Sampling Plan. 3.1 Oxide thickness (section 4.1) should be measured on 20% of the lot to verify it is within spec. 3.2 The Gross Visual Inspection (section 4.2) should be done on all of the wafers in the lot. 3.3 The Fine Visual Inspection (section 4.3) should be done on 20% of the wafers in the lot. 3.3.1 Inspect five (5) spots per wafer, five (5) die per spot. (see Figure 1) 3.3.2 Accept/Reject Criteria If one or more die in a spot is rejected, then the spot is rejected. If 3 or more spots are rejected, then the wafer is rejected. If the total number of spots rejected exceeds the number of wafers inspected, the lot is rejected.
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Sources: Corporate Agreement (FSC Semiconductor Corp), Corporate Agreement (FSC Semiconductor Corp)