another Party to the extent specified in this
paragraph. Marchin rights become available if the Party originally holding
title to the Consortium Intellectual Property has failed to adequately
commercialize within a reasonable time, the technology of the Consortium related
to that Consortium Intellectual Property. The reasonable time shall be no less
than 3 years from the date these Articles are terminated. Any Consortium Member
may exercise march-in rights upon any Member either on the Member's behalf or on
the behalf of its licensees irrespective of whether an Agency has exercised
similar march-in rights. The title holder shall be entitled to commercially
reasonable licensing fees and a reasonable license agreement from the Member
exercising march-in rights.
(f) Each Party is subject to the licensing and march-in rights of
subparagraph (e), but the Consortium may not bind any Party without its approval
for the conveyance of its intellectual property to any Agency.
(g) The Consortium favors, subject to Agency requirements, an open-
publication policy to promote commercial acceptance of the technologies
developed for plastic packaged integrated circuits, but simultaneously desires
to protect the proprietary information of the Parties developed both within and
without the Consortium. However, successful commercialization of aspects of the
technology
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by some of the Parties may depend on the proprietary nature of the information.
Each Party will individually decide whether to publish its own technical data or
maintain it as proprietary. However, in the performance of the Consortium,
proprietary information, software or hardware of one Party may necessarily be
disclosed to or used by another Party. A non-disclosure agreement separately
executed by all the Members, attached as Exhibit 1, is incorporated herein by
reference, and the Members will assure that their employees participating in the
Consortium conform to its terms.
(h) Notwithstanding the separately executed non-disclosure agreement
attached hereto, when one Party's Consortium related work depends on the
proprietary information of another Party, the technical data may be published to
the extent that such data: (i) is required for a description of the Member's
work, (ii) does not disclose proprietary materials, hardware, formulations or
software, and (iii) relates primarily to system or material performance and
characteristics. However, publication of proprietary technical data may be
delayed by its owner for a time period of not more than six (6) months enabling
the filing of patent applications. In the event that a Party's work depends on
proprietary materials, hardware, software or processes developed by another
Party in tasks outside the Consortium, the system performance and
characteristics may be published, but only after the delay period for patent
filings. In no event shall such disclosure in any way reveal the proprietary
information of the implementation necessary to achieve the system performance.
(i) Each Party will select its inventions for which it applies for
patents. The Party is further responsible for prosecuting those applications
and maintaining the resulting patents, both in the U.S. and in foreign
countries. A Party jointly owning an invention may file a patent application
for it and the co-owning Parties will cooperate in the filing and prosecution.
(j) Any patent application filed claiming a Consortium invention covered
by an agreement with an Agency shall include a Government interest paragraph.
The Party will report a patent application claiming any Consortium Intellectual
Property to the CMC within one month and provide to the CMC a copy of the
application, without claims. The CMC will report the invention in a timely
manner including a short abstract to all Parties and to any Agency funding the
invention, as required by the Agency. Any Member or the funding Agency may
obtain copies of the application from the CMC. However, any such patent
information shall be covered by the nondisclosure agreement and shall not be
disclosed by the Agency to non-governmental personnel until the respective
patents have been issued. All Parties agree to retain and maintain
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in good condition until five (5) years after completion or termination of these
Articles, all data necessary to achieve practical application of all Consortium
and/or Government funded inventions.
(k) The funding agreement for the Project Statement may provide for the
government to obtain certain rights in the Consortium Intellectual Property.
Each Party agrees to such government rights in its Consortium Intellectual
Property subject to the Agreement between the Consortium and ARPA. The
intellectual property rights provided to the Consortium by Agreement shall be
provided in turn to the Parties according to the terms of this Agreement. The
Parties will cooperate with the CMC in performing any reporting, election, and
rights predetermination to the Agency regarding intellectual property as
required by the funding agreement and to provide the required information to the
CMC before such information is required by the Funding Agreement.
(l) All Parties agree to respect the Intellectual Property rights of all
other Parties. During the term of the Agreement, no Party may attempt to
reverse engineer, analyze, recreate, or duplicate the specific technology
developed by another Party as a result of this Collaboration Agreement. Such
efforts may result in termination of membership in the Consortium, forfeiture of
all funds assigned to the milestones to be performed by the offending Party, and
any legal action deemed appropriate.
(m) Notwithstanding the above limitations in this paragraph 8, a basic
intent for the formation of this consortium is to share information freely or by
license to the maximum extent possible without disclosing or otherwise
compromising another Parties proprietary data. This is necessary to assure the
formation of a viable market for the advanced plastic packaging technology.
9. (a) National Semiconductor Corporation will receive funds from the funding
Agency and disperse such funds available to the Consortium as specified in the
attached Consortium Funding Agreement or as directed by the CMC. Milestone
payments will be distributed within fifteen (15) working days after receipt of a
document certifying completion of the milestone, providing funds have been made
available by ARPA.
