Qualification Process. The Parties shall mutually verify the applicable Company Process as implemented at the designated Facilities for all Contract Wafers, and further agree upon the parametric, electrical, process flow, quality, and reliability specifications, as well as other standards or requirements that may be necessary for manufacturing the Contract Wafers as provided in an addendum to the applicable Product Supplements (the “Quality and Reliability Specifications”). Thereafter, Company and Foundry will in good faith execute the qualification plan for such Contract Wafers as set forth in applicable Product Supplement.
Appears in 3 contracts
Sources: Master Semiconductor Foundry and Technology Transfer Agreement, Master Semiconductor Foundry and Technology Transfer Agreement (Spansion Inc.), Master Semiconductor Foundry and Technology Transfer Agreement (Spansion Inc.)