HI-AM Conference Author AgreementHi-Am Conference Author Agreement • March 27th, 2025
This Agreement is entered into by and between the Holistic Innovation in Additive Manufacturing (HI-AM) Conference (hereinafter referred to as the “Conference”) and the authors of the manuscript (hereinafter referred to as the “Authors”), as represented by the individual submitting the manuscript on their behalf, whether or not that individual is an Author (hereinafter referred to as the “Submitter”).