(b) The funding agreement for the Project Statement may provide for
certain rights of the Government to audit the financial records of the
Consortium. Each Party agrees that it will reasonably cooperate with a
Government audit of the Consortium and a Government audit of their individual
financial records related directly to the costs incurred during the performance
of the ARPA Agreement in accordance with Generally Accepted Accounting
Principles (GAAP) only. No Federal Acquisition Regulations or Cost
9
Accounting Standards apply to the accounting and financial records and systems
of the members.
10. (a) The Consortium Administrator will set up a document repository
(Consortium Data Repository), wherein all pertinent documents and data generated
by the Consortium and its Members will be archived. All Parties agree to
provide to the Consortium Administrator copies of pertinent documentation,
drawings, photographs and data. Data will be maintained for a period of up to
five (5) years after completion or termination of these Articles. Such data
shall not include proprietary information previously developed at prior expense
by any Party prior to entering into this Agreement.
(b) A copy of all patent abstracts resulting from Consortium Intellectual
Property will be provided to the Consortium Administrator within 30 days after
filing.
(c) All press releases, publicity, technical papers and other such data
shall be provided to the Consortium Administrator for archiving in the
Consortium Data Repository within 30 days of submittal for publication.
11. (a) THE PARTIES DISCLAIM ANY WARRANTY INCLUDING WITHOUT LIMITATION AN
IMPLIED WARRANTY FOR MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, TO
EACH OTHER, TO ANY AGENCY, AND TO THIRD PARTIES FOR ACTIONS, OMISSIONS,
PRODUCTS, NONCONFORMITIES, DEFECTS, LIABILITIES, OR INFRINGEMENT ARISING OUT OF
THE CONSORTIUM. THE PARTIES DISCLAIM ANY LIABILITY FOR CONSEQUENTIAL, INDIRECT,
OR SPECIAL DAMAGES. IN NO EVENT SHALL A PARTY'S LIABILITY UNDER THIS
AGREEMENT EXCEED THE FUNDING IT HAS RECEIVED UP TO THE TIME OF INCURRING SUCH
LIABILITY.
(b) The Parties are bound to each other and to the Agency entering into
this agreement with the Consortium by a duty of only good faith and best
reasonable research effort in achieving the goals of the Consortium. Joint and
several liability will not attach to the Parties of the Consortium so that no
Party is responsible for the actions of another Party, but is responsible only
for those tasks specified to it and to which it agrees to perform in the
separately executed ARPA funding agreement. Any Party may waive any right,
breach or default which such Party has the right to waive, provided that such
waiver shall not be effective against the waiving Party unless it is in writing,
is signed by such Party, and specifically refers to this Agreement. No waiver
of any breach of any agreement or provision herein contained shall be deemed a
waiver of any preceding or succeeding breach thereof nor of any other agreement
or provision herein contained.
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12. No Party has the obligation to nor will it disclose to another Party
proprietary information not required for the research purposes in the Program,
and specifically will not exchange with another Party in connection with this
Agreement any market data or plans for other services or market products or any
information relating to procurement of plastic encapsulated microcircuits,
except as such information is made publicly available.
13. (a) These Articles are not intended to form, nor shall they be construed
to form, by implication or otherwise, a partnership or other formal business
organization, nor should they be construed as a contract or a grant as defined
for purposes of federal procurement law. No Party can be bound by another Party
acting as its agent except as specifically stated in this Agreement.
(b) No Party shall be obligated to provide any capital contribution, loan,
guarantee, or other financing commitment for the benefit of the Consortium,
unless required for such Party's portion of the Project Statement or such Party
agrees in writing herein or otherwise.
14. Except and to the extent as specifically set forth herein, nothing in
these Articles shall be construed by implication, estoppel or otherwise to grant
any license or right under any patent, copyright, trade secret, trademark or
proprietary right of any Party.
15. This Agreement does not bar the Parties from singly or jointly planning,
designing, or entering manufacturing, subject to the rights of all Parties,
outside the Consortium.
16. No Party shall identify any other Party and its association with this
Consortium in advertising, publicity, or otherwise, except with the formal
written approval of such other Party. However, the Parties agree that
notification of the establishment of this Joint Research and Development Venture
shall be filed by National Semiconductor Corporation on behalf of the Parties
with the Attorney General and the Federal Trade Commission in accordance with
the provisions of the National Cooperative Research Act of 1984 within 90 days
of execution of this Agreement and after adequate review by the legal
departments of all Parties.
17. (a) These Articles and the Consortium shall continue after execution of
this agreement for 24 months thereafter or earlier under any provision of sub-
section (b) hereof. It may be renewed at any time prior to the expiration of
the term of this Agreement by letter agreement signed by the authorized
representatives of all the Parties who are Parties at that time.
(b) This Agreement shall terminate upon the earliest
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occurrence of: (i) disapproval by the Attorney General or the Federal Trade
Commission of the notification of Section (1 5); (ii) termination of the funding
of the first Project Statement by an Agency unless each Party has agreed to
extend the Consortium for subsequent funding; or (iii) no funding is provided by
an Agency by March 31, 1995.
