Loan Agreement Date: December 16, 2024Loan Agreement • March 14th, 2025 • MAGNACHIP SEMICONDUCTOR Corp • Semiconductors & related devices
Contract Type FiledMarch 14th, 2025 Company IndustryThe Bank shall explain the important contents of this loan agreement (the “Agreement”) to the parties involved in the Agreement and deliver all contract documents, including the Bank’s General Terms and Conditions for Credit Transactions (for corporations), a copy of this Agreement, and the corporate loan product description.
s/ signatures of the bank’s team member, team manager and deputy general manager of KDB Loan Agreement Date: March 26, 2024Loan Agreement • May 10th, 2024 • MAGNACHIP SEMICONDUCTOR Corp • Semiconductors & related devices
Contract Type FiledMay 10th, 2024 Company IndustryThe Bank shall explain the important contents of this loan agreement (the “Agreement”) to the parties involved in the Agreement and deliver all contract documents, including the Bank’s General Terms and Conditions for Credit Transactions (for corporations), a copy of this Agreement, and the corporate loan product description.