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2 similar Credit Agreement contracts by TTM Technologies Inc

CREDIT AGREEMENT DATED 16 NOVEMBER 2009 AS AMENDED AND RESTATED ON 30 MARCH 2010 US$582,500,000 CREDIT FACILITY FOR THE COMPANIES LISTED IN SCHEDULE 1 HEREIN as Borrowers COORDINATED BY THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED WITH THE...
Credit Agreement • August 5th, 2010 • TTM Technologies Inc • Printed circuit boards • Hong Kong
  • Contract Type
    Credit Agreement
  • Filed
    August 5th, 2010
  • Company
    TTM Technologies Inc
  • Industry
    Printed circuit boards
  • Jurisdiction
    Hong Kong
CREDIT AGREEMENT DATED 16 NOVEMBER 2009 US$582,500,000 CREDIT FACILITY FOR THE COMPANIES LISTED IN SCHEDULE 1 HEREIN as Borrowers COORDINATED BY THE HONGKONG AND SHANGHAI BANKING CORPORATION LIMITED WITH THE HONGKONG AND SHANGHAI BANKING CORPORATION...
Credit Agreement • April 13th, 2010 • TTM Technologies Inc • Printed circuit boards • Hong Kong
  • Contract Type
    Credit Agreement
  • Filed
    April 13th, 2010
  • Company
    TTM Technologies Inc
  • Industry
    Printed circuit boards
  • Jurisdiction
    Hong Kong
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