(c) The obligations of confidentiality set forth in Article 8 hereof shall
survive termination of these Articles for a period of 36 months.
18. The Funding Agreement from an Agency may impose certain requirements upon
the Consortium or its Participants-regarding reporting accounting civil rights,
intellectual property, and technology transfer information or transferring of
intellectual property generated with funds provided by the Agency. A
Participant by acceptance of such funds agrees to conform to such requirements
and to reasonably cooperate with the Consortium in conforming to such
requirements.
19. Any notices or other communications required or permitted hereunder shall
be sufficiently given if sent by telecopier or by registered or certified mail,
postage prepaid, addressed as follows
Primary Alternate
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▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇▇ ▇. Nethro
Amoco Chemical Company Amoco Chemical Company
Mail Code E2F Mail Code 4406
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▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇
Leading Technologies, Inc. Leading Technologies, Inc.
P.0. ▇▇▇ ▇▇▇ ▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇.
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Delco Electronics Corporation Delco Electronics Corporation
▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇▇▇ One Corporate Center
Mail Station ▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇ ▇▇ ▇▇▇
▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇ ▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇ ▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇
Dexter Electronic Materials Dexter Electronic Materials
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21 ▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇ 21 ▇ ▇▇▇▇▇▇▇▇ ▇▇.
▇▇▇▇▇, ▇▇ ▇▇▇▇▇ ▇▇▇▇▇, ▇.▇.
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇▇▇ ▇. ▇▇▇▇▇ ▇▇▇▇▇ ▇▇▇▇▇▇
Sandia National Laboratories Sandia National Laboratories
Dept. 1333 Dept. 1333
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▇▇▇▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇ Albuquerque, N.M. 87185-1082
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇▇▇▇. ▇. ▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇
IPAC IPAC
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(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇
National Semiconductor Corporation National Semiconductor Corporation
M/S 19-100 M/S 10-225
2900 Semiconductor Drive ▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇
▇▇▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇ ▇▇▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇
▇▇▇▇ Corporation ▇▇▇▇ Corporation
Metals Research Laboratory Metals Research Laboratory
▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇ ▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇
▇▇▇ ▇▇▇▇▇, ▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇ ▇▇▇ ▇▇▇▇▇, ▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇
(▇▇▇) ▇▇▇-▇▇▇▇ (203) 495-8550 ext. 5719
▇▇▇▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇
▇▇▇▇▇▇▇ Electronic Materials, Inc. ▇▇▇▇▇▇▇ Electronic Materials, Inc.
Rohm and ▇▇▇▇ Company Rohm and ▇▇▇▇ Company
▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇ ▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇
▇. ▇. ▇▇▇ ▇▇▇ P. O. ▇▇▇ ▇▇▇
▇▇▇▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇
▇▇▇▇▇▇▇ ▇▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇▇
▇▇▇▇▇▇▇▇, Inc. ▇▇▇▇▇▇▇▇, Inc.
▇▇▇-▇ ▇. ▇▇▇▇▇▇▇ ▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇
▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇
(▇▇▇) ▇▇▇-▇▇▇▇ (▇▇▇) ▇▇▇-▇▇▇▇ Ext. 280
or such other addresses or telecopier numbers as shall be furnished by like
notice by such party. Any such notice or communication given by mail shall be
deemed to have been given three (3) business
13
days after the date so mailed, and any such notice or communication given by
telecopier shall be deemed to have been given when sent by telecopier and the
appropriate answer back received.
20. Neither this Agreement nor any rights hereunder, in whole or in part,
shall be assignable or otherwise transferable without the prior written consent
of all other Parties, except the Party's wholly owned subsidiaries, its ultimate
parent company, and to any company wholly owned by its parent company. The
above is subject to ARPA approval.
21. (a) These Articles shall first become effective on the date all
Consortium Members have signed these Articles and such Articles will be
effective only as to such Parties who have signed these Articles by such date.
These Articles shall be effective as to any other Party on the date such other
Party executes these Articles.
(b) This Agreement may be executed in counterparts each of which shall be
deemed an original, but taken together shall constitute one and the same
instrument.
22. The Parties Shall further execute, sign or do or procure to be executed,
signed and done all such further deeds and documents and acts as may be
reasonably required to enable the Parties freely and fully to pursue their
agreed objective provided hereunder.
23. These Articles shall be governed by the laws of the United States and the
State of California except principles of conflict of laws.
24. This Agreement constitutes the entire agreement of the Parties and
supersedes all prior and contemporaneous agreements, understandings,
negotiations and discussions among the Parties, whether oral or written, with
respect to the subject matter hereof.
IN WITNESS WHEREOF, each of the parties has caused these Articles to be executed
by its duly authorized representatives, on the respective dates entered below.
