0000950123-11-062164 Sample Contracts
SHARE SUBSCRIPTION AGREEMENTShare Subscription Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
SHARE SUBSCRIPTION AGREEMENT (the “Agreement”), dated as of 18 April, 2011, by and among Semiconductor Manufacturing International Corporation (the “Company”), and Country Hill Limited (the “Investor”).
Hubei Science & Technology Investment Group Co., Ltd. And Semiconductor Manufacturing International Corporation The Joint Venture Agreement regarding establishing Semiconductor Manufacturing International (Wuhan) Corporation May 2011 (English Translation)Joint Venture Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices
Dated 16 August 2010 SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and DATANG TELECOM TECHNOLOGY & INDUSTRY HOLDINGS CO., LTD. Subscription Agreement relating to 1,528,038,461 shares of Semiconductor Manufacturing International Corporation...Subscription Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong
Dated 8 July 2010 (1) SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORPORATION and (2) J.P. MORGAN SECURITIES (ASIA PACIFIC) LIMITED and (3) THE ROYAL BANK OF SCOTLAND N.V., HONG KONG BRANCH PLACING AGREEMENT relating to Shares in the share capital of...Placing Agreement • June 28th, 2011 • Semiconductor Manufacturing International Corp • Semiconductors & related devices • Hong Kong