14
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME NATIONAL SEMICONDUCTOR CORPORATION
---------------------------------------------------
ADDRESS: ▇▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇▇
-----------------------------------------------------
---------------------------------------------------
------------------------------------------------------
By /s/ ▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇
-----------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇
----------------------------------------------------
(PRINT NAME)
Manager Business Operations
------------------------------------------------------------
(TITLE)
3-2-95
----------------------------------------------------
(DATE OF EXECUTION)
15
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME AMOCO CHEMICAL COMPANY
---------------------------------------------------
ADDRESS: ▇▇▇ ▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇
---------------------------------------------------
▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
--------------------------------------------------
----------------------------------------------------
By /s/ ▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇
----------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇
-----------------------------------------------------
(PRINT NAME)
VICE PRESIDENT
---------------------------------------------------
(TITLE)
March 3, 1995
------------------------------------------------------------
(DATE OF EXECUTION)
16
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME LEADING TECHNOLOGIES, INC.
---------------------------------------------------
ADDRESS: ▇▇ ▇▇▇ ▇▇▇
----------------------------------------------------
▇▇▇▇▇▇▇▇▇ ▇▇ ▇▇▇▇▇
--------------------------------------------------
-----------------------------------------------------
By /s/ ▇▇▇ ▇▇▇▇▇▇▇▇
----------------------------------------------------
(AUTHORIZED SIGNATURE)
Len Kosowksy
---------------------------------------------------
(PRINT NAME)
President
-----------------------------------------------------------
(TITLE)
3-3-95
---------------------------------------------------
(DATE OF EXECUTION)
17
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME DELCO ELECTRONICS CORPORATION
---------------------------------------------------
ADDRESS: ONE CORPORATE CENTER
----------------------------------------------------
▇.▇. ▇▇▇ ▇▇▇▇
--------------------------------------------------
▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
----------------------------------------------------
By /s/ Lesterson ▇▇▇▇▇▇▇▇▇
----------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇ ▇▇▇▇▇▇▇▇▇
---------------------------------------------------
(PRINT NAME)
DIRECTOR, IC DELCO
-----------------------------------------------------------
(TITLE)
March 2, 1995
---------------------------------------------------
(DATE OF EXECUTION)
18
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME DEXTER CORPORATION
------------------------------------------------------
ADDRESS: ▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇▇▇
-------------------------------------------------------
▇▇▇▇▇, ▇▇ ▇▇▇▇▇
--------------------------------------------------
----------------------------------------------------
By /s/ ▇▇▇ ▇. ▇▇▇▇
-----------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇ ▇. ▇▇▇▇
-----------------------------------------------------
(PRINT NAME)
Director of Research & Development
---------------------------------------------------------------
(TITLE)
3-2-95
-----------------------------------------------------
(DATE OF EXECUTION)
19
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME IPAC
---------------------------------------------------
ADDRESS: ---------------------------------------------------
--------------------------------------------------
----------------------------------------------------
/s/ ▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇▇▇▇
By ---------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇▇▇▇
--------------------------------------------------
(PRINT NAME)
President CEO
-----------------------------------------------------------
(TITLE)
3-1-95
--------------------------------------------------
(DATE OF EXECUTION)
20
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME ▇▇▇▇ CORPORATION
---------------------------------------------------
ADDRESS: ▇▇ ▇▇▇▇▇▇▇ ▇▇▇▇▇▇
----------------------------------------------------
▇▇▇ ▇▇▇▇▇, ▇▇ ▇▇▇▇▇
--------------------------------------------------
----------------------------------------------------
By /s/ ▇▇▇▇▇ ▇. ▇▇▇▇▇
----------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇ ▇. ▇▇▇▇▇
---------------------------------------------------
(PRINT NAME)
Vice President, Metals Research Lab
------------------------------------------------------------
(TITLE)
March 17, 1995
---------------------------------------------------
(DATE OF EXECUTION)
21
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME ▇▇▇▇▇▇▇ ELECTRONIC MATERIALS, INC.
---------------------------------------------------
ADDRESS: ▇▇▇ ▇▇▇▇▇▇▇▇▇▇▇▇ ▇▇▇▇ ▇▇▇▇
----------------------------------------------------
▇▇▇▇▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇-▇▇▇▇
--------------------------------------------------
---------------------------------------------------
By /s/ ▇▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇, ▇▇.
---------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇▇, ▇▇.
---------------------------------------------------
(PRINT NAME)
PRESIDENT
----------------------------------------------------------
(TITLE)
March 2, 1995
---------------------------------------------------
(DATE OF EXECUTION)
22
PLASTIC PACKAGING CONSORTIUM
ARTICLES OF COLLABORATION
CONSORTIUM MEMBER
COMPANY NAME SHELDAHL, INC.
---------------------------------------------------
ADDRESS: ▇▇▇▇ ▇▇▇▇▇▇▇▇ ▇▇▇▇
----------------------------------------------------
▇▇▇▇▇▇▇▇▇▇, ▇▇ ▇▇▇▇▇
-------------------------------------------------
---------------------------------------------------
By /s/ ▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇
---------------------------------------------------
(AUTHORIZED SIGNATURE)
▇▇▇▇▇▇▇ ▇. ▇▇▇▇▇▇
--------------------------------------------------
(PRINT NAME)
Senior Vice President, Technology
---------------------------------------------------------
(TITLE)
March 1, 1995
--------------------------------------------------
(DATE OF EXECUTION)
23
Agreement Number: MDA972-95-3-0024
Attachment No. 4
Page 1
SCHEDULE OF PAYMENTS AND PAYABLE MILESTONES
A. SCHEDULE OF PAYMENTS
--------------------
QUARTER ARPA PAYMENT CONSORTIUM PAYMENT
------- ------------ ------------------
FIRST $ 375,000 $ 247,060
SECOND $1,185,731 $1,155,376
THIRD $1,249,658 $1,349,183
FOURTH $1,638,158 $1,835,444
FIFTH $1,530,039 $1,595,914
SIXTH $1,242,326 $1,274,449
SEVENTH $1,038,986 $ 989,138
EIGHTH $ 827,022 $ 733,143
NINTH $ 463,024 $ 486,951
TOTAL $9,549,944 $9,666,658
B. DETAILED SCHEDULE OF PAYABLE MILESTONES
---------------------------------------
ARPA
TASK MONTH PAYABLE MILESTONES PAYMENT CONSORTIUM PAYMENT
---- ----- ------------------ ------- ------------------
1 FEB '95 DELIVER INITIAL PROGRAM PLAN $ 375,000 $ 247,060
. Deliver initial program plan.
2 APR '95 INITIAL PRODUCT DESIGN REVIEW $1,185,731 $1,155,376
. Specify critical initial design
considerations for Interposer an flip-chip
vehicles in Focus Area 3 (SOW 3.2.4)
. Evaluate leadframe to molding compound
interfacial adhesion for first sample of
enhanced treated leadframes for Focus Area 1.
(SOW 1.3.3)
3 JULY '95 DELIVER SAMPLES OF FUNDAMENTAL $1,249,657 $1,349,183
COMPONENTS
. The consortium will demonstrate capability
to produce new blend resin to be utilized in
enhanced molding compound formulation. (SOW 1.3.1)
. Complete design and manufacture samples
of test vehicle interposer for 160-lead PQFP.
(SOW 3.2.4)
4 OCT '95 EPOXY MOLDING COMPOUND $1,638,158 $1,835,444
. Demonstrate mechanical and manufacturability
properties of screening level molding
compounds such as curing kinetics, rheology, Tg,
coefficient thermal expansion. (SOW 1.3.1,
2.3.1 & 3.3.1)
24
ATTACHMENT 1
25
Agreement Number: MDA972-95-3-0024
Attachment No. 4
Page 2
================================================================================================
ARPA CONSORTIUM
TASK MONTH PAYABLE MILESTONES PAYMENT PAYMENT
------------------------------------------------------------------------------------------------
5 JAN '96 MANUFACTURE EXPOXY MOLDING COMPOUNDS TO TEST $1,530,039 $1,595,914
VEHICLES SPECIFICATIONS
. Demonstrate successful assembly of high lead
count (160-lead and 304 or 204-lead) PQFP
packages.
(SOW 3.1)
. The Consortium will evaluate and characterize
the mechanical connection of the interposer to
the leadframe for 160-lead PFP. (SOW 3.2.5)
------------------------------------------------------------------------------------------------
6 APR '96 VALIDATION OF METALLIC PROPERTIES $1,242,326 $1,274,449
. Complete characterization of the leadframe
alloy designed for higher strength to give
improved stamping and handling characteristics.
(SOW 1.3.3)
. Demonstrate capability of producing stamped
heat sinks for enhanced thermal dissipation.
(SOW 2.3.3)
------------------------------------------------------------------------------------------------
7 JULY COMPLETE DEVELOPMENT OF FUNDAMENTAL MATERIALS $1,038,986 $ 989,138
'96 AND VERIFY VOLUME PRODUCTION CAPABILITIES
. The Consortium will complete development of
optimized molding compound formulations for
all focus areas.
(SOW 1.3.1, 2.3.1, & 3.2.1)
. Demonstrate on-shore volume production
capability of high lead count PQFPs. (SOW 3.1)
. Complete characterization of flip chip underfill
mechanical and manufacturability properties.
(SOW 3.2.2)
------------------------------------------------------------------------------------------------
8 OCT '96 SELECTION OF OPTIMIZED MATERIAL COMBINATIONS $ 827,022 $ 733,143
AND TEST VEHICLE ASSEMBLY
. Select optimized material combinations (molding
compound die attach material, leadframe
treatment, leadframe alloy, substrate/interposer
materials, etc.) Use this set of final optimized
materials for technology demonstration product
builds in all focus areas. (SOW 1.3.5, 2.3.5, &
3.2.6)
. Issue final mechanical and manufacturability
report for epoxy molding compounds for all
focus areas.
(SOW 1.3.1, 2.3.1, & 3.2.1)
------------------------------------------------------------------------------------------------
9 JAN '97 FINAL REPORT $ 463,024 $ 486,951
. Issue final report illustrating the capabilities
achieved vs. the initial targets of the program.
------------------------------------------------------------------------------------------------
TOTAL $9,549,944 $9,666,658
================================================================================================
26
Agreement Number: MDA972-95-3-0024
Attachment No. 4
Page 3
FUNDING SCHEDULE
A. PROJECTED PROGRAM FUNDING COMMITMENTS
-------------------------------------
YEAR ARPA FUNDING CONSORTIUM CONTRIBUTION
---- ------------ -----------------------
CY '95 $4,448,546 $4,587,063
CY '96 $4,638,373 $4,592,644
CY '97 $ 463,024 $ 486,951
---------- ----------
TOTALS $9,549,943 $9,666,658
B. CONSORTIUM MEMBER CONTRIBUTIONS
-------------------------------
MEMBER CONTRIBUTION
------ ------------
Amoco Chemical Company $ 411,348
Delco Electronics $ 340,616
The Dexter Corporation $ 482,000
Integrated Packaging Assembly Corp. $1,051,800
Leading Technologies, Inc. 3,059,601
National Semiconductor Corp. 2,442,675
▇▇▇▇ Corporation $ 901,225
▇▇▇▇▇▇▇ Electronic Materials, Inc. $ 484,800
▇▇▇▇▇▇▇▇ $ 492,593
----------
TOTAL $9,666,658
27
Plastic Packaging Statement of Work
-----------------------------------
The Plastic Packaging Program will establish the required infrastructure
and enabling technologies in three key Focus Areas. Benefits gained from these
interdependent, and yet individual areas, are sufficiently broad-based to be
widely applicable to the entire packaging industry. The three key Focus Areas
are:
1. Plastic Package Ruggedization
2. Plastic Package Thermal Dissipation
3. High Density Plastic Packaging
These interrelated Focus Areas offer synergistic solutions for cost-
effective, high volume packaging with improved reliability and performance.
1.0 Plastic Package Ruggedization - (Focus Area 1)
This area will develop enabling technologies to reduce cost and enhance the
reliability of plastic packages during assembly and field operation.
Reliability issues applicable to plastic ICs include interfacial delamination,
package cracking ("popcorning"), and stress induced failures.
1.1 Description of Problem
Die interfacial delamination occurs due to excessive shear strength
breaking the interfacial bond between the die or die coating and the molding
compound. Factors governing delamination include, the net thermal displacement
during thermal excursion, the gap between the epoxy and the device surface after
separation, the topography of the device and the adhesion strength of the
molding compound. The resultant effect of these factors can be device failure.
Package cracking, or popcorning, occurs during assembly operations. In
this case the hygroscopic molding compound absorbs moisture when exposed to
typical manufacturing conditions. If moisture has accumulated past a package-
dependent critical concentration, the solder reflow conditions (230-260 deg C)
cause water to vaporize. Pressure builds up inside the package and eventually,
steam is released along the path of least resistance causing cracking of the
compound. To avoid popcorning today, Packages are baked and then shipped in
drybags which is very costly.
Stress-induced failures are equally damaging to devices. The thermal
mismatch between silicon and the materials inside the package causes stresses
and induces defects ranging form cosmetic passivation cracking to metal line
shift, dielectric cracking, and even die fracture.
"Ruggedization" of the packages will enhance the package reliability during
board assembly and adverse field conditions. In turn, mean-time-to-failure will
increase the cost effectiveness of packaging. The enabling technologies
proposed in this Focus Area will address these major reliability issues plaguing
plastic packaging.
1.2 Key Metrics
The key metrics for success for Focus Area 1 are:
* No interfacial delamination (e.g., between molding compound and die
surface, molding compound and leadframe, and, die attach (d/a) and
leadframe).
* Unlimited shelf life at 30 deg. C/90% RH without drybagging.
("Anti-popcorning")
* No stress-induced device failures (e.g., metal line shift, passivation
cracking, dielectric cracking; and die cracking).
* Team cost target improvement over SIA roadmap is 50% to a cost of
$0.005/lead up to 300-lead PQFP.
1.3 Technical Approach
To achieve these four metrics, five major components will be addressed:
1. Molding Compound Enhancement
2. Die Attach Enhancement
3. Leadframe Enhancement
4. Reliability Characterization
5. Technology Demonstration
1.3.1 Molding Compound Enhancement
New resin formulations and additives will be developed to provide properties for
enhanced reliability. The metric improvements listed use the current low-stress
molding compounds as benchmark.
* Reduce water uptake by 50% for improved leadframe adhesion and better
anti-popcorning
* Increase the hot strength at 240 deg C by a factor of 2.
* Lower the stress index by at least 25%
* Increase the Tg of the anti-popcorning compound from ▇▇▇ ▇▇▇ ▇ ▇▇
▇▇▇ ▇▇▇
▇▇
* Decrease the cure time by 25%
* Lower compound viscosity by 25%
1.3.2 Die Attach Enhancement
----------------------
Using the epoxy-based die attach material as a benchmark, development of die
attach formulations will aim at:
* Eliminating voiding in the die attach
* Increase the adhesion strength between the molding compound and the
die attach surface by 50% at 240 deg C
* Decrease cure time by 50% at 160 deg C
* Reduce water uptake by 50% for improved leadframe adhesion and better
anti-popcorning
* Develop new cyanate ester-based materials with:
** Hot strength superior to epoxies at 260 deg C by 50%
** Stress index lower by at least 25%.
** Unique stable moisture-resistant properties
1.3.3 Leadframe Enhancement
Key reliability issues affecting the interface between leadframe, the molding
compound, and the die attach are:
* Increase the interfacial adhesion to the molding compound and the die
attach media.
* Optimize or replace the polyamide tape on the leadframe to improve
adhesion.
* Develop and characterize a new leadframe alloy with higher strength
for fine pitch stamping and in-process handling
1.3.4 Reliability Characterization
The test methodology, processing, and material properties of key materials of
construction in IC packaging will be fully characterized:
* Materials screening - Various combinations of materials will be
evaluated through design of experiments. This will include evaluating
the different choices for synergistic interaction
* Evaluate adhesion and stress characteristics of die coatings
* Characterize mold compounds. Include manufacturability assessment
(e.g. curing kinetics, rheology, moldability) and mechanical
characteristics (coefficient of thermal expansion, modulus, fracture
strength, adhesion).
* Obtain Assembly Test Chips (ATCs) for use in the evaluation of package
properties.
* Reliability testing of the test ICs and product vehicles will be
performed.
1.3.5 Technology Demonstration
The enabling technologies for ruggedizing the packages will be validated with
commercial product vehicles. Reliability tests will follow mil-approved
standards. Products could include but will not be limited to National's Super
I/O and CLAy chips.
2.0 Plastic Package Thermal Dissipation (Focus Area 2)
The objective of this Focus Area is to develop enabling technologies which will
enhance the thermal dissipation characteristics of the plastic packages.
2.1 Description of Problem
Devices are operating at increasingly faster speeds and frequencies, and
generating more heat. Thus, to keep up with the speed performance curve,
improved thermal dissipation becomes a necessity. The typical thermal path
available for plastic packages mounted on boards is through the molding
compound, along the leadframe, and to the metal traces on the board. This path
can be enhanced with the use of heat spreaders imbedded into the package and
with improved thermal characteristics of the materials.
2.2 Key Metrics
The key metrics for success for Focus Area 2 are:
* High temperature operation (175 deg C)
* High thermal dissipation (Theta-ja improvement by 50% on 160 PQFP to
20 deg. C/Watt)
* High Temperature Reliability
* Fine Pitch stamped leadframes with heat spreaders or heat slugs
* Cost target for the thermally enhanced package is $0.02/lead over the
standard package of $0.007/lead
2.3 Technical Approach
To achieve these metrics, five major components will be addressed:
1. Molding Compound Thermal Enhancement
2. Die Attach Thermal Enhancement
3. Leadframe/Heat Sink Enhancement
4. Reliability Characterization
5. Technology Demonstration
29
2.3.1 Molding Compound Enhancement
The molding compound must satisfy two functional requirements, high thermal
dissipation and high thermal performance. The goals are to:
* Increase thermal conductivity from the current 0.4-0.5 W/m K
* Evaluate new resin materials and fillers for enhanced thermal
dissipation and thermal performance.
* Promote good interfacial adhesion to all components, including heat
spreaders and heat slugs
2.3.2 Die Attach Thermal Enhancement
The die attach material is a thermal barrier between the die and the leadframe.
Poor thermal conductivity is usually due to either voiding or inadequate die
attach material. The d/a must satisfy two functional requirements, good thermal
conductivity and no voiding. Development work will focus on:
* Increase thermal dissipation of the die attach by at least 25%
* Eliminate voiding in the die attach for good thermal conductivity
2.3.3 Leadframe/Heat Sink Enhancement
The low-cost requirement of plastic packages dictates that any thermal
enhancement structure attached to either the leadframe of the package must not
add significantly to the total package cost. Development work will focus on:
* Design and model the attachment of heat slugs to the package
* Design and build automated equipment to tape, downset and attach the
heat spreader to the leadframe
* High thermal conductivity material leadframes will be developed and
evaluated
2.3.4 Reliability Characterization
Materials screening and characterization similar to section 1.3.4 on
ruggedization must be performed:
* Characterize thermally enhanced molding compounds and die attach
materials
* Develop thermal test chips for use in screening materials
* Assembly of 160 PQFP will be done by IPAC and National
* Reliability testing of test vehicles and product drivers will be
performed
2.3.5 Technology Demonstration
The enabling technologies for thermally enhanced packages will be validated with
commercial product vehicles. Reliability tests will follow mil-approved
standards. Two products will be selected based on market needs.
3.0 High Density Packaging (Focus Area 3)
This Focus Area aims at developing the enabling technologies to increase the I/O
density of plastic packages. Two packaging form factors will be considered, the
PQFP and the Plastic Ball Grid Array packages (PBGA). Efforts in this area can
be broken up into 3 interrelated areas:
1. Develop fine pitch leadframe stamping technology
2. Develop fine pitch PQFP with interposer attached
3. Develop a 625-pin Plastic BGA for use with flip chip
Efforts will aim at developing fine pitch stamped leadframe for high lead count
PQFPs, evaluating high density interposer substrates for PQFPs, attaching
interposers to the PQFP leadframes, and devising high density, low-cost
substrates for PBGAs. We will be evaluating different molding compounds for the
two package types but there is a common development effort on the high density
substrates. We expect that the commercial cross over point from QFP to BGA from
a cost and handling standpoint is at about 300 pins. Specific packages
addressed in this program are 160 to 304 or 240-lead QFP and the 625-pin BGA
with flip chip. The flip-chip BGA portion of this focus area will augment the
work in the Low Cost Flip Chip Program in that both programs will lead up to the
development of the 4 ▇▇▇▇ ▇▇▇▇ product assembled in the plastic BGA package.
3.1 Key Metrics
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The key metrics for success for Focus Area 3 are:
* Fine pitch, stamped, low-cost leadframes. Two packages are addressed:
1. 160-lead QFP with 6.0 mil internal pitch and 4.0 mil lead flat
2. 304 or 240-lead QFP with 7.0 mil internal pitch and 4.0 mil lead
flat
* Establish on-shore capability for high lead count package assembly.
(160 and 240 or 304-lead QFP and 625 BGA)
* High density and low-cost substrates
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** Interposer cost adder $0.10 for 160-lead PQFP
** Substrate cost $0.40/sq in.
* Minimal or zero-warpage of BGA
* Reworkable, low stress underfill for flip chip in Plastic BGA.
* Integration of interposer to leadframe
3.2 Technical Approach
To achieve the previous key metrics, the following major components will be
addressed:
1. Molding Compound for BGAs
2. Flip Chip Underfill Development
3. Leadframe Enhancement
4. Substrate/Interposer Enhancement
5. Reliability Characterization
6. Technology Demonstration
3.2.1 Molding Compound for BGAs
Molding compounds formulated for large chips in high lead count PQFPs and BGAs
need to have enhanced properties. Efforts will focus on:
* Lower stress by 50%
* Lower molding viscosity for molding thing packages
* Higher Tg and lower shrinkage by 50%
* Reduce moisture absorption by 50%
* No delamination
* Prolonged pot life
3.2.2 Flip-Chip Underfill Development
In this program we will focus on development of an underfill to be used with
flip-chips mounted on substrates in plastic GBA packages. Underfill of lip-chip
structures can significantly increase solder joint life. The improvement level
depends on the substrate material since thermal mismatch dictates the stress
level on the joints. Key development efforts aim at high Tg ( 160 deg C)
resins with:
* Improved wetting characteristics
* Narrower filler size distribution for small chip gaps
* Faster cure by at least 50%
* Better adhesion to polyamide or other substrates and substrate
coatings
* Lower stress by at least 25%
* Longer potlife for ease of processing
* Higher thermal conductivity than current underfill resins by 50%
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* Reworkability capability
3.2.3 Leadframe Enhancement
Fine pitch leadframes are currently manufactured by expensive etch techniques.
Stamping of higher lead count fine pitch leadframes will require looking at
different materials. Key development tasks required are:
* Develop a process for stress reduction in C7025 alloy prior and after
tamping
* Evaluate high strength materials form punches
* Design and fabricate tooling for stamping two leadframes
** 160-lead PQFP with a 6.0 mil internal pitch and 4.0 mil lead flat
** 304-lead PQFP with a 7.0 mil internal pitch and a 4.0 mil lead
flat or 240 lead PQFP
3.2.4 Substrate/Interposer Enhancement
Two types of packages are considered for this area, 160-lead PQFP and 625-pin
BGA. The PQFP requires an interposer to be bonded to the leadframe while the
BGA involves flip-chip mounting. Development tasks will include:
* Develop a 160-lead PQFP interposer based on NSC Super I/O chip family
* Develop the methodology and process for attaching the interposer to
the leadframe by thermocompression bonding and by conductive adhesives
* Develop a 625-pin BGA substrate based on test chips and CLAy.
3.2.5 Reliability Characterization
Once again, Tasks similar to the previous two area will be performed. Tasks
specific to high density package will include:
* Characterize the interposer mounting technology
* Provide redistributed and bumped test chips for flip-chip bonding
* Evaluate the effectiveness of the reworkable underfill resin
* Assembly of 160-lead PQFP and 625 BGA will be handled by IPAC and
National
* Reliability testing of the test vehicles and product drivers will be
performed
3.2.6 Technology Demonstration
The enabling technologies for stamped fine pitch leadframes, interposer
integration to the leadframe, and high density low-cost substrates will be
validated with product vehicles. The final vehicles will be selected from the
Super I/O, LAN and CLAy product families from National Semiconductor.
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